JPS54127677A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54127677A
JPS54127677A JP3624278A JP3624278A JPS54127677A JP S54127677 A JPS54127677 A JP S54127677A JP 3624278 A JP3624278 A JP 3624278A JP 3624278 A JP3624278 A JP 3624278A JP S54127677 A JPS54127677 A JP S54127677A
Authority
JP
Japan
Prior art keywords
panel
electrode support
caused
soldering
warp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3624278A
Other languages
Japanese (ja)
Inventor
Kiyohiko Mihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3624278A priority Critical patent/JPS54127677A/en
Publication of JPS54127677A publication Critical patent/JPS54127677A/en
Pending legal-status Critical Current

Links

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  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent occurrence of the warp for the semiconductor element and the electrode support panel, which is caused by soldering between them, by using the lamination metal plate composed of the hetero-metals for the electrode support panel.
CONSTITUTION: Semiconductor element 1 is soldered to electrode support plate 2a composed of the lamination metal plate of the triple-pole structure in order to prevent the warp for both element 1 and panel 2a. This is due to the fact that a good balance is secured between element 1 and panel 2a by the internal stress caused by the 3-layer structure and that the thermal strain caused by soldering is absorbed by the balance of the internal stress for both element 1 and panel 2a.
COPYRIGHT: (C)1979,JPO&Japio
JP3624278A 1978-03-28 1978-03-28 Semiconductor device Pending JPS54127677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3624278A JPS54127677A (en) 1978-03-28 1978-03-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3624278A JPS54127677A (en) 1978-03-28 1978-03-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54127677A true JPS54127677A (en) 1979-10-03

Family

ID=12464295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3624278A Pending JPS54127677A (en) 1978-03-28 1978-03-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54127677A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material

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