JPS6181163U - - Google Patents
Info
- Publication number
- JPS6181163U JPS6181163U JP1984165179U JP16517984U JPS6181163U JP S6181163 U JPS6181163 U JP S6181163U JP 1984165179 U JP1984165179 U JP 1984165179U JP 16517984 U JP16517984 U JP 16517984U JP S6181163 U JPS6181163 U JP S6181163U
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- light receiving
- emitting
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Optical Communication System (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図は同正面図、第３図は同下面図、第４図は光Ｉ
Ｃ素子の構造例を示す正面図である。
１１……発光、受光機能を持つ光ＩＣ素子、１
１Ａ……基板、１１Ｂ……発光部、１１Ｃ……受
光部、１１Ｄ……電極、１２……リードフレーム
、１３……金線、１４……樹脂（パツケージ）、
１５……光フアイバー。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a front view of the same, Fig. 3 is a bottom view of the same, and Fig. 4 is a light I
FIG. 3 is a front view showing a structural example of a C element. 11... Optical IC element with light emitting and light receiving functions, 1
1A...Substrate, 11B...Light emitting part, 11C...Light receiving part, 11D...Electrode, 12...Lead frame, 13...Gold wire, 14...Resin (package),
15...Optical fiber.
Claims (1)
発光面、受光面が同一向きの発光、受光機能を持
つ光ＩＣ素子をリードフレームにマウントし、所
定の接続となるように金線のワイヤボンデイング
を行い、樹脂でモールド、パツケージしたことを
特徴とする光フアイバー通信用発光・受光組合せ
素子。 An optical IC element with a light emitting and light receiving function, with a light emitting part in the center and a light receiving part around it, with the light emitting surface and light receiving surface facing the same direction, is mounted on a lead frame, and a gold wire is attached to make the specified connection. A combination light-emitting/light-receiving element for optical fiber communication, characterized by bonding, molding and packaging with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984165179U JPS6181163U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984165179U JPS6181163U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181163U true JPS6181163U (en) | 1986-05-29 |
Family
ID=30723039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984165179U Pending JPS6181163U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181163U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58204577A (en) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | Semiconductor light emitting element |
-
1984
- 1984-10-31 JP JP1984165179U patent/JPS6181163U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58204577A (en) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | Semiconductor light emitting element |
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