JPS5322364A - Semi conductor element sealing package - Google Patents
Semi conductor element sealing packageInfo
- Publication number
- JPS5322364A JPS5322364A JP9681776A JP9681776A JPS5322364A JP S5322364 A JPS5322364 A JP S5322364A JP 9681776 A JP9681776 A JP 9681776A JP 9681776 A JP9681776 A JP 9681776A JP S5322364 A JPS5322364 A JP S5322364A
- Authority
- JP
- Japan
- Prior art keywords
- element sealing
- sealing package
- conductor element
- semi conductor
- increase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To achieve the increase in mechanical strength and the increase in creeping distance at glass part by providing a metal ring between an electrode lead and the hole provided to an electrode member and sealing therebetween with glass layers, forming element sealing package.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9681776A JPS5322364A (en) | 1976-08-13 | 1976-08-13 | Semi conductor element sealing package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9681776A JPS5322364A (en) | 1976-08-13 | 1976-08-13 | Semi conductor element sealing package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5322364A true JPS5322364A (en) | 1978-03-01 |
Family
ID=14175126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9681776A Pending JPS5322364A (en) | 1976-08-13 | 1976-08-13 | Semi conductor element sealing package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5322364A (en) |
-
1976
- 1976-08-13 JP JP9681776A patent/JPS5322364A/en active Pending
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