KR101066175B1 - Electronic device and method for manufacturing electronic device - Google Patents

Electronic device and method for manufacturing electronic device Download PDF

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Publication number
KR101066175B1
KR101066175B1 KR1020080061544A KR20080061544A KR101066175B1 KR 101066175 B1 KR101066175 B1 KR 101066175B1 KR 1020080061544 A KR1020080061544 A KR 1020080061544A KR 20080061544 A KR20080061544 A KR 20080061544A KR 101066175 B1 KR101066175 B1 KR 101066175B1
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KR
South Korea
Prior art keywords
frame member
resin
electronic device
resin layer
sealing
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KR1020080061544A
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Korean (ko)
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KR20090012055A (en
Inventor
겐지 우치다
고키 히라사와
Original Assignee
르네사스 일렉트로닉스 가부시키가이샤
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Publication of KR20090012055A publication Critical patent/KR20090012055A/en
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Publication of KR101066175B1 publication Critical patent/KR101066175B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

An electronic device is provided which reduces contamination and improves reliability in a functional unit of an exposed device, and a method for manufacturing the same is also provided. The electronic device includes a light receiving element, a frame member composed of a first resin provided to surround a photoreceptor of the light receiving element, and a sealed resin layer composed of a second resin and filling the periphery of the frame member. The photo acceptor unit of the light receiving element is exposed to the space surrounded by the frame member. The upper surface of the frame member and the upper surface of the sealing resin layer form a common plane or the upper surface of the frame member is higher than the upper surface of the sealing resin layer.

Frame member, height, modulus of elasticity, thickness, resin, contamination, common plane

Description

Electronic device and method for manufacturing electronic device

The present invention relates to an electronic device and a method for manufacturing the electronic device.

This application is based on Japanese Patent Application Nos. 2007-195683 and 2007-321587, the contents of which are incorporated herein by reference.

Electronic devices with exposed portions of functional devices have recently been developed for practical use to meet the needs of technological advances. The development of this type of device requires the need to reduce the weakening of the optical signal and the electronic device that converts the optical signal into an electronic signal and directly introduces the optical signal coming from the outside of the electronic device into the photo acceptance of the optical device. The free mounting of leads by using black resin is based on the improved moisture resistance of the electronics to meet the reflow conditions. In particular, in an optical recording technology using blue light such as an optical signal, an epoxy resin used in a light receiving device for converting an optical signal into an electrical signal is degraded by blue light in an insufficient condition, and thus the epoxy resin is in an optical path. The above-mentioned electronic device having an exposed portion in functional elements removed from is obtained. In addition, an electronic device having such a structure includes movable elements in a functional element such as a microelectromechanical system (MEMS), an electroacoustic filter, and the like, and an electronic device of the type described above has a movable element that cannot be sealed with a resin. Or it is expected to be employed for solid state image sensing devices for cameras.

12 is a cross-sectional view showing a solid state image device disclosed in Japanese Unexamined Patent Publication No. 2001-257334. As shown in FIG. 12, the solid state image device includes an opening formed only in a solid state image sensing device chip 81 and a photoacceptance unit (not shown) attached to the solid state image sensing device chip 81 with an adhesive 85. An epoxy resin sheet 84 having an 83 and an adhesive 85 are attached to the epoxy resin sheet 84 and provided with a transmissive member 86 provided as a flat portion. The solid state image sensing device chip 81 is die bonded to the package or substrate 810 and a connection between the pad portion 81a of the solid state image sensing device chip 81 and the package or substrate 810 is for practical use. After the bonding wire 811 is formed, the peripheral portion including the bonding wire connecting portion except the sealing chamber is packaged into the sealing resin 812. The penetrating member 86 functions as a protective film for the photo acceptor.

13 and 14 are cross-sectional views showing the solid state image device disclosed in Japanese Unexamined Patent Application Publication No. 07-202152. As shown in Fig. 13, the solid state imager includes a solid state image sensing device chip 91, and only the photoacceptance region 92 provided with the microlens 93 is sealed around with a transparent sealing member 94. do. The solid state image sensing device chip 91 is directly attached to the substrate 921 by die bonding, and the electrodes of the solid state image sensing device chip 91 are connected to the electrodes of the substrate 921 by the bonding wire 922. Then, the chip surface except for the transparent sealing member 94 provided only at the portion connected to the photo-resistance region 92 and the bonding wire 922 of the solid state image sensing device chip 91 is a sealing resin 923. Is sealed. As shown in FIG. 14, the transparent sealing member 911 has a flat portion 911a and a frame 911b and is configured to form a flat portion 911a on the upper surface of the frame 911b. The transparent sealing member 911 provides protection of the photoresistance region 92 and the flat portion 911a functioning as a protective film. The transparent sealing member 911 shown in FIG. 14 corresponds to the transparent sealing member 94 shown in FIG.

In addition, the top surface of the sealing resin 812 is positioned higher than the top surface of the epoxy resin sheet 84 in the solid state imager described with reference to FIG. 12. Accordingly, the side surface of the transparent member 86 formed on the epoxy resin sheet 84 is covered with the sealing resin 812. This provides the attachment of the sealing resin 812 to the side of the transparent member 86, and therefore, it is difficult for the transparent member 86 to peel off.

In the solid state imager described with reference to Figs. 13 and 14, the upper surface of the sealing resin 923 is located higher than the upper surface of the frame 911b. Since the side of the transparent sealing member 94 is covered with a sealing resin 923 as shown in FIG. 13, the side of the flat portion 911a shown in FIG. 14 is covered with a sealing resin 923 (not shown). This causes the side surface of the flat portion 911a to be attached to the sealing resin 923, and makes it difficult to peel off the flat portion 911a. In addition, since the size of the surface for attachment of the flat portion 911a is limited by the size of the upper surface of the frame 911b, it is difficult to provide a large area for attachment to achieve a strong attachment force.

