JPS5571646A - Glass composition - Google Patents
Glass compositionInfo
- Publication number
- JPS5571646A JPS5571646A JP14427778A JP14427778A JPS5571646A JP S5571646 A JPS5571646 A JP S5571646A JP 14427778 A JP14427778 A JP 14427778A JP 14427778 A JP14427778 A JP 14427778A JP S5571646 A JPS5571646 A JP S5571646A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- compsn
- thermal expansion
- expansion coefficient
- charge density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Glass Compositions (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To enable the surface charge density and thermal expansion coefficient of glass to be accurately controlled to desired values by mixing ZnO-B2O3-SiO2 three- component glass of different compsn. ratios into the glass.
CONSTITUTION: ZnO-B2O3-SiO2 three-component glass remarkably changes its surface charge density and thermal expansion coefficient according to its compsn. ratio. By utilizing this property a glass compsn. for passivation of a semiconductor element, a glass-coated semiconductor, etc. can be controlled to desired values in surface charge density and thermal expansion coefficient by mixing the glass of different compsn. ratios. By this method a glass compsn. having desired press. resistance, etc. is obtd. in a high yield.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14427778A JPS5571646A (en) | 1978-11-24 | 1978-11-24 | Glass composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14427778A JPS5571646A (en) | 1978-11-24 | 1978-11-24 | Glass composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5571646A true JPS5571646A (en) | 1980-05-29 |
Family
ID=15358336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14427778A Pending JPS5571646A (en) | 1978-11-24 | 1978-11-24 | Glass composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5571646A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164342A (en) * | 1988-10-14 | 1992-11-17 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
| US5258335A (en) * | 1988-10-14 | 1993-11-02 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
| WO2013168236A1 (en) * | 2012-05-08 | 2013-11-14 | 新電元工業株式会社 | Resin-sealed semiconductor device and production method for resin-sealed semiconductor device |
| JP5827398B2 (en) * | 2012-05-08 | 2015-12-02 | 新電元工業株式会社 | Method for manufacturing glass composition for protecting semiconductor junction, method for manufacturing semiconductor device, and semiconductor device |
| JPWO2013168623A1 (en) * | 2012-05-08 | 2016-01-07 | 新電元工業株式会社 | Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device |
-
1978
- 1978-11-24 JP JP14427778A patent/JPS5571646A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164342A (en) * | 1988-10-14 | 1992-11-17 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
| US5258335A (en) * | 1988-10-14 | 1993-11-02 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
| WO2013168236A1 (en) * | 2012-05-08 | 2013-11-14 | 新電元工業株式会社 | Resin-sealed semiconductor device and production method for resin-sealed semiconductor device |
| JP5827398B2 (en) * | 2012-05-08 | 2015-12-02 | 新電元工業株式会社 | Method for manufacturing glass composition for protecting semiconductor junction, method for manufacturing semiconductor device, and semiconductor device |
| JP5827397B2 (en) * | 2012-05-08 | 2015-12-02 | 新電元工業株式会社 | Resin-sealed semiconductor device and method for manufacturing resin-sealed semiconductor device |
| JPWO2013168623A1 (en) * | 2012-05-08 | 2016-01-07 | 新電元工業株式会社 | Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device |
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