JPH02136343U - - Google Patents
Info
- Publication number
- JPH02136343U JPH02136343U JP4594389U JP4594389U JPH02136343U JP H02136343 U JPH02136343 U JP H02136343U JP 4594389 U JP4594389 U JP 4594389U JP 4594389 U JP4594389 U JP 4594389U JP H02136343 U JPH02136343 U JP H02136343U
- Authority
- JP
- Japan
- Prior art keywords
- output lead
- light
- input
- semiconductor device
- chip mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す斜視図、第２
図は同上の断面図、第３図は本考案の異なる実施
例を示す断面図、第４図は従来例を示す斜視図、
第５図は同上の断面図である。
１，２……入力リードフレーム、３，４……出
力リードフレーム、５……発光素子、６……受光
素子、７……透明カツプリング樹脂、８……出力
素子、９……エポキシ成形樹脂、１ａ……チツプ
搭載部、２ａ……ボンデイング部、１ｂ，２ｂ…
…外部リード部、３ａ，４ａ……チツプ搭載部、
３ｂ，４ｂ……外部リード部。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view of the same as above, FIG. 3 is a sectional view showing a different embodiment of the present invention, and FIG. 4 is a perspective view showing a conventional example.
FIG. 5 is a sectional view of the same as above. 1, 2... Input lead frame, 3, 4... Output lead frame, 5... Light emitting element, 6... Light receiving element, 7... Transparent coupling resin, 8... Output element, 9... Epoxy molding resin, 1a... Chip mounting part, 2a... Bonding part, 1b, 2b...
...External lead part, 3a, 4a... Chip mounting part,
3b, 4b...external lead parts.
Claims (1)
部に搭載した発光素子と受光素子を、透明カツプ
リング樹脂を介して光結合させたシングル・イン
・ライン型パツケージタイプの光結合型半導体装
置において、前記入力・出力リードフレームのい
ずれか一方若しくは両方を折り曲げると共に、前
記発光素子と受光素子が対向するように入力・出
力リードフレームを配設したことを特徴とする光
結合型半導体装置。 (2) 前記出力リードフレームのチツプ搭載部の
厚みを外部リード部よりも厚くしたことを特徴と
する請求項１記載の光結合型半導体装置。[Claims for Utility Model Registration] (1) A single-in-line package type in which the light-emitting element and light-receiving element mounted on each chip mounting part of the input/output lead frame are optically coupled via a transparent coupling resin. An optical coupling type semiconductor device, characterized in that one or both of the input/output lead frames are bent and the input/output lead frames are arranged so that the light emitting element and the light receiving element face each other. type semiconductor device. (2) The optically coupled semiconductor device according to claim 1, wherein the chip mounting portion of the output lead frame is thicker than the external lead portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4594389U JPH02136343U (en) | 1989-04-19 | 1989-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4594389U JPH02136343U (en) | 1989-04-19 | 1989-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02136343U true JPH02136343U (en) | 1990-11-14 |
Family
ID=31560577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4594389U Pending JPH02136343U (en) | 1989-04-19 | 1989-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02136343U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476063U (en) * | 1990-11-16 | 1992-07-02 |
-
1989
- 1989-04-19 JP JP4594389U patent/JPH02136343U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476063U (en) * | 1990-11-16 | 1992-07-02 |
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