According to an aspect of the invention, the device; A frame member composed of a first resin provided to surround the functional unit of the device; And a resin layer composed of a second resin and filling the periphery of the frame member, wherein the functional unit of the element is exposed to a space surrounded by the frame member and the upper surface of the frame member and the upper surface of the resin layer form a common surface or the frame. An electronic device is provided in which the upper surface of the member is located higher than the upper surface of the resin layer.

In such an electronic device, the upper surface of the frame member and the upper surface of the resin layer are coplanar, or the upper surface of the frame member is positioned higher than the upper surface of the resin layer. More specifically, it is easy to attach and remove the protective film covering the upper surface of the frame member and the upper surface of the resin layer, thereby reducing contamination in the functional unit and improving reliability in the electronic device.

According to another aspect of the invention, the device; A frame member composed of a first resin provided to surround the functional unit of the device; And a resin layer composed of a second resin and filling the periphery of the frame member, wherein the functional unit of the element is exposed to a space surrounded by the frame member and the upper surface of the frame member is positioned higher than the upper surface of the resin layer. do.

In such an electronic device, the upper surface of the frame member is positioned higher than the upper surface of the resin layer. More specifically, attachment and removal of the protective film covering the upper surface of the frame member and the upper surface of the resin layer can be facilitated, the contamination in the functional unit can be reduced, and the reliability of the electronic device is improved.

According to another aspect of the invention, a step of forming a resin film on a wafer having a plurality of elements formed therein; Patterning the resin film to form a frame member composed of the first resin and provided to surround the functional unit of the device; And providing a seal, comprising: installing an element in the base member; Pressing a molding surface for sealing the metal mold to each of the upper surface of the frame member and the lower surface of the base member; Injecting a second resin into a portion of the space surrounded by the molding surface of the sealing metal mold other than the portion surrounded by the frame member to fill the periphery of the frame member. A method is provided for doing this.

The molding surface of the sealed metal mold is pressed against the upper surface of the frame member and the lower surface of the base member, and the molding surface of the sealed metal molds except for the portion surrounded by the frame member to fill the periphery of the frame member in the method for manufacturing the electronic device. Since the second resin is injected into a part of the space surrounded by the upper surface of the frame member, the upper surface of the frame member and the upper surface of the resin layer are formed to be in the same plane. This makes it easy to attach and remove the protective film covering the top surface of the frame member and the top surface of the resin layer so that contamination in the functional unit can be reduced and the reliability of the electronic device is improved. This improves the reliability of the electronic device by a simple process.

According to the present invention, an electronic device can be provided which improves reliability and reduces contamination in functional units of an exposed device, and a method for manufacturing the same is also provided.

The above and other objects, advantages and features of the present invention will become more apparent from the following description of the preferred embodiments in conjunction with the accompanying drawings.

The invention will be explained below with reference to examples. Those skilled in the art will recognize that many other alternative embodiments may be made using the disclosure of the present invention and that the present invention is not limited to the disclosed embodiments for purposes of explanation.

An exemplary implementation of an electronic device and a method of manufacturing the same according to the present invention will be described in detail as follows with reference to the accompanying drawings. In all the drawings, the same reference numerals are added to components commonly shown in the drawings and detailed description thereof will not be repeated.

(Embodiment 1)

1A is a perspective view illustrating an electronic device according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line II ′ of FIG. 1A.

As shown in FIG. 1B, the electronic device 108 includes a light receiving element 101, a frame member 102 formed of a first resin provided to surround a photo acceptor unit (functional unit) 101b of the light receiving element 101, And a sealing resin layer 106 composed of a second resin and filling the periphery of the frame member 102. Although not shown in FIG. 1B, the electronic device 108 further includes a passivation layer covering a top surface of the frame member 102 and a bottom surface formed by the bottom surface of the sealing resin layer 106. In addition, the light receiving element 101 is electrically connected to the lead frames 104 through the metal filaments 105.

The upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 form a common plane. More specifically, since the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 are the same plane, it is easy to attach and remove the protective film covering the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106. Can be done.

The photo acceptor unit 101b provided as a functional unit is formed on the surface of the light receiving element 101. More preferably, the photo acceptor unit 101b is exposed to the surface of the light receiving element 101.

The frame member 102 is provided on the light receiving element 101 and provided to surround the photo acceptor unit 101b. The photo acceptor unit 101b of the light receiving element 101 is exposed to a space surrounded by the frame member 102.

The height of the frame member 102 is designed to be 0.08 mm. The preferred height of the frame member 102 may be 0.05 mm or more, more preferably 0.1 mm or more. The height of this range is the metal filament 105 connected between the lead frame 104 and the sealing metal molds 111a and 111b used in the manufacturing process for the electronic device 108 between the predetermined positions of the light receiving element 101. To prevent contact. Therefore, the sealing metal mold 111a may be strongly attached to the upper surface of the frame member 102 and prevent the sealing resin layer 106 from penetrating into the frame member 102. Here, the height of the frame member 102 may be determined from the upper surface of the light receiving element 101 to the upper surface of the frame member 102 and the same vertical length as the thickness of the resin film composed of the first resin.

The preferred modulus of elasticity of the frame member 102 may be in the range of 1GPa to 6GPa at 20 ° C and in the range of 10MPa to 3GPa at 200 ° C. The range from 1GPa to 6GPa at 20 ° C. provides the function of the frame member 102 as protecting the photo acceptor unit 101b of the electronic device 108. The range from 10 MPa to 3 GPa at 200 ° C is such that when the frame member 102 is pressed into the sealing metal molds 111a and 111b in a process for manufacturing the electronic device 108, the frame member 102 is elastically resilient. While slightly deformed, the photo acceptor unit 101b is protected from external pressure, providing the function of the frame member 102 as a cushion material. Here, the elastic modulus of the frame member 102 refers to the elastic modulus under the condition that the first resin is completely cured by light and heat.

