JPH0233459U - - Google Patents
Info
- Publication number
- JPH0233459U JPH0233459U JP11007088U JP11007088U JPH0233459U JP H0233459 U JPH0233459 U JP H0233459U JP 11007088 U JP11007088 U JP 11007088U JP 11007088 U JP11007088 U JP 11007088U JP H0233459 U JPH0233459 U JP H0233459U
- Authority
- JP
- Japan
- Prior art keywords
- output
- receiving element
- island portion
- light
- optically coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000009413 insulation Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Description
第１図は本考案に係る光結合半導体装置の一実
施例の横断面図、第２図は従来の光結合半導体装
置の横断面図である。
１：入力端子（−）、２：赤外発光フオトダイ
オードチツプ、３：入力端子（＋）、５：受光素
子チツプ、６：中吊り部、１２：光結合路、１３
，４０：光反射層、１４：外装、２０，３０：出
力端子、２１，３１：中継端子、２１ａ，３１ａ
：中継端子１次側アイランド、２１ｂ，３１ｂ：
中継端子２次側アイランド、２２，２３，３２，
３３：ボンデイングワイヤー。
FIG. 1 is a cross-sectional view of an embodiment of an optically coupled semiconductor device according to the present invention, and FIG. 2 is a cross-sectional view of a conventional optically coupled semiconductor device. 1: Input terminal (-), 2: Infrared light emitting photodiode chip, 3: Input terminal (+), 5: Photodetector chip, 6: Middle hanging part, 12: Optical coupling path, 13
, 40: light reflective layer, 14: exterior, 20, 30: output terminal, 21, 31: relay terminal, 21a, 31a
:Relay terminal primary side island, 21b, 31b:
Relay terminal secondary island, 22, 23, 32,
33: Bonding wire.
Claims (1)
受光素子とを透明または乳白色の樹脂にて光結合
し、この樹脂のまわりを、光を反射するための白
色樹脂で覆つた光結合半導体装置において、前記
受光素子と、この受光素子からの出力を導くため
の出力端子との間にリードフレーム中継端子を設
け、前記受光素子からの出力配線をするためのボ
ンデイングワイヤーを前記リードフレーム中継端
子のアイランド部へ接続してこのアイランド部を
前記白色樹脂で覆い、さらに前記リードフレーム
中継端子から前記出力端子のアイランド部へボン
デイングワイヤーを接続したことを特徴とする光
結合半導体装置。 An optically coupled semiconductor device in which a light-emitting element and a light-receiving element are optically coupled with a transparent or milky white resin in order to provide insulation separation between input and output, and this resin is covered with a white resin to reflect light. A lead frame relay terminal is provided between the light receiving element and an output terminal for guiding the output from the light receiving element, and a bonding wire for wiring the output from the light receiving element is connected to the lead frame relay terminal. An optically coupled semiconductor device, characterized in that the island portion is connected to an island portion and the island portion is covered with the white resin, and further a bonding wire is connected from the lead frame relay terminal to the island portion of the output terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11007088U JPH0233459U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11007088U JPH0233459U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233459U true JPH0233459U (en) | 1990-03-02 |
Family
ID=31346896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11007088U Pending JPH0233459U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233459U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0245659U (en) * | 1988-09-22 | 1990-03-29 | ||
| JP2010258165A (en) * | 2009-04-23 | 2010-11-11 | Omron Corp | Optical coupler |
-
1988
- 1988-08-24 JP JP11007088U patent/JPH0233459U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0245659U (en) * | 1988-09-22 | 1990-03-29 | ||
| JP2010258165A (en) * | 2009-04-23 | 2010-11-11 | Omron Corp | Optical coupler |
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