JPS62291077A - Photo coupler - Google Patents
Photo couplerInfo
- Publication number
- JPS62291077A JPS62291077A JP61134593A JP13459386A JPS62291077A JP S62291077 A JPS62291077 A JP S62291077A JP 61134593 A JP61134593 A JP 61134593A JP 13459386 A JP13459386 A JP 13459386A JP S62291077 A JPS62291077 A JP S62291077A
- Authority
- JP
- Japan
- Prior art keywords
- emitting element
- light
- light emitting
- photodetector
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔発明の目的〕
（産業上の利用分野）
この発明は、発光素子と受光素子とが光学的に結合され
た状態で同一の容器内に封入された光結合器に関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) This invention provides a method for storing a light-emitting element and a light-receiving element in the same container while being optically coupled. Relating to an encapsulated optical coupler.
（従来の技術）
従来、光結合器は例えば第４図に示すように構成されて
いる。第４図にお−で、１ノは発光素子、１２は受光素
子で、これらの素子１１．１２はそれぞれリードフレー
ム１３．１４上に載置され、図示しない金属細線によっ
て配線されている。(Prior Art) Conventionally, an optical coupler is configured as shown in FIG. 4, for example. In FIG. 4, 1 is a light emitting element, and 12 is a light receiving element. These elements 11 and 12 are placed on lead frames 13 and 14, respectively, and are wired by thin metal wires (not shown).
１５は透光性樹脂から成る光伝達部で、ポッテッング等
の方法を用いて発光素子１ノと受光素子１２とを包むよ
うに形成される。また、１６は透光性樹脂から成る外囲
器で、トランスファモールド法等によって形成される。Reference numeral 15 denotes a light transmitting section made of a translucent resin, which is formed so as to enclose the light emitting element 1 and the light receiving element 12 using a method such as potting. Further, reference numeral 16 denotes an envelope made of a transparent resin, which is formed by a transfer molding method or the like.
ところで、光結合器の重要な特性の一つとして伝達効率
（入力に対する出力の割合）があるが、上記第４図に示
しだような構成ではこの伝達効率のばらつきが大きい欠
点がある。そこで、この伝達効率を一定にするために、
発光素子１１と受光素子１２の特性を検査し選別して組
合わせることが行なわれているが、このばらつきに対し
ては大きな効果は得られない。この問題を種々検討した
結果、光を伝達する透光性樹脂から成る光伝達部１５の
形状にばらつきの原因の多くがあることが明らかとなっ
た。By the way, one of the important characteristics of an optical coupler is the transmission efficiency (ratio of output to input), and the configuration shown in FIG. 4 has the disadvantage that the transmission efficiency varies widely. Therefore, in order to keep this transmission efficiency constant,
Although the characteristics of the light-emitting element 11 and the light-receiving element 12 are inspected, selected, and combined, no significant effect can be obtained on this variation. As a result of various studies on this problem, it has become clear that many of the causes of variations are in the shape of the light transmitting section 15 made of a transparent resin that transmits light.
（発明が解決しようとする問題点）
上述したように従来の光結合器は伝達効率のばらつきが
大きい欠点があった。(Problems to be Solved by the Invention) As described above, conventional optical couplers have the drawback of large variations in transmission efficiency.
この発明は上記のような事情に鑑みてなされたもので、
その目的とするところは、光伝達部を再現性良く形成す
ることにより伝達効率のばらつきが少なく、且つ高い伝
達効率が得られる光結合器を提供することにある。This invention was made in view of the above circumstances,
The purpose is to provide an optical coupler in which variation in transmission efficiency is small and high transmission efficiency can be obtained by forming a light transmission part with good reproducibility.
（問題点を解決するための手段と作用）この発明におい
ては、上記の１的を達成するために、発光素子と受光素
子との間に金属製の反射板を設け、発光素子からの光を
この反射板による反射によって受光素子に伝達すること
により伝達効率を高めるとともに、上記反射板を透光性
樹脂によって形成される光伝達部のストン・４′（整形
部材）として用いることによシ光伝達部の形状の再現性
を高めている。(Means and effects for solving the problem) In order to achieve the above-mentioned object, in this invention, a metal reflection plate is provided between the light emitting element and the light receiving element to reflect light from the light emitting element. The transmission efficiency is increased by transmitting the light to the light-receiving element through reflection by the reflector, and the light is also increased by using the reflector as a stone 4' (shaping member) of the light transmitting section formed of a translucent resin. Improves the reproducibility of the shape of the transmission part.
