JPS63155652U - - Google Patents
Info
- Publication number
- JPS63155652U JPS63155652U JP4670987U JP4670987U JPS63155652U JP S63155652 U JPS63155652 U JP S63155652U JP 4670987 U JP4670987 U JP 4670987U JP 4670987 U JP4670987 U JP 4670987U JP S63155652 U JPS63155652 U JP S63155652U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light emitting
- package
- light receiving
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案の一実施例におけるリードフレ
ームに発光素子を搭載した状態の平面図、第２図
は同一のリードフレームに受光素子を搭載した状
態の平面図、第３図ａ乃至ｄは夫々異なる光結合
装置の等価回路図である。
１……リードフレーム、２……外部リード、２
Ａ，２Ｂ……外部接続部、３……内部リード、３
Ａ，３Ｂ……内部マウント部、４……発光素子、
５……ボンデイング線、６……受光素子、７……
ボンデイング線。
Fig. 1 is a plan view of a light emitting element mounted on a lead frame according to an embodiment of the present invention, Fig. 2 is a plan view of a light receiving element mounted on the same lead frame, and Figs. 3 a to 3 d are FIG. 4 is an equivalent circuit diagram of different optical coupling devices. 1...Lead frame, 2...External lead, 2
A, 2B...External connection part, 3...Internal lead, 3
A, 3B... Internal mount part, 4... Light emitting element,
5... Bonding wire, 6... Light receiving element, 7...
bonding wire.
Claims (1)
を有するリードを複数本配列したリードフレーム
に発光素子を搭載し、かつ同一構成のリードフレ
ームに受光素子を搭載し、これら発光素子及び受
光素子が夫々対をなすように前記各リードフレー
ムを一体的にパツケージ内に内装したことを特徴
とする光結合装置。 A light emitting element is mounted on a lead frame in which a plurality of leads having an internal mount part and an external connection part continuous thereto are arranged, and a light receiving element is mounted on a lead frame having the same structure, and these light emitting elements and light receiving elements are paired with each other. An optical coupling device characterized in that each of the lead frames is integrally housed in a package so as to form a package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4670987U JPS63155652U (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4670987U JPS63155652U (en) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155652U true JPS63155652U (en) | 1988-10-12 |
Family
ID=30866620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4670987U Pending JPS63155652U (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155652U (en) |
-
1987
- 1987-03-31 JP JP4670987U patent/JPS63155652U/ja active Pending