JPS51144182A - Indirectly heated semiconductor unit - Google Patents

Indirectly heated semiconductor unit

Info

Publication number
JPS51144182A
JPS51144182A JP50068409A JP6840975A JPS51144182A JP S51144182 A JPS51144182 A JP S51144182A JP 50068409 A JP50068409 A JP 50068409A JP 6840975 A JP6840975 A JP 6840975A JP S51144182 A JPS51144182 A JP S51144182A
Authority
JP
Japan
Prior art keywords
semiconductor unit
indirectly heated
heated semiconductor
package
electric heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50068409A
Other languages
Japanese (ja)
Inventor
Hideo Onishi
Josuke Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50068409A priority Critical patent/JPS51144182A/en
Publication of JPS51144182A publication Critical patent/JPS51144182A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: In directly heated semiconductor unit with high heat response and reliability achieved by improving insulation between electric heater and package.
COPYRIGHT: (C)1976,JPO&Japio
JP50068409A 1975-06-05 1975-06-05 Indirectly heated semiconductor unit Pending JPS51144182A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50068409A JPS51144182A (en) 1975-06-05 1975-06-05 Indirectly heated semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50068409A JPS51144182A (en) 1975-06-05 1975-06-05 Indirectly heated semiconductor unit

Publications (1)

Publication Number Publication Date
JPS51144182A true JPS51144182A (en) 1976-12-10

Family

ID=13372839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50068409A Pending JPS51144182A (en) 1975-06-05 1975-06-05 Indirectly heated semiconductor unit

Country Status (1)

Country Link
JP (1) JPS51144182A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374368A (en) * 1976-12-15 1978-07-01 Hitachi Ltd Package for semiconductor device
JPS5922392A (en) * 1982-07-06 1984-02-04 スペリ・コ−ポレ−シヨン Integrated circuit package with integrated heating circuit, method of producing same and method of soldering by reflow of same
JPS5972750A (en) * 1982-10-19 1984-04-24 Matsushita Electric Ind Co Ltd Semiconductor package and manufacture of semiconductor device
JPS59136968A (en) * 1983-01-25 1984-08-06 Mitsubishi Electric Corp Hybrid integrated circuit device
JPS63126252A (en) * 1987-06-12 1988-05-30 Hitachi Ltd Manufacture of ultraviolet-erasable programmable romic
JP2010021530A (en) * 2008-07-14 2010-01-28 Honeywell Internatl Inc Packaged die heater
JP2014143360A (en) * 2013-01-25 2014-08-07 Kyocera Corp Electronic component mounting board
WO2015008860A1 (en) * 2013-07-19 2015-01-22 日本電信電話株式会社 Package for electrical element

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374368A (en) * 1976-12-15 1978-07-01 Hitachi Ltd Package for semiconductor device
JPS5936824B2 (en) * 1976-12-15 1984-09-06 株式会社日立製作所 semiconductor equipment
JPS5922392A (en) * 1982-07-06 1984-02-04 スペリ・コ−ポレ−シヨン Integrated circuit package with integrated heating circuit, method of producing same and method of soldering by reflow of same
JPS5972750A (en) * 1982-10-19 1984-04-24 Matsushita Electric Ind Co Ltd Semiconductor package and manufacture of semiconductor device
JPS59136968A (en) * 1983-01-25 1984-08-06 Mitsubishi Electric Corp Hybrid integrated circuit device
JPS63126252A (en) * 1987-06-12 1988-05-30 Hitachi Ltd Manufacture of ultraviolet-erasable programmable romic
JP2010021530A (en) * 2008-07-14 2010-01-28 Honeywell Internatl Inc Packaged die heater
JP2014143360A (en) * 2013-01-25 2014-08-07 Kyocera Corp Electronic component mounting board
WO2015008860A1 (en) * 2013-07-19 2015-01-22 日本電信電話株式会社 Package for electrical element
JP2015023154A (en) * 2013-07-19 2015-02-02 日本電信電話株式会社 Package of electric element

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