JPS6476744A - Resin sealed semiconductor device - Google Patents
Resin sealed semiconductor deviceInfo
- Publication number
- JPS6476744A JPS6476744A JP23220187A JP23220187A JPS6476744A JP S6476744 A JPS6476744 A JP S6476744A JP 23220187 A JP23220187 A JP 23220187A JP 23220187 A JP23220187 A JP 23220187A JP S6476744 A JPS6476744 A JP S6476744A
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- resin
- becomes
- edge part
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 5
- 229920005989 resin Polymers 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title 1
- 239000012212 insulator Substances 0.000 abstract 3
- 239000003989 dielectric material Substances 0.000 abstract 2
- 238000004299 exfoliation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To decrease stress concentration of resin generating in the edge part of an insulator, and prevent the resin crack from the insulator edge part, by making dimensions of the shorter side of an electric insulator between an element and a lead frame, smaller than those of the shorter side of an element. CONSTITUTION:The short side dimension of an electric insulator is made smaller than the shorter side dimensions of an element. When the dimension of an insulator 7 becomes smaller than that of an element, stress concentration at a point (a) becomes discontinuously small, and the stress concentration almost vanishes. Then, on the contrary, the stress at a point (b) of the edge part of the element 1 becomes large. But, if only the exfoliation of resin 5 from the element 1 does not occur, the generating stress does not becomes so large, and it can be restrained at a level in which resin crack does not occur.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62232201A JPH0828462B2 (en) | 1987-09-18 | 1987-09-18 | Resin-sealed semiconductor device |
KR1019880011746A KR890005868A (en) | 1987-09-18 | 1988-09-12 | Semiconductor device and manufacturing method |
US07/536,932 US4987474A (en) | 1987-09-18 | 1990-06-12 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62232201A JPH0828462B2 (en) | 1987-09-18 | 1987-09-18 | Resin-sealed semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7232322A Division JP2651132B2 (en) | 1995-09-11 | 1995-09-11 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6476744A true JPS6476744A (en) | 1989-03-22 |
JPH0828462B2 JPH0828462B2 (en) | 1996-03-21 |
Family
ID=16935570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62232201A Expired - Lifetime JPH0828462B2 (en) | 1987-09-18 | 1987-09-18 | Resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0828462B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009240602A (en) * | 2008-03-31 | 2009-10-22 | Mitsubishi Electric Corp | Vacuum cleaner |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6072236A (en) * | 1983-09-28 | 1985-04-24 | Toshiba Corp | Semiconductor device |
JPS61258458A (en) * | 1985-05-13 | 1986-11-15 | Hitachi Ltd | Resin-sealed ic |
-
1987
- 1987-09-18 JP JP62232201A patent/JPH0828462B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6072236A (en) * | 1983-09-28 | 1985-04-24 | Toshiba Corp | Semiconductor device |
JPS61258458A (en) * | 1985-05-13 | 1986-11-15 | Hitachi Ltd | Resin-sealed ic |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009240602A (en) * | 2008-03-31 | 2009-10-22 | Mitsubishi Electric Corp | Vacuum cleaner |
Also Published As
Publication number | Publication date |
---|---|
JPH0828462B2 (en) | 1996-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5521128A (en) | Lead frame used for semiconductor device and its assembling | |
GB2017408B (en) | Structured copper strain buffer and semiconductor device structure incorporating the buffer | |
JPS6476744A (en) | Resin sealed semiconductor device | |
JPS5294074A (en) | Leading-in frame | |
JPS564255A (en) | Semiconductor device sealed up with resin | |
JPS5558557A (en) | Resin mold type electronic component and lead frame used therefor | |
JPS5357971A (en) | Production of semiconductor device | |
JPS5351971A (en) | Manufacture for semiconductor | |
JPS51120685A (en) | Semtconductor element | |
JPS54124680A (en) | Semiconductor device | |
JPS5315762A (en) | Production of semiconductor device | |
JPS5735331A (en) | Semiconductor device | |
JPS5710954A (en) | Semiconductor device | |
JPS52127759A (en) | Resin-seal type semiconductor unit | |
JPS5414676A (en) | Carrier tape and electronic parts using it | |
JPS5610950A (en) | Lead wire for semiconductor device | |
JPS5336655A (en) | Semiconductor integrated circuit | |
JPS5624961A (en) | Lead frame for semiconductor device | |
JPS5478663A (en) | Resin-sealed semiconductor device | |
JPS5363980A (en) | Semiconductor device | |
JPS51132768A (en) | Resin-mold transistor | |
JPS5586142A (en) | Glass mold type semiconductor device | |
JPS526082A (en) | Production method of resin-seal type semiconductor device | |
JPS53124975A (en) | Semiconductor device | |
JPS54101265A (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 12 Free format text: PAYMENT UNTIL: 20080321 |