The frame member 102 is formed of a first resin. The first resin is a cured product of a resin material which can be cured by light and heat. Resin materials that can be cured by light and heat include photoreactive resins such as acrylic resins and thermally reactive resins such as epoxy resins.

The sealing resin layer 106 is formed of a second resin. The second resin is a sealing resin used to seal the electronic device 108. The upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 form a flat surface as a whole.

A method for manufacturing the electronic device of the first embodiment will be described with reference to FIGS. 2A to 6B. 2A to 5C are cross-sectional views showing the process for manufacturing the electronic device of the first embodiment. 6A is a perspective view illustrating the electronic device of the first embodiment, and FIG. 6B is a cross-sectional view taken along line II-II 'of FIG. 6A.

First, as shown in FIG. 2A, a wafer 101a is provided. The wafer 101a includes a plurality of light receiving elements 101 formed therein, and the photoacceptor units 101b are exposed to the surface of the light receiving element 101. Here, only two photoreceptors 101 are shown in FIG. 2A between the photoreceptors 101 arranged on the wafer 101a, thus only two photoacceptor units 101b are exposed.

Next, as shown in Fig. 2B, a resin film 102a (first resin) is formed on the light receiving element 101 (wafer 101a). Here, the resin film 102a is a film having a uniform thickness distribution. The reason why such a film-shaped resin film 102a is used is to form a resin film having a uniform film thickness of 0.05 mm or more for the entire wafer 101a. More preferably, in the case where a liquid resin is used for the resin film 102a, a low viscosity resin should be used to obtain a uniform thickness of the film for the entire wafer 101a, which is sufficient film thickness of 0.05 mm due to the low viscosity. Makes it difficult to get. On the contrary, forming a film having a thickness of 0.05 mm or more with respect to the entire wafer 101a with liquid resin requires the use of a high viscosity resin, which increases the resistance to viscosity during the coating process for the wafer 101a due to its high viscosity. It causes many variations in the thickness of the coated film so that one film thickness is difficult to obtain. As a result, the use of the film-form resin film 102a forms the resin film 102a having a uniform film thickness of 0.05 mm or more. In this embodiment, the entire wafer 101a is covered with the resin film 102a. The thickness of the resin film 102a is 0.08 mm. This configuration makes it possible to obtain the frame member 102 having a height of 0.08 mm.

Next, as shown in FIG. 2C, the alignment is performed so that the photo acceptor unit 101b is disposed in the inner diameter of the cylindrical portion formed on the upper surface of the exposure mask 103, and then the frame member 102 is formed. Exposure is performed and the resin film 102a is patterned.

In addition, as shown in FIG. 2D, a printing process is performed to remove portions of the resin film 102a except for the frame members 102, so that the frame members 102 are used to remove the photoacceptor units 101b. It is formed to surround. As described above, the frame members 102 may be formed using a photolithography process. Therefore, the contact of the sealing resin layer 106 to the photoacceptor unit 101b is completely removed, thereby preventing the sealing resin layer 106 from remaining inside the frame member 102. In addition to the above, after the printing process is completed, the resin constituting the frame member 102 is not completely cured, but between the frame member 102 and the wafer 101a, that is, the frame member 102 and the light receiving elements ( 101) Weak attachment force provides weak attachment, not rigid attachment.

Next, a frame member 102 having a wafer 101a thereon is thermally processed to completely cure the frame member 102 and is interposed between the frame member 102 and the wafer 101a, ie, the frame member 102. ) And light receiving elements 101. Since the shape change does not occur in the frame member 102 by the heat treatment, the appearance of the frame member 102 is similar to that of the frame member 102 shown in FIG. 2D.

Next, as shown in FIG. 3A, the individual light receiving elements 101 are diced from the wafer 101a to obtain the light receiving elements 101 having the frame members 102.

As shown in Figure 6a, the frame member 102 is formed to form a cylindrical shape with a cavity inside the frame member. Here, the useful shape of the frame member 102 is not limited to the cylindrical shape and other elliptical or prismatic shapes such as elliptical pillars or square pillars may alternatively be used to form a frame around the photoacceptor unit 101b. . Further, since the cavity is provided inside the frame member 102 as shown in FIG. 6B above the photoacceptor unit 101b, the photoacceptor unit 101b is exposed to the surface of the light receiving element 101. Here, the elastic modulus of the frame member 102 is controlled to be about 2.4 GPa at ambient temperature and about 15 MPa at a temperature of 200 ° C. The elastic modulus of the frame member 102 may be appropriately adjusted by appropriately selecting the type of resin material cured by light and heat, the content rate of an additive such as a curing agent, or processing conditions such as curing light density or curing temperature.

Next, as shown in FIG. 3B, the light receiving element 101 may be attached to the lead frame 104 at a predetermined position by an adhesive. Next, as shown by FIG. 3C, the light receiving elements 101 are electrically connected to the associated leadframes 104 at their respective predetermined positions by the metal filaments 105.

 Next, as shown in Figure 4a, the sealing metal molds (111a, 111b) having a flat molding surface is provided and as shown in Figure 4b the light receiving element 101 in the lead frame 104 is sealed metal mold ( 111a and 111b). Next, the molding surface of the sealing metal mold 111a is pressed against the upper surface of the frame member 102, and the molding surface of the sealing metal mold 111b is pressed against the lower surface of the lead frame 104. More specifically, the gap between the upper surface of the frame member 102 and the molding surface of the sealing metal mold 111a and the lower surface of the lead frame 104 and the molding surface of the sealing metal mold 111b are reduced to a minimum. And a close connection between them is provided.

Next, as shown in 4a, the sealing resin (second resin) melted by heat while maintaining the conditions of the crimping connection of the sealing metal molds (111a, 111b) except for the space surrounded by the frame member (102) It is injected into the space surrounded by the metal surface. This forms the sealing resin layer 106 filling the periphery of the frame member 102. Here, the sealing resin and the sealing metal mold 111a surrounded by the frame member 102 are formed above the photo acceptor unit 101b. In addition, the molding surface of the sealing metal mold 111a and the upper surface of the frame member 102 are closely connected by an external force due to the clamping pressure, and the light receiving element 101 and the frame member 102 are strongly attached as described above. do. In this case, if the frame member 102 has an elastic modulus in the range of 1 GPa to 6 GPa at 20 ° C. and an elastic modulus in the range of 10 MPa to 3 GPa at 200 ° C., then the frame member 102 is subjected to the external force of this clamping pressure. The clamping pressure of the absorbing sealing metal mold may be appropriately elastically deformed, thereby providing protection for the light receiving element 101. In addition, such elastic deformation may generate an opposing force for closely connecting the frame member 102 to the sealing metal mold 111a. Therefore, unwanted inflow of the sealing resin into the frame member 102, that is, into the sealing region formed above the photo acceptor unit 101b can be prevented. As described above, in order to provide increased adhesion of the sealing metal mold 111a due to the elastic deformation of the frame member 102, the height of the upper surface of the frame member 102 is 0 to 0 from the upper surface of the sealing resin layer 106. The design can be made to be in the range of 0.05 mm. When the upper surface of the frame member 102 is designed to be 0.05 mm or more larger than the upper surface of the sealing resin layer 106, the external force due to the clamping pressure of the sealing metal mold 111a is increased, and the deformation of the frame member 102 is increased. This leads to plastic deformation causing damage to the frame member 102. On the contrary, when the upper surface of the frame member 102 is lower than the upper surface of the sealing resin layer 106, that is, when the height of the upper surface of the frame member 102 is lower than the height of the upper surface of the sealing resin layer 106 (0 mm). Lower than the level), causing unwanted inflow of the sealing resin into the interior of the frame member 102.

Next, the sealing metal molds 111a and 111b are removed to obtain the light receiving element 101 whose level of the upper surface of the frame member 102 is the same as that of the upper surface of the sealing resin 106 as shown in FIG. 4B. . More specifically, the plurality of light receiving elements 101 on the lead frame 104 are entirely sealed.

Next, as shown in FIG. 5A, a protective tape 107 is formed to cover the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106. A protective tape 107 is provided to protect the photo acceptor units 101b. Although the material for the protective tape 107 is not particularly limited to any particular material, a removable resin having a thermal resistance at a temperature not lower than the reflow temperature may generally be used.

Next, as shown in FIG. 5B, dicing is performed on each of the light receiving elements 101 to obtain an electronic device 108 having a desired appearance.

Next, the electronic device 108 is connected to the base substrate 109 having the necessary electronic circuits formed therein by the solder 110 in a reflow process. The protective tape 107 is then removed to obtain an electronic device 108 with the device mounted as in FIG. 5C.

Here, the electronic device 108 is a device having passive elements and / or active elements formed on the surface of the semiconductor substrate or the glass substrate.

Advantageous effects obtained by using the configuration of the present invention will be described. An electronic device 108 having a top surface of the frame member 102 and a top surface of the sealing resin layer 106 is formed, all of which form a flat surface. According to the electronic device 108 having such a configuration, attachment and removal of the protective tape 107 covering the upper surface of the frame member 102 and the sealing resin layer 106 can be easily performed. Therefore, contamination of the photo acceptor unit 101 can be reduced. Weakening of the optical signal can be prevented because the protective tape 107 disposed in the optical path of the exposed photoacceptor unit 101b can be easily removed in use of the electronic device 108. Thus, an electronic device 108 with improved reliability can be achieved.

In addition, the protective tape 107 is removed after the electronic device 108 is connected to the base substrate 109 in a process for manufacturing the electronic device 108. Therefore, contamination of the photo acceptor unit 101 due to contaminants that have entered the frame member 102 can be prevented when the electronic device on the base substrate 109 is mounted.

In the manufacturing method of the electronic device 108, the flat molding surfaces of the sealing metal molds 111a and 111b are pressed against the upper surface of the frame member 102 and the upper surface of the lead frame 104, and to the frame member 102. The sealing resin is injected into the space surrounded by the molding surfaces of the sealing metal molds 111a and 111b except for the space surrounded by the sealing metal layer 111 to form the sealing resin layer 106 filling the periphery of the frame member 102. Therefore, the structure in which the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 form a common plane can be obtained by a simple process. Therefore, productivity of the electronic device 108 may be improved.

Further, the use of the resin film 102a having a uniform thickness distribution can provide the frame member 102 having a uniform height distribution over the entire surface of the wafer 101a. This reduces the height deviation of the frame member 102 on the light receiving element 101 and provides sealing in one process. Therefore, productivity of the electronic device 108 may be improved.

In addition, the frame member 102 provides protection for the photoacceptor units 101b in the process for providing the electronic device 108 and requires removal of the frame member 102 after production of the electronic device 108. It doesn't work. Thus, further operation to remove the frame member 102 can be omitted, so that an electronic device 108 exhibiting improved reliability can be obtained without having to perform an additional manufacturing process.

Although an exemplary description of the resin film 102a having a thickness of 0.08 mm is shown in this embodiment, the thickness of the resin film 102a can be appropriately selected so that the height of the frame member 102 is 0.08 mm or more. It may be selected, and more preferably may be selected to be thicker or thicker than the resin film 102a of 0.1 mm. Further, although an exemplary description using a single layer of the resin film 102a has been described in this embodiment, the resin film 102 may include any number of layers.

(Second Embodiment)

7A to 7C are sectional views showing the manufacturing process for the electronic device of the second embodiment. The first embodiment is configured to employ the protective tape 107, and this embodiment is configured to employ the protective glass 207. The other configuration of this embodiment is similar to that used in the first embodiment.

The protective glass 207 is formed on a surface commonly formed by the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106. Optically transmissive glass can be used as the protective glass 207.

