JPH0328764U - - Google Patents
Info
- Publication number
- JPH0328764U JPH0328764U JP1989088611U JP8861189U JPH0328764U JP H0328764 U JPH0328764 U JP H0328764U JP 1989088611 U JP1989088611 U JP 1989088611U JP 8861189 U JP8861189 U JP 8861189U JP H0328764 U JPH0328764 U JP H0328764U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- reflective surface
- light emitting
- lead portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の１実施例である発光ダイオー
ドの概略断面図及びその発光素子が発する光の光
路図、第２図はその発光ダイオードの概略正面図
、第３図はその変形例を示す図、第４図は従来の
反射型の発光ダイオードの概略断面図及びその発
光素子が発する光の光路図、第５図は従来の反射
型の発光ダイオードの概略正面図である。
１……発光素子、２，３……リードフレーム、
４……ワイヤ、５……光透過性材料、５ａ……放
射面、６……反射面。
Fig. 1 is a schematic cross-sectional view of a light-emitting diode that is an embodiment of the present invention and an optical path diagram of light emitted by its light-emitting element, Fig. 2 is a schematic front view of the light-emitting diode, and Fig. 3 shows a modification thereof. 4 are a schematic cross-sectional view of a conventional reflective light emitting diode and an optical path diagram of light emitted by its light emitting element, and FIG. 5 is a schematic front view of a conventional reflective light emitting diode. 1... Light emitting element, 2, 3... Lead frame,
4... Wire, 5... Light-transmitting material, 5a... Emitting surface, 6... Reflecting surface.
Claims (1)
リード部と、前記発光素子の発光面に対向して設
けられた反射面とを有し、前記発光素子が発する
光を前記反射面で反射した後に外部に放射する発
光ダイオードにおいて、前記リード部はリードフ
レームを含むものであり、該リードフレームは前
記反射面に対向する面の裏面に反射防止処理が施
されていることを特徴とする発光ダイオード。 (2) 光透過性材料によつて、前記発光素子と前
記リード部の一部とが封止されると共に、前記発
光素子と前記反射面との空間が埋められている請
求項１記載の発光ダイオード。[Claims for Utility Model Registration] (1) A light-emitting element comprising: a light-emitting element; a lead portion for supplying power to the light-emitting element; and a reflective surface provided opposite to a light-emitting surface of the light-emitting element; In the light emitting diode that emits light to the outside after reflecting it on the reflective surface, the lead portion includes a lead frame, and the lead frame has an anti-reflection treatment applied to the back side of the surface facing the reflective surface. A light emitting diode characterized by: (2) The light emitting device according to claim 1, wherein the light emitting element and a part of the lead portion are sealed with a light-transmitting material, and a space between the light emitting element and the reflective surface is filled. diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088611U JPH0755008Y2 (en) | 1989-07-28 | 1989-07-28 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088611U JPH0755008Y2 (en) | 1989-07-28 | 1989-07-28 | Light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0328764U true JPH0328764U (en) | 1991-03-22 |
| JPH0755008Y2 JPH0755008Y2 (en) | 1995-12-18 |
Family
ID=31638213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989088611U Expired - Lifetime JPH0755008Y2 (en) | 1989-07-28 | 1989-07-28 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755008Y2 (en) |
-
1989
- 1989-07-28 JP JP1989088611U patent/JPH0755008Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755008Y2 (en) | 1995-12-18 |
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