JPS61171266U - - Google Patents
Info
- Publication number
- JPS61171266U JPS61171266U JP5429885U JP5429885U JPS61171266U JP S61171266 U JPS61171266 U JP S61171266U JP 5429885 U JP5429885 U JP 5429885U JP 5429885 U JP5429885 U JP 5429885U JP S61171266 U JPS61171266 U JP S61171266U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- group
- emitting diodes
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図、第２図、第３図は本考案の一実施例の
ＬＥＤランプを示し、第１図はその平面図、第２
図はその正面図、第３図は第１図のＡ―Ａ′矢視
断面図である。
１…ＬＥＤ、２…リードフレーム、３…支持部
材、４…樹脂モールド部、５…ボンデイングパツ
ド。
1, 2, and 3 show an LED lamp according to an embodiment of the present invention, and FIG. 1 is a plan view thereof, and FIG.
The figure is a front view thereof, and FIG. 3 is a sectional view taken along the line A-A' in FIG. DESCRIPTION OF SYMBOLS 1... LED, 2... Lead frame, 3... Supporting member, 4... Resin mold part, 5... Bonding pad.
Claims (1)
る支持部材と、 該発光ダイオード群及び該リード部材を、該支
持部材に樹脂封入する樹脂モールド部と、から構
成され、 該発光ダイオード群は単一の樹脂モールド部に
一体的に樹脂封入されていることを特徴とする発
光ダイオードランプ。 (2) 発光ダイオード群は８個の発光ダイオード
で構成され、略直方体形状をなす支持部材の長手
方向に各４個ずつ平行に並んでいる実用新案登録
請求の範囲第１項記載の発光ダイオードランプ。 (3) 支持部材は内壁面が下方に開くテーパ形状
の凹部を有し、該凹部の底には長手方向に平行な
２本の貫通溝を具備しており、該貫通溝に該凹部
へ向かう各々４個の発光ダイオードが設けられて
いる実用新案登録請求の範囲第２項記載の発光ダ
イオードランプ。 (4) 樹脂モールド部は略透明な光通過部と、発
光ダイオードからの光を乱反射せしめる光反射部
とからなる実用新案登録請求の範囲第１項記載の
発光ダイオードランプ。 (5) 光反射部にはシリカ粉末を含む実用新案登
録請求の範囲第４項記載の発光ダイオードランプ
。[Claims for Utility Model Registration] (1) A group of three or more light emitting diodes, a lead member connected to the group of light emitting diodes, a support member supporting the group of light emitting diodes and the lead member, and the group of light emitting diodes. and a resin mold part for resin-sealing the lead member in the support member, and the light-emitting diode group is integrally resin-sealed in a single resin mold part. . (2) The light-emitting diode lamp according to claim 1, wherein the light-emitting diode group is composed of eight light-emitting diodes, each four of which are arranged in parallel in the longitudinal direction of a substantially rectangular parallelepiped support member. . (3) The support member has a tapered recess whose inner wall surface opens downward, and the bottom of the recess is provided with two through grooves parallel to the longitudinal direction, and the through grooves are provided with two through grooves extending toward the recess. The light emitting diode lamp according to claim 2, each of which is provided with four light emitting diodes. (4) The light-emitting diode lamp according to claim 1, in which the resin molded portion is comprised of a substantially transparent light-passing portion and a light-reflecting portion that diffusely reflects light from the light-emitting diode. (5) The light emitting diode lamp according to claim 4 of the utility model registration claim, in which the light reflecting portion contains silica powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5429885U JPS61171266U (en) | 1985-04-12 | 1985-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5429885U JPS61171266U (en) | 1985-04-12 | 1985-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171266U true JPS61171266U (en) | 1986-10-24 |
Family
ID=30575925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5429885U Pending JPS61171266U (en) | 1985-04-12 | 1985-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171266U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637657A (en) * | 1986-06-27 | 1988-01-13 | Nitto Electric Ind Co Ltd | Photo-semiconductor device |
-
1985
- 1985-04-12 JP JP5429885U patent/JPS61171266U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637657A (en) * | 1986-06-27 | 1988-01-13 | Nitto Electric Ind Co Ltd | Photo-semiconductor device |