In the process for manufacturing the electronic device 208 having such a configuration, a similar manufacturing process shown in Figs. 2A to 4B for manufacturing the electronic device 108 in the previous embodiment can be used. Here, the manufacturing process after the operation shown in FIG. 2B will be described.

First, as shown in FIG. 7A, a protective glass 207 is attached to cover the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106. Here, the attachment of the protective glass 207 is attached with an adhesive having a thermal resistance at a temperature not lower than the reflow temperature. Next, as shown in FIG. 7B, each of the plurality of electronic devices 208 formed on the leadframe 104 is diced to obtain electronic devices 208 having a desired geometric shape. Next, as shown in FIG. 7C, the electronic device 208 is mounted after being connected to the base substrate 109 having the necessary electronic circuits formed therein by the solder 108 in a reflow process.

Since the optically transmissive glass is used for the protective glass 207 for the electronic device 208 in the second embodiment, the advantageous effect of removing the unwanted process for removing the protective glass 207 after the reflow process is finished. Can be obtained.

In this embodiment, the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 are formed to form a common surface, and the electronic device 208 to which the protective glass 207 attached is easily provided and for manufacturing the same. The process can be obtained. Other advantageous effects of this embodiment are similar to those obtained in the above-described embodiment.

(Third Embodiment)

8A to 8D are cross-sectional views illustrating the process for manufacturing the electronic device in the third embodiment. The configuration of the electronic device of the third embodiment is similar to that of the electronic device 108 of the first embodiment.

The frame member 302 of the electronic device of the third embodiment is formed by a manufacturing process as shown in Figs. 8A to 8D. The other manufacturing process of this embodiment is similar to the process of the first embodiment. 8A-8D correspond to FIGS. 2A-2D, respectively. The other manufacturing process is similar to the operation in the first embodiment, and thus, detailed description thereof is not repeated.

First, as shown in Fig. 8A, a wafer 101a having a plurality of light receiving elements formed therein is provided. The photo acceptor units 101b are exposed on the surface of each of the light receiving elements 101 arranged on the wafer 101a. Here, only two light receiving elements 101 are shown in FIG. 8A between the plurality of light receiving elements 101 arranged on the wafer 101a. In addition, a resin film 302a formed of a resin material formed in a film form and cured by light and heat is provided. An opening corresponding to the cavity of the frame member 302 is previously drilled in the resin film 302a. Next, as shown in FIG. 8B, the alignment for the photo acceptor units 101b is performed and properly positioned inside the opening provided in the resin film 302a, and then the entire light receiving element 101 (wafer 101a). Is covered with the resin film 302a.

Next, as shown in FIG. 8C, the exposure process is performed using the exposure mask 103 and the resin film 302a is patterned to form the frame member 302.

In addition, as shown in FIG. 8D, a printing process is performed to remove the resin film 302a except for the frame members 302 so as to surround the respective photo acceptor units 101b. Is formed. As described above, the frame member 302 can be formed by using a photolithography process. In addition to the above, the resin constituting the frame member 302 does not fully cure immediately after the ignition process is completed, but provides weak adhesion with weak adhesion between the frame member 302 and the light receiving elements 310 and provides a firm attachment. Does not provide

By allowing the internal cavity of the frame member 302 to be formed in advance, residue of the resin film 302a inside the frame member 302 can be prevented. Otherwise it is difficult to remove completely only by the ignition process. Therefore, the electronic device 108 and the method for manufacturing the same can be made which further prevents contamination of the photo acceptor unit 101b and thus exhibits further improved reliability. Although the manufacturing process in which the inner wall and the outer wall of the frame member 102 are simultaneously formed is perpendicular to the surface of the light receiving element 101 as described in the first embodiment, it is difficult to form the inner wall of the frame member 102. As described in the third embodiment, the use of the frame member 302 forms the opening of the resin film 302a in advance, thereby forming the inner wall of the frame member 302 to be perpendicular to the surface of the light receiving element 101. Can provide. Therefore, the distance between the photoacceptor unit 101b and the frame member 302 can be eliminated, whereby contamination in the photoacceptor unit 101b can be further reduced. In addition, an advantageous effect of reducing the size of the electronic device can also be obtained.

In the present embodiment, the configuration of the electronic device is similar to that of the first embodiment, but other advantageous effects of the present embodiment are similar to those obtained by the above-described embodiment.

(Fourth Embodiment)

9A and 9B are cross-sectional views illustrating a process for manufacturing the electronic device of the fourth embodiment. The configuration of the electronic device of the fourth embodiment is similar to the configuration for the electronic device 108 of the first embodiment. The electronic device of the fourth embodiment is formed by the manufacturing process described in Figs. 9A and 9B. The other manufacturing process of this embodiment is similar to the first embodiment. 9A and 9B correspond to FIGS. 4A and 4B, respectively. The other manufacturing process is similar to that of the first embodiment, and thus, detailed description thereof is not repeated.

First, as shown in FIG. 9A, after the sealing metal molds 111a and 111b having the flat molding surface are provided, the resin film 412 is formed on the molding surface of the sealing metal mold 111a by vacuum chucking. Is placed. Subsequently, the light receiving elements 101 on the lead frame 104 are fixed at predetermined positions of the sealing metal molds 111a and 111b. Next, the molding surface of the sealing metal mold 111a is pressed against the upper surface of the frame member 402, and the molding surface of the sealing metal mold 111b is pressed against the lower surface of the lead frame 104. More preferably, the resin film 412 is disposed and pressed between the upper surface of the frame member 402 and the molding surface of the sealing metal mold 111a.

This is because the gap between the upper surface of the frame member 402 and the molding surface of the sealing metal mold 111a and the gap between the lower surface of the lead frame 104 and the molding surface of the sealing metal mold 111b are separated from the resin film 412. Intervention is reduced to a minimum to provide intimate contact therebetween.

