JPH0288258U - - Google Patents
Info
- Publication number
- JPH0288258U JPH0288258U JP1988166725U JP16672588U JPH0288258U JP H0288258 U JPH0288258 U JP H0288258U JP 1988166725 U JP1988166725 U JP 1988166725U JP 16672588 U JP16672588 U JP 16672588U JP H0288258 U JPH0288258 U JP H0288258U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- light
- semiconductor device
- optically coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第1図は本考案実施例における光結合半導体装
置の内部透視斜視図、第2図は従来の光結合半導
体装置の内部透視斜視図である。
1……中継アイランド、2,3……ボンデイン
グワイヤ、10……本体、14……発光ダイオー
ド、20……受光素子。
FIG. 1 is an internal perspective view of an optically coupled semiconductor device according to an embodiment of the present invention, and FIG. 2 is an internal transparent perspective view of a conventional optically coupled semiconductor device. 1... Relay island, 2, 3... Bonding wire, 10... Main body, 14... Light emitting diode, 20... Light receiving element.
Claims (1)
、この発光ダイオードの光を受光して電気信号を
出力する受光素子を備えた光結合半導体装置であ
つて、上記発光ダイオードの接続を外部に突出す
る端子から独立したアイランドを介して中継する
ことを特徴とした光結合半導体装置。 An optically coupled semiconductor device comprising a light emitting diode that emits light by inputting an electrical signal, and a light receiving element that receives light from the light emitting diode and outputs an electrical signal, the terminal projecting the connection of the light emitting diode to the outside. An optically coupled semiconductor device characterized by relaying via an island independent from the .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988166725U JPH085571Y2 (en) | 1988-12-24 | 1988-12-24 | Optically coupled semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988166725U JPH085571Y2 (en) | 1988-12-24 | 1988-12-24 | Optically coupled semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0288258U true JPH0288258U (en) | 1990-07-12 |
JPH085571Y2 JPH085571Y2 (en) | 1996-02-14 |
Family
ID=31454364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988166725U Expired - Lifetime JPH085571Y2 (en) | 1988-12-24 | 1988-12-24 | Optically coupled semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH085571Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63170976U (en) * | 1987-04-27 | 1988-11-07 | ||
JPH0245659U (en) * | 1988-09-22 | 1990-03-29 |
-
1988
- 1988-12-24 JP JP1988166725U patent/JPH085571Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63170976U (en) * | 1987-04-27 | 1988-11-07 | ||
JPH0245659U (en) * | 1988-09-22 | 1990-03-29 |
Also Published As
Publication number | Publication date |
---|---|
JPH085571Y2 (en) | 1996-02-14 |