JPS5578535A - Pressure-contact type semiconductor device - Google Patents
Pressure-contact type semiconductor deviceInfo
- Publication number
- JPS5578535A JPS5578535A JP15225078A JP15225078A JPS5578535A JP S5578535 A JPS5578535 A JP S5578535A JP 15225078 A JP15225078 A JP 15225078A JP 15225078 A JP15225078 A JP 15225078A JP S5578535 A JPS5578535 A JP S5578535A
- Authority
- JP
- Japan
- Prior art keywords
- pillar
- elastic deformation
- pressure
- semiconductor device
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To absorb thermal stress through deformation of pillars by dividing a contact face with a main electrode of a main electrode conductor into plural pillars to facillitate an elastic deformation.
CONSTITUTION: A groove 12 narrow but deep to obtain plural pillar in squares is formed on a contact face with a cathode 2 of a diode element 1 for cathode conductor 7, thereby forming the pillar 13 divided and easy for elastic deformation. Accord ing to this constitution, a thermal stress working between the diode element 1 and the cathode conductor 7 due to heat generated by conducting current can be absorbed by elastic deformation of the pillar 13, and thus a thermal compensation plate necessary conventionally can be omitted.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15225078A JPS5578535A (en) | 1978-12-08 | 1978-12-08 | Pressure-contact type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15225078A JPS5578535A (en) | 1978-12-08 | 1978-12-08 | Pressure-contact type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5578535A true JPS5578535A (en) | 1980-06-13 |
Family
ID=15536370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15225078A Pending JPS5578535A (en) | 1978-12-08 | 1978-12-08 | Pressure-contact type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5578535A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57180137A (en) * | 1981-04-30 | 1982-11-06 | Hitachi Ltd | Semicondudtor device |
EP0476661A2 (en) * | 1990-09-20 | 1992-03-25 | Kabushiki Kaisha Toshiba | Press-contact type semiconductor device |
US5489802A (en) * | 1992-06-26 | 1996-02-06 | Mitsubishi Denki Kabushiki Kaisha | Pressure contact type semiconductor device and heat compensator |
JP2010003870A (en) * | 2008-06-20 | 2010-01-07 | Denso Corp | Semiconductor device and manufacturing method thereof |
-
1978
- 1978-12-08 JP JP15225078A patent/JPS5578535A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57180137A (en) * | 1981-04-30 | 1982-11-06 | Hitachi Ltd | Semicondudtor device |
EP0476661A2 (en) * | 1990-09-20 | 1992-03-25 | Kabushiki Kaisha Toshiba | Press-contact type semiconductor device |
US5360985A (en) * | 1990-09-20 | 1994-11-01 | Kabushiki Kaisha Toshiba | Press-contact type semiconductor device |
US5489802A (en) * | 1992-06-26 | 1996-02-06 | Mitsubishi Denki Kabushiki Kaisha | Pressure contact type semiconductor device and heat compensator |
JP2010003870A (en) * | 2008-06-20 | 2010-01-07 | Denso Corp | Semiconductor device and manufacturing method thereof |
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