JPS5378771A - Preparation for semiconductor device - Google Patents

Preparation for semiconductor device

Info

Publication number
JPS5378771A
JPS5378771A JP15530676A JP15530676A JPS5378771A JP S5378771 A JPS5378771 A JP S5378771A JP 15530676 A JP15530676 A JP 15530676A JP 15530676 A JP15530676 A JP 15530676A JP S5378771 A JPS5378771 A JP S5378771A
Authority
JP
Japan
Prior art keywords
preparation
semiconductor device
connection
bump
matching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15530676A
Other languages
Japanese (ja)
Inventor
Kenji Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15530676A priority Critical patent/JPS5378771A/en
Publication of JPS5378771A publication Critical patent/JPS5378771A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain good connection without using wire bonding, by heating and re-solving in the reducing characteristic gas atmosphere the bump which is an electrode for connection of the semiconductor tip and the lead frame which is in contact with the foregoing, and making them perform the own matching by surface tension.
COPYRIGHT: (C)1978,JPO&Japio
JP15530676A 1976-12-23 1976-12-23 Preparation for semiconductor device Pending JPS5378771A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15530676A JPS5378771A (en) 1976-12-23 1976-12-23 Preparation for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15530676A JPS5378771A (en) 1976-12-23 1976-12-23 Preparation for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5378771A true JPS5378771A (en) 1978-07-12

Family

ID=15603009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15530676A Pending JPS5378771A (en) 1976-12-23 1976-12-23 Preparation for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5378771A (en)

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