JPS6451628A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS6451628A
JPS6451628A JP20814887A JP20814887A JPS6451628A JP S6451628 A JPS6451628 A JP S6451628A JP 20814887 A JP20814887 A JP 20814887A JP 20814887 A JP20814887 A JP 20814887A JP S6451628 A JPS6451628 A JP S6451628A
Authority
JP
Japan
Prior art keywords
lead
hold
tab
section
hanging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20814887A
Other languages
Japanese (ja)
Other versions
JP2524364B2 (en
Inventor
Toshihiro Inoue
Koji Hirata
Katsumi Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP62208148A priority Critical patent/JP2524364B2/en
Publication of JPS6451628A publication Critical patent/JPS6451628A/en
Application granted granted Critical
Publication of JP2524364B2 publication Critical patent/JP2524364B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To minimize the thermal deformation of a tab-hanging lead in a lead frame, and to improve the reliability of wire bonding by using brass having high thermal conductivity as a heat block for a wire bonding device and allowing a hold-down section for the tab-hanging lead for a lead hold-down jig to project to a section slightly lower than a hold-down section for a lead terminal. CONSTITUTION:Since a heat block 1 is composed of brass having high thermal conductivity, a lead frame 2 is heated instantaneously up to the deformation saturation region of the lead frame 2 by the heat block 1, and the thermal deformation of the lead frame 2 at the time of bonding is inhibited minimally. A tab-hanging hold-down section 9 is formed to a section lower than a lead terminal hold-down section 10 in a lead hold-down jig 7, thus positively pressing a tab-hanging lead 3 by small force.
JP62208148A 1987-08-24 1987-08-24 Wire bonding equipment Expired - Fee Related JP2524364B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62208148A JP2524364B2 (en) 1987-08-24 1987-08-24 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62208148A JP2524364B2 (en) 1987-08-24 1987-08-24 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS6451628A true JPS6451628A (en) 1989-02-27
JP2524364B2 JP2524364B2 (en) 1996-08-14

Family

ID=16551434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62208148A Expired - Fee Related JP2524364B2 (en) 1987-08-24 1987-08-24 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JP2524364B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499833U (en) * 1991-02-06 1992-08-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499833U (en) * 1991-02-06 1992-08-28

Also Published As

Publication number Publication date
JP2524364B2 (en) 1996-08-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees