JPS574146A - Package of semiconductor device - Google Patents
Package of semiconductor deviceInfo
- Publication number
- JPS574146A JPS574146A JP7799480A JP7799480A JPS574146A JP S574146 A JPS574146 A JP S574146A JP 7799480 A JP7799480 A JP 7799480A JP 7799480 A JP7799480 A JP 7799480A JP S574146 A JPS574146 A JP S574146A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- sealed
- glass
- convex part
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To improve a physical strength of a lead wire against a mechanical stress in a package in which a metallic mount for installing some component elements and outer lead wires are sealed by glass, by a method wherein either a convex part or a concave part is arranged at the sealed part of the lead wire. CONSTITUTION:A through-pass hole is arranged in the metallic mount 1 on which top surface some component elements are mounted. Outer lead wire 2 for use in drawing out an electrode of the element is passed through the through-pass hole, both the metallic mount 1 and the lead wire 2 are sealed by the sealing glass 3 and then fixed thereto. At the part 4 where the lead wire 2 is sealed with glass is provided either a convex part 6 or a concave part. Thereby, the lead wire 2 may be strongly fixed to the glass 3 at the convex part 6, and their adhering area is substantially made with, so that it is possible to prevent a determination of air-tightness caused by a mechanical stress etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7799480A JPS574146A (en) | 1980-06-10 | 1980-06-10 | Package of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7799480A JPS574146A (en) | 1980-06-10 | 1980-06-10 | Package of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS574146A true JPS574146A (en) | 1982-01-09 |
Family
ID=13649360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7799480A Pending JPS574146A (en) | 1980-06-10 | 1980-06-10 | Package of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS574146A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008294258A (en) * | 2007-05-25 | 2008-12-04 | Panasonic Corp | Electronic chip mounting base and manufacturing method therefor, and electronic device |
-
1980
- 1980-06-10 JP JP7799480A patent/JPS574146A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008294258A (en) * | 2007-05-25 | 2008-12-04 | Panasonic Corp | Electronic chip mounting base and manufacturing method therefor, and electronic device |
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