（実施例）
以下、この発明の一実施例について図面を参照して説明
する。第１図において、前記第４図と同一構成部には同
じ符号を付しており、１ノは発光素子、１２は受光素子
、１．９ 、１４はリードフレーム、１５は透光性樹脂
から成る光伝達部、１６は外囲器、１７は反射板である
。上記反射板１７は、上記発光素子１１から発せられた
光を反射して高い伝達効率で上記受光素子１２に導くよ
うに設けられている。また、この反射板１７は、光伝達
部１５のストッパ（整形部材）としても働き。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. In FIG. 1, the same components as those in FIG. 16 is an envelope, and 17 is a reflecting plate. The reflecting plate 17 is provided so as to reflect the light emitted from the light emitting element 11 and guide it to the light receiving element 12 with high transmission efficiency. Further, this reflection plate 17 also functions as a stopper (shaping member) for the light transmission section 15.
この光伝達部１５の形状の再現性を高める作用をする。This serves to improve the reproducibility of the shape of the light transmission section 15.
これによって、伝達効率のばらつきを大幅に改善するこ
とができる。Thereby, variations in transmission efficiency can be significantly improved.
上記第１図に示したような構造の光結合器は。The optical coupler has a structure as shown in FIG. 1 above.
例えば次のようにして形成される。すなわち、まず第２
図（、）に示すようなリードフレーム１８を用意し、そ
の一部１８ｋを金型で押し曲げて（ｂ）図に示すように
反射板１７を形成する０次Ｋ、リードフレーム１８にお
ける発光素子と受光素子の設置部１８Ｂ、１８Ｃに発光
素子１ノと受光素子１２を載置し、デンディングワイヤ
１９に、１９Ｂでリードフレーム１８Ａ、１８Ｄとそれ
ぞれＩＩｒンデイング接続する。次に、−上記発光素子
１ノ、受光素子１２および反射板１７間に透光性シリコ
ーン樹脂で光伝達部１５を形成する。そして、上記光伝
達部１５を白色のエポキシ樹脂でトランスファモールド
９して外囲器１６を形成し、メッキ、リート◆不要部の
切り落とし、押し曲げ旬、の工程を経て前記第１図に示
したようなりＩＰ型の光結合器を得る。For example, it is formed as follows. That is, first, the second
A light-emitting element in the lead frame 18 is prepared by preparing a lead frame 18 as shown in the figure (,) and pressing and bending a part 18k of it with a mold to form a reflecting plate 17 as shown in the figure (b). The light-emitting element 1 and the light-receiving element 12 are placed on the light-receiving element installation parts 18B and 18C, and connected to the lead frames 18A and 18D by the leading wire 19 at 19B, respectively. Next, a light transmitting section 15 is formed between the light emitting element 1, the light receiving element 12, and the reflecting plate 17 using a translucent silicone resin. Then, the light transmitting part 15 is transfer-molded 9 with white epoxy resin to form an envelope 16, which is then subjected to the steps of plating, cutting off unnecessary parts, and pressing and bending, as shown in FIG. 1. Thus, an IP type optical coupler is obtained.
ＳＩＰ型の光結合器を形成する場合には、壕ず第３図（
ａ） 、 （ｂ）に示すような２枚のリードフレーム２
０．２１を準備し、（ｂ）図に示すリードフレーム２１
ヒの発光素子と受光素子の設置部２１Ａ。When forming a SIP type optical coupler, the groove shown in Figure 3 (
Two lead frames 2 as shown in a) and (b)
0.21 is prepared, and the lead frame 21 shown in FIG.
Installation section 21A for the light-emitting element and light-receiving element.
２１１３上に発光素子１ノおよび受光素子１２を載置し
、ボンディングワイヤ２２に、２２Ｂでワイヤボンディ
ングする。上記リードフレーム２０は反射板となる７１
ｉ分２３ｍ、２３ｂ、・・・を備えており、このリード
フレー２０と上記リードフレーム２１とが第３図（Ｃ）
に示すように組合わされて使用される。この際、上記反
射板となる部分２３ａ。The light emitting element 1 and the light receiving element 12 are placed on 2113, and wire bonded to the bonding wire 22 at 22B. The lead frame 20 serves as a reflector 71
This lead frame 20 and the lead frame 21 are shown in FIG. 3(C).
They are used in combination as shown. At this time, the portion 23a serves as the reflecting plate.
