JPS6424602A - Mounting method for chip type inductor - Google Patents

Mounting method for chip type inductor

Info

Publication number
JPS6424602A
JPS6424602A JP18200587A JP18200587A JPS6424602A JP S6424602 A JPS6424602 A JP S6424602A JP 18200587 A JP18200587 A JP 18200587A JP 18200587 A JP18200587 A JP 18200587A JP S6424602 A JPS6424602 A JP S6424602A
Authority
JP
Japan
Prior art keywords
pad
wire
dielectric resonator
pattern
chip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18200587A
Other languages
Japanese (ja)
Inventor
Osamu Osawa
Kunio Arakawa
Izumi Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP18200587A priority Critical patent/JPS6424602A/en
Publication of JPS6424602A publication Critical patent/JPS6424602A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

PURPOSE:To facilitate the automation of the mounting process by providing two sets of highly conductive pad to one conductive face of a chip type inductor and using a high conduction wire so as to connect each pad and a circuit pattern of a base side by the wire bonding method thereby eliminating the need for soldering lead terminals. CONSTITUTION:A connection pattern 17 is formed fo two parts on the base 16 while clipping a dielectric resonator 11 in front and in rear and each pad 18 of the dielectric resonator 11 and the connection pattern 17 are connected by a gold-made wire 15. In case of mounting, two pads 18 are formed on a metallic film 13 of the dielectric resonator 11 by printing and the dielectric resonator 11 is fixed on a dice bonding pattern 19 of the base 18 by soldering or the like. Then the wire 15 is used to connect each pad 18 and the connection pattern 17 by the wire bonding method to form the circuit. The processes above are attained by automation.
JP18200587A 1987-07-21 1987-07-21 Mounting method for chip type inductor Pending JPS6424602A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18200587A JPS6424602A (en) 1987-07-21 1987-07-21 Mounting method for chip type inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18200587A JPS6424602A (en) 1987-07-21 1987-07-21 Mounting method for chip type inductor

Publications (1)

Publication Number Publication Date
JPS6424602A true JPS6424602A (en) 1989-01-26

Family

ID=16110657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18200587A Pending JPS6424602A (en) 1987-07-21 1987-07-21 Mounting method for chip type inductor

Country Status (1)

Country Link
JP (1) JPS6424602A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357496B1 (en) 1999-08-12 2002-03-19 Meinan Machinery Works, Inc. Veneer lathe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357496B1 (en) 1999-08-12 2002-03-19 Meinan Machinery Works, Inc. Veneer lathe

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