JPS6476744A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS6476744A
JPS6476744A JP23220187A JP23220187A JPS6476744A JP S6476744 A JPS6476744 A JP S6476744A JP 23220187 A JP23220187 A JP 23220187A JP 23220187 A JP23220187 A JP 23220187A JP S6476744 A JPS6476744 A JP S6476744A
Authority
JP
Japan
Prior art keywords
insulator
resin
becomes
edge part
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23220187A
Other languages
Japanese (ja)
Other versions
JPH0828462B2 (en
Inventor
Sueo Kawai
Asao Nishimura
Makoto Kitano
Hideo Miura
Akihiro Yaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62232201A priority Critical patent/JPH0828462B2/en
Priority to KR1019880011746A priority patent/KR890005868A/en
Publication of JPS6476744A publication Critical patent/JPS6476744A/en
Priority to US07/536,932 priority patent/US4987474A/en
Publication of JPH0828462B2 publication Critical patent/JPH0828462B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To decrease stress concentration of resin generating in the edge part of an insulator, and prevent the resin crack from the insulator edge part, by making dimensions of the shorter side of an electric insulator between an element and a lead frame, smaller than those of the shorter side of an element. CONSTITUTION:The short side dimension of an electric insulator is made smaller than the shorter side dimensions of an element. When the dimension of an insulator 7 becomes smaller than that of an element, stress concentration at a point (a) becomes discontinuously small, and the stress concentration almost vanishes. Then, on the contrary, the stress at a point (b) of the edge part of the element 1 becomes large. But, if only the exfoliation of resin 5 from the element 1 does not occur, the generating stress does not becomes so large, and it can be restrained at a level in which resin crack does not occur.
JP62232201A 1987-09-18 1987-09-18 Resin-sealed semiconductor device Expired - Lifetime JPH0828462B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62232201A JPH0828462B2 (en) 1987-09-18 1987-09-18 Resin-sealed semiconductor device
KR1019880011746A KR890005868A (en) 1987-09-18 1988-09-12 Semiconductor device and manufacturing method
US07/536,932 US4987474A (en) 1987-09-18 1990-06-12 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62232201A JPH0828462B2 (en) 1987-09-18 1987-09-18 Resin-sealed semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7232322A Division JP2651132B2 (en) 1995-09-11 1995-09-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6476744A true JPS6476744A (en) 1989-03-22
JPH0828462B2 JPH0828462B2 (en) 1996-03-21

Family

ID=16935570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62232201A Expired - Lifetime JPH0828462B2 (en) 1987-09-18 1987-09-18 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH0828462B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009240602A (en) * 2008-03-31 2009-10-22 Mitsubishi Electric Corp Vacuum cleaner

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072236A (en) * 1983-09-28 1985-04-24 Toshiba Corp Semiconductor device
JPS61258458A (en) * 1985-05-13 1986-11-15 Hitachi Ltd Resin-sealed ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072236A (en) * 1983-09-28 1985-04-24 Toshiba Corp Semiconductor device
JPS61258458A (en) * 1985-05-13 1986-11-15 Hitachi Ltd Resin-sealed ic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009240602A (en) * 2008-03-31 2009-10-22 Mitsubishi Electric Corp Vacuum cleaner

Also Published As

Publication number Publication date
JPH0828462B2 (en) 1996-03-21

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