JPH0487664U - - Google Patents
Info
- Publication number
- JPH0487664U JPH0487664U JP13070690U JP13070690U JPH0487664U JP H0487664 U JPH0487664 U JP H0487664U JP 13070690 U JP13070690 U JP 13070690U JP 13070690 U JP13070690 U JP 13070690U JP H0487664 U JPH0487664 U JP H0487664U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- emitting chips
- coupling device
- optical coupling
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図ａ及びｂはそれぞれ本考案の一実施例に
よる光結合素子の縦断側面図及び横断平面図、第
２図は本考案の一実施例による光結合素子のフレ
ームの平面図、第３図ａ乃至ｃは本考案による外
部接続用リードフレームのボンデイング工程図、
第４図ａ及びｂはそれぞれ、従来例による光結合
素子の縦断側面図及び横断平面図である。
１……発光チツプ、２……受光チツプ、３……
チツプ搭載用リードフレーム、７……外部接続用
リードフレーム。
1A and 1B are a vertical side view and a cross-sectional plan view, respectively, of an optical coupling device according to an embodiment of the present invention, FIG. 2 is a plan view of a frame of an optical coupling device according to an embodiment of the present invention, and FIG. 3 a to c are bonding process diagrams of an external connection lead frame according to the present invention;
FIGS. 4a and 4b are a vertical side view and a cross-sectional plan view, respectively, of a conventional optical coupling device. 1... Light emitting chip, 2... Light receiving chip, 3...
Lead frame for chip mounting, 7...Lead frame for external connection.
Claims (1)
リードフレームと、外部への電気的接続を行なう
外部接続用リードフレームとを有してなる光結合
素子において、 前記外部接続用リードフレームを前記受発光チ
ツプ上にそれぞれ延在して、前記受発光チツプに
接続してなることを特徴とする光結合素子。[Scope of Claim for Utility Model Registration] An optical coupling device comprising a chip mounting lead frame on which receiving and emitting chips are respectively mounted, and an external connection lead frame for electrically connecting to the outside, An optical coupling device characterized in that a lead frame is extended over the light receiving and emitting chips and connected to the light receiving and emitting chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13070690U JPH0487664U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13070690U JPH0487664U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487664U true JPH0487664U (en) | 1992-07-30 |
Family
ID=31878023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13070690U Pending JPH0487664U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487664U (en) |
-
1990
- 1990-11-30 JP JP13070690U patent/JPH0487664U/ja active Pending