JPS5586142A - Glass mold type semiconductor device - Google Patents

Glass mold type semiconductor device

Info

Publication number
JPS5586142A
JPS5586142A JP15859178A JP15859178A JPS5586142A JP S5586142 A JPS5586142 A JP S5586142A JP 15859178 A JP15859178 A JP 15859178A JP 15859178 A JP15859178 A JP 15859178A JP S5586142 A JPS5586142 A JP S5586142A
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
type semiconductor
glass mold
mold type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15859178A
Other languages
Japanese (ja)
Inventor
Kensuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15859178A priority Critical patent/JPS5586142A/en
Publication of JPS5586142A publication Critical patent/JPS5586142A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce void generation by chamfering to a required extent the shoulders of an electrode on the fixing side of a semiconductor pellet.
CONSTITUTION: A jig used for adhering a semiconductor pellet and an electrode has an inside diameter larger than the maximum diameter of the two. Therefore, a step is formed between the electrode and the pellet when assembled. If corner radii 22a are made on the shoulders of an electrode 22, void generation is reduced at the time of glass sealing, and if radii larger than about a half of the step are made, void generation can be reduced extremely and the reliability of the device is improved.
COPYRIGHT: (C)1980,JPO&Japio
JP15859178A 1978-12-25 1978-12-25 Glass mold type semiconductor device Pending JPS5586142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15859178A JPS5586142A (en) 1978-12-25 1978-12-25 Glass mold type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15859178A JPS5586142A (en) 1978-12-25 1978-12-25 Glass mold type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5586142A true JPS5586142A (en) 1980-06-28

Family

ID=15675022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15859178A Pending JPS5586142A (en) 1978-12-25 1978-12-25 Glass mold type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5586142A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11994201B2 (en) 2020-12-28 2024-05-28 Kubota Corporation Power transmission device for work vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11994201B2 (en) 2020-12-28 2024-05-28 Kubota Corporation Power transmission device for work vehicle

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