Subsequently, as shown in FIG. 9B, under the condition of compressive contact, the heat-sealed sealing resin is surrounded by the molding surfaces of the sealing metal molds 111a and 111b except for the space surrounded by the frame member 102. Is injected into the sealing resin layer 106 to fill the periphery of the frame member 402. Here, the sealed region surrounded by the frame member 402 and the sealing metal mold 111a is formed above the photo acceptor unit 101b. In addition, the molding surface of the sealing metal mold 111a and the upper surface of the frame member 402 are in close contact with the external force by the clamping pressure, and the light receiving element 101 and the frame member 402 are strongly attached as described above. do. Accordingly, unwanted flow of the sealing resin into the sealing region formed inside the frame member 420, that is, above the photoacceptor unit 101b can be prevented.

Subsequently, the sealing metal molds 111a and 111b are removed as shown in FIG. 9B to obtain the light receiving element 101. More specifically, the plurality of light receiving elements are entirely sealed on the lead frame 104. In this case, since the resin film 412 is chucked to the sealing metal mold 111a, the film does not remain on the upper surface of the frame member 402 or the upper surface of the sealing resin layer 106.

In this embodiment, the elastic modulus of the frame member 402 is 9 GPa. Therefore, the rigidity of the frame member 402 can be improved to more strongly prevent the sealing resin from penetrating into the cavity of the frame member 402 and the protection for the photo acceptor unit 101b can be improved.

When the elastic modulus of the frame member 402 of 6 GPa or more is implemented without using the configuration of this embodiment, the sealing metal mold 111a as described above to apply the external force generated by the clamping pressure on the light receiving element 101 The frame member 402 cannot sufficiently elastically deform with respect to the direct cranking pressure on the upper surface of the frame member 402. This may cause damage to the light receiving element 101, damage to the function of the photoacceptor unit 101b, and may also cause deterioration in the entire test. On the contrary, since the resin film 412 is sandwiched between the upper surface of the frame member 402 and the molding surface of the sealing metal mold 111a in the present embodiment, a general defect state such as breakage of the light receiving element 101 or photo storage is achieved. It functions as a cushioning material so that failure of the function of the acceptor unit 101b can be prevented.

Since the effective range of the elastic modulus of the frame member 402 is 6 GPa or more, the degree of flexibility can be increased when the resin for the first resin is selected as the material of the frame member 402. In addition, since the frame member 420 is made of a resin material having an elastic modulus of 9 GPa, which is a fully cured resin, so that the enhanced protection against the penetration of the sealing resin into the photoacceptor unit 101b can be achieved during the sealing process. There is an advantage that the rigidity of the frame member 402 can be improved.

Here, the elastic modulus of the frame member 402 means the elastic modulus of the product in a state completely cured by light and heat. The frame member 402 is composed of a first resin. The first resin is a cured product of a resin material which can be cured by light and heat. Resin materials that can be cured by light and heat include photoreactive resins such as acrylic resins and thermally reactive resins such as epoxy resins.

The elasticity modulus of the resin film 412 is 3 GPa. Therefore, when the upper surface of the frame member 402 is pressed into the sealing metal mold 111a so that the photo acceptor units 101 are protected, the resin film 412 is elastically deformed to function as a cushioning material.

Although the exemplary description with the resin film 412 disposed between the upper surface of the frame member 402 and the molding surface of the sealing metal mold 111a has been described in this embodiment, the lower surface of the lead frame 104 and the sealing metal mold are described. A similar resin film may alternatively be disposed between the molding surfaces of 111b and pressed against it. This alternative arrangement prevents the molten sealing resin from entering into the gap between the lower surface of the lead frame 104 and the molding surface of the sealing metal malls 111b.

(Fifth Embodiment)

10A is a perspective view illustrating an electronic device of a fifth embodiment, and FIG. 10B is a cross-sectional view taken along the line III-III 'of FIG. 10. The first embodiment is a configuration in which the upper surface of the frame member and the upper surface of the sealing resin layer form a common surface, but in this embodiment, the upper surface of the frame member is higher than the upper surface of the sealing resin layer and protrudes upward. The process for manufacturing the electronic device in the fifth embodiment is similar to the process for manufacturing the electronic device in the first embodiment as shown in Figs. 2A to 5C.

The deviation of the height of the frame member 502 in the process for manufacturing the electronic device in the test fabrication was about 10 μm by the standard deviation. Here, the deviation of the height of the frame member 502 is a deviation in the height of the frame member 502, which is composed of a change in the light density in the exposure process, or the type of the printing solution or the first resin and is used in the photolithography process. By the process of forming the frame member 502 in the process for forming a film having a uniform thickness, it may be caused by the change in the process time in the ignition process. In view of this height deviation of the manufacturing process, if the minimum height of the frame member 502 is designed not to be higher than the sealing resin layer 106, the second resin (sealing resin) can enter the inside of the frame member 502 The cavity may be broken.

In contrast, in the electronic device of this embodiment, the upper surface of the frame member 502 is higher than the upper surface of the sealing resin layer 106 by 10 µm to 60 µm as shown in FIG. 10A. The height of the frame member 502 that meets the above criteria can be obtained by designing the frame member 502 about 30 μm higher than the top surface of the sealing resin layer 106, which is at the height of the frame member 502. Three times the standard deviation of the deviation. This design of the height of the frame member 502 can also be appropriately made by appropriately adjusting the pressure for pressing against the frame member 502 in a sealing process or the like.

Advantageous advantages obtained in the electronic device of the fifth embodiment are similar to those obtained in the first embodiment. Further, even if the upper surface of the frame member 502 is three times higher than the standard deviation of the height deviation of the frame member 502 than the upper surface of the sealing resin layer 106, unwanted penetration of the sealing resin into the cavity of the frame member 502 is achieved. Is prevented, and therefore, the configuration of the present embodiment can provide an electronic device with improved reliability. As a result, even if a deviation in the height of the frame member 502 of about 10 mu m due to the standard deviation is caused in the process for manufacturing the electronic device, the frame causing breakage of the cavity and contamination of the photo acceptor unit 101b. Undesirable penetration of the sealing resin inside the member 502 can be prevented.

