JPS6464341A - Photosemiconductor package - Google Patents

Photosemiconductor package

Info

Publication number
JPS6464341A
JPS6464341A JP62220432A JP22043287A JPS6464341A JP S6464341 A JPS6464341 A JP S6464341A JP 62220432 A JP62220432 A JP 62220432A JP 22043287 A JP22043287 A JP 22043287A JP S6464341 A JPS6464341 A JP S6464341A
Authority
JP
Japan
Prior art keywords
package
photosemiconductor
module
stem
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62220432A
Other languages
Japanese (ja)
Inventor
Akira Okamoto
Nobuyoshi Horigome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62220432A priority Critical patent/JPS6464341A/en
Publication of JPS6464341A publication Critical patent/JPS6464341A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To facilitate the fixing of this package on a photosemiconductor module, by mounting a welding projection on one part of a metallic package and next by using an electrical resistance welding method to make the package fixable on a housing for use in module. CONSTITUTION:A stem 1, a photosemiconductor element 2, terminals 1a, 3 are used to form this package. The semiconductor element 2 is closely sealed in a cap 4. A welding projection 11 is mounted on one part of the photosemiconductor package 10 composed of the stem 1 and the cap 4. Since this mounting of the welding projection enables the electrical resistance welding of the photosemiconductor package 10 with a housing 5 at the time of assembling the photosemiconductor module, the fixing processes can be performed with good reliability and working processes can be facilitated.
JP62220432A 1987-09-04 1987-09-04 Photosemiconductor package Pending JPS6464341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62220432A JPS6464341A (en) 1987-09-04 1987-09-04 Photosemiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62220432A JPS6464341A (en) 1987-09-04 1987-09-04 Photosemiconductor package

Publications (1)

Publication Number Publication Date
JPS6464341A true JPS6464341A (en) 1989-03-10

Family

ID=16751016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62220432A Pending JPS6464341A (en) 1987-09-04 1987-09-04 Photosemiconductor package

Country Status (1)

Country Link
JP (1) JPS6464341A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175552A (en) * 1991-12-25 1993-07-13 Nec Corp Mounting structure of optical element board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588965B2 (en) * 1975-09-08 1983-02-18 旭化成株式会社 Kokan Concrete

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588965B2 (en) * 1975-09-08 1983-02-18 旭化成株式会社 Kokan Concrete

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175552A (en) * 1991-12-25 1993-07-13 Nec Corp Mounting structure of optical element board

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