JPS5624961A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5624961A
JPS5624961A JP10090279A JP10090279A JPS5624961A JP S5624961 A JPS5624961 A JP S5624961A JP 10090279 A JP10090279 A JP 10090279A JP 10090279 A JP10090279 A JP 10090279A JP S5624961 A JPS5624961 A JP S5624961A
Authority
JP
Japan
Prior art keywords
lead wires
inner lead
lead frame
insulator
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10090279A
Other languages
Japanese (ja)
Inventor
Hiroshi Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10090279A priority Critical patent/JPS5624961A/en
Publication of JPS5624961A publication Critical patent/JPS5624961A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To prevent shortcircuit of inner lead wires and of a semiconductor element fixing portion with the lead wires and the deformation of the lead wires by forming an insulator in the gap between the fixing portion and the lead wires and between each of the inner lead wires. CONSTITUTION:When an insulator 3 is filled in the same thickness as the lead frame between inner lead wires 1 and 4 and between the inner lead wires 1, 4 and a semiconductor element fixing portion 2, it can prevent the deformation of the inner lead wires and the shortcircuit of the adjacent lead wires. When the insulator is fixed at the element and is retained between the sealed resins, it is advantageous.
JP10090279A 1979-08-07 1979-08-07 Lead frame for semiconductor device Pending JPS5624961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10090279A JPS5624961A (en) 1979-08-07 1979-08-07 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10090279A JPS5624961A (en) 1979-08-07 1979-08-07 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5624961A true JPS5624961A (en) 1981-03-10

Family

ID=14286269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10090279A Pending JPS5624961A (en) 1979-08-07 1979-08-07 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5624961A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187842A (en) * 1988-01-21 1989-07-27 Toshiba Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187842A (en) * 1988-01-21 1989-07-27 Toshiba Corp Manufacture of semiconductor device

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