JPS5599756A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5599756A JPS5599756A JP798379A JP798379A JPS5599756A JP S5599756 A JPS5599756 A JP S5599756A JP 798379 A JP798379 A JP 798379A JP 798379 A JP798379 A JP 798379A JP S5599756 A JPS5599756 A JP S5599756A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin sealing
- time
- stitch
- pressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent a wire from coming into contact with a neighboring wire or a stitch by providing a step for a specified stitch at the time of usual resin sealing after bonding. CONSTITUTION:Island 2, a stitch which constitutes the bonding part of external lead 3, and those parts of lead 3, which is to be provided with a step, that are to be pressed by the lead frame of metal mold 5 at the time of resin sealing are partially plated. At this time, partial plating is made over a long extent for the upper surface of lead 3 and over a short extent for the lower surface. When lead frame 1 is pressed by the metal old at the time of resin sealing, the pressed parts of plated lead are deformed upward due to the difference in the plated extent between the upper and the lower surface. Immediately after this, molding is operated by resin sealing. Further, the degree of the step can be adjusted by varying the thickness of plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP798379A JPS5599756A (en) | 1979-01-25 | 1979-01-25 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP798379A JPS5599756A (en) | 1979-01-25 | 1979-01-25 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5599756A true JPS5599756A (en) | 1980-07-30 |
Family
ID=11680664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP798379A Pending JPS5599756A (en) | 1979-01-25 | 1979-01-25 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5599756A (en) |
-
1979
- 1979-01-25 JP JP798379A patent/JPS5599756A/en active Pending
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