JPS5249768A - Method of assembling semiconductor device - Google Patents

Method of assembling semiconductor device

Info

Publication number
JPS5249768A
JPS5249768A JP12581075A JP12581075A JPS5249768A JP S5249768 A JPS5249768 A JP S5249768A JP 12581075 A JP12581075 A JP 12581075A JP 12581075 A JP12581075 A JP 12581075A JP S5249768 A JPS5249768 A JP S5249768A
Authority
JP
Japan
Prior art keywords
semiconductor device
assembling semiconductor
tratment
flexed
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12581075A
Other languages
Japanese (ja)
Inventor
Hiroshi Mugitani
Kazuya Takahashi
Yoshiaki Sano
Yoshinori Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12581075A priority Critical patent/JPS5249768A/en
Publication of JPS5249768A publication Critical patent/JPS5249768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform simple, highly accurate and efficient positioning, by opposing the ends of flexed lead connector parts to the window holes of a jig, inserting a chip attached with a solder film into the hole, and making given tratment.
JP12581075A 1975-10-18 1975-10-18 Method of assembling semiconductor device Pending JPS5249768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12581075A JPS5249768A (en) 1975-10-18 1975-10-18 Method of assembling semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12581075A JPS5249768A (en) 1975-10-18 1975-10-18 Method of assembling semiconductor device

Publications (1)

Publication Number Publication Date
JPS5249768A true JPS5249768A (en) 1977-04-21

Family

ID=14919472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12581075A Pending JPS5249768A (en) 1975-10-18 1975-10-18 Method of assembling semiconductor device

Country Status (1)

Country Link
JP (1) JPS5249768A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472470U (en) * 1977-10-31 1979-05-23
JPS62162839U (en) * 1986-04-04 1987-10-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472470U (en) * 1977-10-31 1979-05-23
JPS62162839U (en) * 1986-04-04 1987-10-16

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