JPH0469958A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor device of excellent massproductivity and at low cost by forming a projecting wall such that it surrounds a sensor part which directly contacts with outside atmosphere, and sealing the device excluding the region surrounded by this projecting wall. CONSTITUTION:Parts others than the surface of the sensor part 2 surrounded by a projecting wall 10 are all sealed by a mold part 11. The change of temperature, pressure, etc., reaches the sensor part 2 passing through the region being surrounded by the projecting wall 10 but not sealed by resin, and is detected by this sensor part 2, and the electric signal accompanying this is transmitted to an outside circuit through a gold wire and an outer lead 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device including a sensor section that senses light and pressure on the surface of a semiconductor element.

[Conventional technology]

FIG. 3 is a cross-sectional view showing this type of conventional semiconductor device. In this figure, 1 is a semiconductor element, which is provided with a sensor section 2. As shown in FIG. 3 is a guide pad for fixing the semiconductor element 1; 4 is an outer lead for making contact with an external circuit; 5 is an outer lead for making contact with an external circuit;
8 is a gold wire that electrically connects the semiconductor element 1 and the outer lead 4; 6 is a cap of the package; 7 is a base;
9 is an adhesive for bonding the cap 6 and the base 7 together, and 9 is a window for passing light and heat from the outside to the sensor section 2.

Next, the operation will be explained.

Changes in light, pressure, etc. taken in through the window 9 are detected by the sensor section 2, and the accompanying electrical signals are sent to the gold wire 5. The signal is output to the external circuit through the outer lead 4.

[Problem to be solved by the invention]

Conventional semiconductor devices equipped with the sensor section 2 and packaged in this way require the sensor section 2 to come into direct contact with the object to be detected, such as light, and in order to reduce stress on the sensor section 2. A hollow package consisting of the base 7 must be used, which is expensive, and since each package must be bonded, there are problems such as low mass productivity.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a semiconductor device in which parts other than the sensor part are sealed with resin by l-transfer molding.

[Means to solve the problem]

In the semiconductor device according to the present invention, a protruding wall is formed so as to surround the sensor section of a semiconductor element that requires direct contact with an external atmosphere and is provided with a sensor section on its surface, and The area other than the area is sealed with mold resin.

[Effect]

In this invention, a protruding wall is formed to surround the sensor portion that is in direct contact with the external atmosphere, and the area other than the area surrounded by the protruding wall is sealed with resin, thereby achieving mass production and cost reduction.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the semiconductor device of the present invention. In FIG. 1, the same reference numerals as in FIG. 3 indicate the same parts, and 10 is a protruding wall for forming a hollow portion formed around the sensor section 2, and is made of silicone resin or the like.

Reference numeral 11 indicates a molded portion formed by transfer molding.

According to the configuration shown in FIG. 1, the entire surface of the processor section 2 other than the surface surrounded by the projecting wall 10 is sealed by the mold section 11. Changes in temperature, pressure, etc. reach the sensor section 2 through an area surrounded by the protrusion wall 10 and not sealed with resin, and
This sensor section 2 detects the electric signal, and the accompanying electric signal is sent to the gold wire 5. The signal is transmitted to the external circuit through the outer lead 4.

Next, the manufacturing method will be explained with reference to FIGS. 2(a) to 2(d).

In FIG. 2, 12 is an upper mold for transfer molding;
13 is a lower mold, and 14 is a flowing malt resin.

First, as shown in FIG. 2(a), after bonding the semiconductor element 1 onto the adhesive pad 3, the auteride 4 and the semiconductor element 1 are bonded using the gold wire 5.

Subsequently, as shown in FIG. 2(b), a protruding wall 10 is formed to surround the sensor section 2 of the semiconductor element 1. Next, as shown in FIG. 2(C), the upper and lower molds 12 and 13 for transfer molding are sealed, and the molds are clamped as shown in FIG. 2(d). At this time, the upper end of the protruding wall 10 comes into contact with the cavity surface of the upper mold, and the hollow part 10 that covers the processor part 2
A is formed. Next, transfer the mold resin into the clamped upper and lower molds 13.1a to complete the molding. This completes the semiconductor device shown in FIG.

In the above embodiment, the protruding wall 10 was formed after wiring, but it may be formed when the element is in the Ueno 1 state.

〔Effect of the invention〕

As explained above, in the invention of B, a protruding wall is formed to surround the sensor part of a semiconductor element that has a sensor part that requires direct contact with the external atmosphere on the surface, and the protruding wall surrounds the semiconductor element. Since the area other than the area covered with IiM resin is sealed with mold resin, it can be mold-sealed by transfer molding without using a special hollow rose cane, making it possible to mass-produce a semiconductor device equipped with a sensor part that comes into direct contact with the external atmosphere. It has an effect that can be obtained at low cost.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a semiconductor device according to an embodiment of the present invention, FIG. 2 is a process sectional view showing a method for manufacturing a semiconductor device according to an embodiment of the invention, and FIG. 3 is a conventional semiconductor device. FIG. In the figure, 1 is a semiconductor element, 2 is a sensor section, 3 is a guide pad, 4 is an outer lead, 5 is a gold wire, 1Q is a protrusion wall,
10a is a hollow part, 11 is a mold part, 12 is an upper mold, 1
3 is a lower mold, and 14 is a flowing mold resin. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Mold publication in Figure Figure Figure Figure 1m - Procedural amendment (self-motivated) Date of Heisei

Claims (1)

[Claims] A protruding wall is formed to surround the sensor part of a semiconductor element having a sensor part that requires direct contact with an external atmosphere on its surface, and the area other than the area surrounded by the protruding wall is resin-sealed with mold resin. A semiconductor device characterized by: