JPS54127677A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54127677A JPS54127677A JP3624278A JP3624278A JPS54127677A JP S54127677 A JPS54127677 A JP S54127677A JP 3624278 A JP3624278 A JP 3624278A JP 3624278 A JP3624278 A JP 3624278A JP S54127677 A JPS54127677 A JP S54127677A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- electrode support
- caused
- soldering
- warp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To prevent occurrence of the warp for the semiconductor element and the electrode support panel, which is caused by soldering between them, by using the lamination metal plate composed of the hetero-metals for the electrode support panel.
CONSTITUTION: Semiconductor element 1 is soldered to electrode support plate 2a composed of the lamination metal plate of the triple-pole structure in order to prevent the warp for both element 1 and panel 2a. This is due to the fact that a good balance is secured between element 1 and panel 2a by the internal stress caused by the 3-layer structure and that the thermal strain caused by soldering is absorbed by the balance of the internal stress for both element 1 and panel 2a.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3624278A JPS54127677A (en) | 1978-03-28 | 1978-03-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3624278A JPS54127677A (en) | 1978-03-28 | 1978-03-28 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54127677A true JPS54127677A (en) | 1979-10-03 |
Family
ID=12464295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3624278A Pending JPS54127677A (en) | 1978-03-28 | 1978-03-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54127677A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5300809A (en) * | 1989-12-12 | 1994-04-05 | Sumitomo Special Metals Co., Ltd. | Heat-conductive composite material |
-
1978
- 1978-03-28 JP JP3624278A patent/JPS54127677A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5300809A (en) * | 1989-12-12 | 1994-04-05 | Sumitomo Special Metals Co., Ltd. | Heat-conductive composite material |
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