JPS5322364A - Semi conductor element sealing package - Google Patents

Semi conductor element sealing package

Info

Publication number
JPS5322364A
JPS5322364A JP9681776A JP9681776A JPS5322364A JP S5322364 A JPS5322364 A JP S5322364A JP 9681776 A JP9681776 A JP 9681776A JP 9681776 A JP9681776 A JP 9681776A JP S5322364 A JPS5322364 A JP S5322364A
Authority
JP
Japan
Prior art keywords
element sealing
sealing package
conductor element
semi conductor
increase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9681776A
Other languages
Japanese (ja)
Inventor
Yuji Shinno
Toshitaka Yamamoto
Shuroku Sakurada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9681776A priority Critical patent/JPS5322364A/en
Publication of JPS5322364A publication Critical patent/JPS5322364A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To achieve the increase in mechanical strength and the increase in creeping distance at glass part by providing a metal ring between an electrode lead and the hole provided to an electrode member and sealing therebetween with glass layers, forming element sealing package.
COPYRIGHT: (C)1978,JPO&Japio
JP9681776A 1976-08-13 1976-08-13 Semi conductor element sealing package Pending JPS5322364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9681776A JPS5322364A (en) 1976-08-13 1976-08-13 Semi conductor element sealing package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9681776A JPS5322364A (en) 1976-08-13 1976-08-13 Semi conductor element sealing package

Publications (1)

Publication Number Publication Date
JPS5322364A true JPS5322364A (en) 1978-03-01

Family

ID=14175126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9681776A Pending JPS5322364A (en) 1976-08-13 1976-08-13 Semi conductor element sealing package

Country Status (1)

Country Link
JP (1) JPS5322364A (en)

Similar Documents

Publication Publication Date Title
JPS5412761A (en) Display device
JPS52116074A (en) Electronic part
JPS5322364A (en) Semi conductor element sealing package
JPS5357971A (en) Production of semiconductor device
JPS5348671A (en) Electrode structure of semiconductor element
JPS5380183A (en) Semiconductor device
JPS5362471A (en) Semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS5258391A (en) Piezo electric element
JPS5353965A (en) Semiconductor device and its production
JPS52103954A (en) Semiconductor device
JPS547272A (en) Semiconductor package
JPS5229173A (en) Sealed terminal for cold pressure junction
JPS52149067A (en) Glass mold type semiconductor device
JPS5231691A (en) Semiconductor luminous device
JPS5345969A (en) Schottky barrier semiconductor device
JPS5624961A (en) Lead frame for semiconductor device
JPS5710954A (en) Semiconductor device
JPS5384556A (en) Semiconductor device
JPS52127760A (en) Glass-seal type semiconductor unit
JPS54973A (en) Semiconductor element
JPS52142968A (en) Assembling method of semiconductor devices
JPS51137375A (en) Semi conductor device
JPS528489A (en) Wire contact element with unnecessity of soldering
JPS52144983A (en) Semiconductor device