Also, as shown in FIG. 10B, the configuration of the upper surface of the frame member 502 higher than the upper surface of the sealing resin layer 106 is such that the frame member is pressed against the molding surfaces of the sealing metal molds 111a and 111b. In this case (see FIG. 4A), a large pressure applied to the frame member 502 can be provided. Thus, further enhanced protection against penetration of the sealing resin into the cavity in the frame member 502 can be achieved, and improved protection for the photo acceptor unit 101b can be further provided.

(Example 6)

11A to 11G are sectional views showing the manufacturing process of the electronic device of the sixth embodiment.

Although the frame member in the first embodiment is formed of a single layer of the first resin, the electronic device in the sixth embodiment is formed of laminated two-ply films in which the frame member is composed of the first resin, and thus has a higher height. It consists of two layers. The other configuration of this embodiment is similar to that of the first embodiment. The frame member 602 of the electronic device of the sixth embodiment is formed by the manufacturing process described in Figs. 11A to 11G. The other manufacturing process is similar to the operation of the first embodiment, and thus, detailed description thereof is not repeated.

First, as shown in FIG. 11A, a wafer 101a is provided.

The wafer 101a is provided with a plurality of light receiving elements 101 formed therein, and the photoacceptor units 101b are exposed on the surface of each of the light receiving elements 101. Here, only two photoreceptors 101 are shown in FIG. 11A and a plurality of photoreceptor units 101b are exposed between the plurality of photoreceptors 101 arranged on the wafer 101a.

Next, as shown in Fig. 11B, resin films 602a and 602b are formed so as to have a film form having a thickness of 0.06 mm and made of a resin material that can be cured by light and heat. The resin film 602a and the resin film 602b have a pressure applied thereon by a roll lamination process in which a laminated member can be obtained in order to obtain a resin film 602c having substantially no “strain” or “wrinkling”. While passing through the roll 603a and roll 603b of the roller. Since a film having a uniform thickness is used for each of the resin films 602a and 602b, the resin film 602c composed of a laminated member of the resin film 602a and the resin film 602b also has a uniform thickness. Membrane (FIG. 11C).

Next, as shown in FIG. 11D, the resin film is formed on the light receiving element 101 (wafer 101a) by a vacuum lamination process so that bubbles or the like are not substantially generated between the resin film 602c and the wafer 101a on the contact surface. 602c is mounted, thereby covering the entire wafer 101a with the resin film 602c. The thickness of the resin film 602c is 0.12 mm.

Next, as shown in FIG. 11E, an exposure process is performed using the exposure mask 103 to pattern the resin film 602c to thereby form the frame member 602.

Also, as shown in FIG. 11F, the resin film 602c is partially removed except for the corresponding portion of the frame member 602 so that the frame member 602 provided to surround the associated photoacceptor units 101b is formed. The printing process is carried out to Experimental fabrication shows that the frame member 602 of the resin film 602c composed of the laminated members of the resin film 602a and the resin film 602b can be formed by using a photolithography process.

Advantageous advantages obtained in the electronic device of the sixth embodiment are similar to those obtained in the first embodiment. In this embodiment, the resin film 603c is configured in the form of a two-layer thin film of the first resin. This ensures a sufficient thickness of the resin film 603c to be 0.08 mm or more. The solvent used to treat the first resin needs to be removed to provide the form of the membrane. When considering removal of the solvent, the use of a thick resin film 603c having a thickness larger than 0.08 mm makes it difficult to remove the solvent from them. More specifically, it is difficult to remove solvents from products such as membranes. As a result, the use of the laminated member of two films having a thickness of 0.08 mm or less, that is, the use of the laminated member of the first resin in the form of a film, which facilitates the removal of the solvent, has increased the film thickness of the resin film 603c. To provide.

Further, the resin films 602a and 602b may be reduced so that the generation of "deformation" or "wrinkling" in the resin films 602a and 602b may be reduced due to the adhesive force or adhesion between the resin films 602a and 602b. The lamination process of is completed before forming the resin film 602c laminated on the wafer 101a. More specifically, in the case where the resin films 602a and 602b are sequentially formed on the wafer 101a, the first layer of resin film, that is, for example, the resin film 602a is formed, and then the second film is formed. When a layered resin film, i.e., a resin film 602b is formed, generation of "deformation" or "wrinkling" in the resin films 602a, 602b due to the adhesion of the resin films 602a, 602b. Will be reduced.

Further, the above-described roll lamination process will be used to form the laminated member of the resin films 602a and 602b. The roll lamination process provides a limited position of the pressed side in the resin films 602a and 602b, so that even if the resin film's adhesiveness causes "deformation" or "wrinkling", such small "deformation" or "wrinkling" The resin films 602a and 602b can be offset to the side that is not greatly pressurized, thereby forming a laminated member of the resin film having substantially no “deformation” or “wrinkling”.

Alternatively, the vacuum lamination process may be used in the process for forming the laminated member of the resin film 602c on the wafer 101a. More specifically, the use of the vacuum lamination process prevents foaming easily from the interface between the wafer 101a and the resin film 602c, and allows the wafer to be uniformly pressed against the entire wafer 101 even if a thin wafer 101a is used. The crack is not generated at 101a.

