JPS56161660A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56161660A
JPS56161660A JP6475980A JP6475980A JPS56161660A JP S56161660 A JPS56161660 A JP S56161660A JP 6475980 A JP6475980 A JP 6475980A JP 6475980 A JP6475980 A JP 6475980A JP S56161660 A JPS56161660 A JP S56161660A
Authority
JP
Japan
Prior art keywords
base
lead wire
sealed
glass
tensile strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6475980A
Other languages
Japanese (ja)
Inventor
Yukio Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6475980A priority Critical patent/JPS56161660A/en
Publication of JPS56161660A publication Critical patent/JPS56161660A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To strengthen the tensile strength of the lead wires of an airtightly sealed element by bending the external lead wire insulated and sealed through a metallic base in parallel with the element carrying surface, sealing the lead wire with glass, and thereby connecting the surface of the base with the wire. CONSTITUTION:In an airtightly sealed package, the end 12' of an external lead wire 12 at the inside of a container to be sealed with glass with a metallic base 11 carrying an element is so bent as to confront the surface of the base 11 and is airtightly sealed with glass 13. Thus, the lead wire 12 can be strengthened against the mechanical stress and particularly the tensile strength by connecting to the surface of the base 11, thereby preventing the deterioration of the airtightness due to the damage of the sealing part.
JP6475980A 1980-05-16 1980-05-16 Semiconductor device Pending JPS56161660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6475980A JPS56161660A (en) 1980-05-16 1980-05-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6475980A JPS56161660A (en) 1980-05-16 1980-05-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56161660A true JPS56161660A (en) 1981-12-12

Family

ID=13267419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6475980A Pending JPS56161660A (en) 1980-05-16 1980-05-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56161660A (en)

Similar Documents

Publication Publication Date Title
JPS57119250A (en) Oxygen sensor element holder
JPS56161660A (en) Semiconductor device
JPS56142657A (en) Resin-sealed semiconductor device
JPS56100436A (en) Manufacture of semiconductor element
JPS5721847A (en) Semiconductor device
JPS5723849A (en) Gas detector and its manufacture
JPS6482554A (en) Resin-sealed semiconductor device
JPS5522711A (en) Photo semiconductor element package
JPS5623755A (en) Assembly of semiconductor device
JPS577953A (en) Semiconductor device
GB783923A (en) Improvements in or relating to semi-conductor devices
JPS6412560A (en) Semiconductor device
JPS6417458A (en) Semiconductor package
JPS57210654A (en) Semiconductor device and manufacture thereof
JPS5610946A (en) Manufacture of resin sealeded type semiconductor device
JPS55166944A (en) Lead frame for semiconductor device
JPS5522889A (en) Manufacturing method of semiconductor device
JPS5629355A (en) Manufacture of resin-sealed semiconductor device
JPS5638845A (en) Semiconductor device
JPS56140652A (en) Diode
JPS5368574A (en) Production of glass sealed semiconductor device
JPS5726459A (en) Glass-sealed semiconductor device
JPS55153360A (en) Glass sealing type semiconductor device
GB851734A (en) Improvements in or relating to semi-conductor devices
JPS59214244A (en) Semiconductor device