２３ｂ、・・・は発光素子の載置部と受光素子の載置部
間上に折曲されて設けられる。次に、発光素子１１、受
光素子１２および反射板間に透光性シリコーン樹脂で光
伝達部を形成し、白色エポキシ樹脂でトランスファモー
ルドする。そして、メッキ。23b, . . . are bent and provided between the mounting portion of the light emitting element and the mounting portion of the light receiving element. Next, a light transmission section is formed between the light emitting element 11, the light receiving element 12, and the reflection plate using a translucent silicone resin, and transfer molding is performed using a white epoxy resin. And plating.
リードフレームの不要部の切り落し等の工程を経て、第
４図（ｄ）の断面図に示すようなＳＩＰ型の光結合器を
形成する。Through steps such as cutting off unnecessary parts of the lead frame, an SIP type optical coupler as shown in the cross-sectional view of FIG. 4(d) is formed.
このような構成によれば、発光素子から発せられた光を
反射板で反射して受光素子に導くようにしたので高い光
伝達効果が得られる。しかも、上記反射板は透光性樹脂
の整形部材としても働き、その形状の再現性を高める作
用をするので伝達効率のばらつきを大幅に改善すること
ができる。According to this configuration, the light emitted from the light emitting element is reflected by the reflection plate and guided to the light receiving element, so that a high light transmission effect can be obtained. Moreover, the reflector plate also functions as a shaping member for the translucent resin and improves the reproducibility of its shape, so that variations in transmission efficiency can be significantly improved.
なお、例えば反射板に光沢銀メッキを施すことにより反
射率を高くすれば、より高い光伝達効率を得ることがで
きる。Note that, for example, if the reflectance is increased by plating the reflector with bright silver, higher light transmission efficiency can be obtained.
以上説明したようにこの発明によれば、光伝達部を再現
性良く形成することＫより伝達効率のばらつきが通なく
、且つ高い伝達効率が得られる光結合器を提供できる。As explained above, according to the present invention, it is possible to provide an optical coupler which is free from variations in transmission efficiency and can obtain high transmission efficiency by forming the optical transmission portion with good reproducibility.
第１図はこの発明の一実施例に係わる光結合器を示す断
面構成図、第２図は上記第１図の構成の製造方法につい
て説明するだめの図、第３図は上記第１図の構成の他の
製造方法につｌｉｒて説明するだめの図、第４図は従来
の光結合器を示す断面構成図である。
１１・・・発光素子、１２・・・受光素子、Ｊ５・・・
光伝達部、１６・・・外囲器、１７・・・反射板。
出願人代理人 弁理士 鈴 江 武 彦７一FIG. 1 is a cross-sectional configuration diagram showing an optical coupler according to an embodiment of the present invention, FIG. 2 is a diagram for explaining the manufacturing method of the configuration shown in FIG. 1, and FIG. FIG. 4 is a cross-sectional configuration diagram showing a conventional optical coupler. 11... Light emitting element, 12... Light receiving element, J5...
Light transmission section, 16... Envelope, 17... Reflection plate. Applicant's agent Patent attorney Takehiko Suzue 71
Claims (1)
器において、上記発光素子と受光素子との間に発光素子
から発せられた光を反射して受光素子に伝達する反射板
を設け、上記発光素子、受光素子および反射板間に透光
性樹脂で光伝達部を形成し、この光伝達部をトランスフ
ァモールドしたことを特徴とする光結合器。In an optical coupler in which a light emitting element and a light receiving element are enclosed in the same container, a reflecting plate is provided between the light emitting element and the light receiving element to reflect light emitted from the light emitting element and transmitting it to the light receiving element, An optical coupler characterized in that a light transmitting section is formed between the light emitting element, the light receiving element and the reflecting plate using a translucent resin, and the light transmitting section is transfer molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61134593A JPS62291077A (en) | 1986-06-10 | 1986-06-10 | Photo coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61134593A JPS62291077A (en) | 1986-06-10 | 1986-06-10 | Photo coupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62291077A true JPS62291077A (en) | 1987-12-17 |
Family
ID=15132012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61134593A Pending JPS62291077A (en) | 1986-06-10 | 1986-06-10 | Photo coupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62291077A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6590232B2 (en) | 2000-08-28 | 2003-07-08 | Sharp Kabushiki Kaisha | Optical coupling semiconductor apparatus and method for manufacturing the same |
-
1986
- 1986-06-10 JP JP61134593A patent/JPS62291077A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6590232B2 (en) | 2000-08-28 | 2003-07-08 | Sharp Kabushiki Kaisha | Optical coupling semiconductor apparatus and method for manufacturing the same |
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