The use of the laminated member of the resin film to form the frame member 602 increases the height of the frame member 602 so that unwanted contact with the metal filament 105 can be prevented by an increased distance, whereby the metal filament ( The distance between the vertex of 105 and the sealing metal molds 111a and 111b is increased (see FIG. 11G). It also increases flexibility in the design for the height of the sealing resin layer 106 and the frame member 602. As described in the first embodiment, the predetermined difference between the vertical size (height) of the frame member 602 and the vertical size (thickness) of the sealing resin layer 106 is 0.05 mm or less. While maintaining this predetermined range of vertical size, the vertical size or height of the frame member 602 itself can be increased by increasing the vertical size or by increasing the thickness of the sealing resin layer 106. This increased height of the frame member 602 provides a large elastic deformation of the frame member while thereby leading to the generation of a strong reaction force which creates a strong contact between the frame member 602 and the sealing metal mold 111a. The sealing resin layer 106 is prevented from entering the inside of 602. Conversely, this increase in the height of the frame member 602 allows sufficient protection with the sealing resin without exposing the light receiving element 101 and the metal filament 105, and from the sealing resin layer 106 to the frame member 602. A sufficient thickness of the sealing resin layer 106 is ensured while ensuring that the height of the () is 0.05 mm.

The electronic device and the process therefor according to the present invention are not limited to the above-described embodiments, and various modifications may be useful.

Although an exemplary description for using the light receiving elements 101, which are useful elements for a DVD system, has been described in the above-described embodiments, for example, an image device used in a digital video camera or a digital still camera, various types of micro electrics. Mechanical systems (MEMS), electroacoustic filters using electric vibrations, and the like can also be used. Also, the configuration of the present invention can be used for semiconductor devices that require space around the devices due to the requirement for low dielectric constant. Further, although the base member is disclosed by explaining the lead frame, the base member is not limited to the lead frame, and for example, a resin substrate or a film substrate may alternatively be adopted.

It is apparent that the present invention is not limited to the above embodiments and can be modified and changed without departing from the spirit and scope of the present invention.

FIG. 1A is a perspective view illustrating the electronic device of the first embodiment, and FIG. 1B is a cross-sectional view of the electronic device along the line II ′ of FIG. 1A.

2A to 2D are sectional views showing the process for manufacturing the electronic device of the first embodiment.

3A to 3C are cross-sectional views showing the process for manufacturing the electronic device of the first embodiment.

4A and 4B are sectional views showing the process for manufacturing the electronic device of the first embodiment.

5A to 5C are cross-sectional views showing the process for manufacturing the electronic device of the first embodiment.

6A is a perspective view illustrating another electronic device of the first embodiment, and FIG. 6B is a cross-sectional view of the electronic device along line II-II ′ of FIG. 6A.

7A to 7C are sectional views showing the process for manufacturing the electronic device of the second embodiment.

8A to 8D are sectional views showing the process for manufacturing the electronic device of the third embodiment.

9A and 9B are sectional views showing the process for manufacturing the electronic device of the fourth embodiment.

FIG. 10A is a perspective view illustrating the electronic device of the fifth embodiment, and FIG. 10B is a cross-sectional view of the electronic device along the line III-III ′ of FIG. 10A.

11A to 11G are sectional views showing the process for manufacturing the electronic device of the sixth embodiment.

12 is a cross-sectional view of a conventional electronic device.

13 is a cross-sectional view illustrating a conventional electronic device.

14 is a cross-sectional view illustrating a conventional electronic device.

* Description of the symbols for the main parts of the drawings *

101: light receiving element 101b: photo acceptor unit

102 frame member 102a resin film

104: lead frame 105: metal filament

107: protective tape 111a, 111b: sealing metal mold

Claims (18)

delete In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And Comprising a second resin and comprises a resin layer filling the periphery of the frame member, The functional unit of the device is exposed to a space surrounded by the frame member, And an upper surface of the frame member is positioned higher than an upper surface of the resin layer. In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And A second resin layer composed of a second resin and filling the periphery of the frame member; The functional unit of the device is exposed to a space surrounded by the frame member, The upper surface of the frame member and the upper surface of the resin layer form a common plane or the upper surface of the frame member is positioned higher than the upper surface of the resin layer, And the first resin is a cured product of a resin that can be cured by light and heat. In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And A second resin layer composed of a second resin and filling the periphery of the frame member; The functional unit of the device is exposed to a space surrounded by the frame member, The upper surface of the frame member and the upper surface of the resin layer form a common plane or the upper surface of the frame member is positioned higher than the upper surface of the resin layer, The elastic modulus of the cured product of the first resin is in the range of 1 GPa to 6 GPa at 20 ° C and in the range of 10 MPa to 3GPa at 200 ° C. In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And A second resin layer composed of a second resin and filling the periphery of the frame member; The functional unit of the device is exposed to a space surrounded by the frame member, The upper surface of the frame member and the upper surface of the resin layer form a common plane or the upper surface of the frame member is positioned higher than the upper surface of the resin layer, The first resin is a film resin. In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And A second resin layer composed of a second resin and filling the periphery of the frame member; The functional unit of the device is exposed to a space surrounded by the frame member, The upper surface of the frame member and the upper surface of the resin layer form a common plane or the upper surface of the frame member is positioned higher than the upper surface of the resin layer, The upper surface of the frame member is located higher than the upper surface of the resin layer in the range of 0mm to 0.05mm. In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And A second resin layer composed of a second resin and filling the periphery of the frame member; The functional unit of the device is exposed to a space surrounded by the frame member, The upper surface of the frame member and the upper surface of the resin layer form a common plane or the upper surface of the frame member is positioned higher than the upper surface of the resin layer, The height of the frame member is more than 0.05mm electronic device. In the electronic device, device; A frame member composed of a first resin provided to surround the functional unit of the device; And A second resin layer composed of a second resin and filling the periphery of the frame member; The functional unit of the device is exposed to a space surrounded by the frame member, The upper surface of the frame member and the upper surface of the resin layer form a common plane or the upper surface of the frame member is positioned higher than the upper surface of the resin layer, The surface formed by the upper surface of the frame member and the upper surface of the resin layer is covered with a protective film. The electronic device of claim 8, wherein the protective layer is formed of a resin that can be removed. The electronic device of claim 8, wherein the passivation layer is formed of an optically transmissive material. delete delete delete delete delete delete delete delete
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