JPS57188857A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57188857A
JPS57188857A JP56073531A JP7353181A JPS57188857A JP S57188857 A JPS57188857 A JP S57188857A JP 56073531 A JP56073531 A JP 56073531A JP 7353181 A JP7353181 A JP 7353181A JP S57188857 A JPS57188857 A JP S57188857A
Authority
JP
Japan
Prior art keywords
package
semiconductor device
header
opening
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56073531A
Other languages
Japanese (ja)
Inventor
Tomoaki Yamaguchi
Usuke Enomoto
Makoto Shimaoka
Kenji Akeyama
Ryuichi Tanaka
Kazuo Kanbayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56073531A priority Critical patent/JPS57188857A/en
Publication of JPS57188857A publication Critical patent/JPS57188857A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the resistance against an external force and to improve the reliability of semiconductor device by a construction wherein a header is provided with an opening at the part covered with a package or the part corresponding to peripheral edges of the package. CONSTITUTION:A header 1 for mounting a semiconductor pellet 2 thereon is formed with an opening 13 at the part covered with a package 8 or the part corresponding to peripheral edges of the package. Resin for the package is made to flow into the opening 13. By so doing, the package will not be chipped off even when the load is applied on the exposed end of the header. Thus, the reliability of the semiconductor device is improved without inviting reduction of moisture resistance.
JP56073531A 1981-05-18 1981-05-18 Semiconductor device Pending JPS57188857A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56073531A JPS57188857A (en) 1981-05-18 1981-05-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56073531A JPS57188857A (en) 1981-05-18 1981-05-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57188857A true JPS57188857A (en) 1982-11-19

Family

ID=13520901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56073531A Pending JPS57188857A (en) 1981-05-18 1981-05-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57188857A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261161A (en) * 1984-06-08 1985-12-24 Hitachi Ltd Semiconductor device
US6373124B1 (en) 1998-08-24 2002-04-16 Matsushita Electric Industrial Co., Ltd. Lead frame and method of producing the same, and a semiconductor device using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261161A (en) * 1984-06-08 1985-12-24 Hitachi Ltd Semiconductor device
US6373124B1 (en) 1998-08-24 2002-04-16 Matsushita Electric Industrial Co., Ltd. Lead frame and method of producing the same, and a semiconductor device using the same

Similar Documents

Publication Publication Date Title
JPS5521128A (en) Lead frame used for semiconductor device and its assembling
IE821984L (en) Optocouplers
JPS5676542A (en) Resin-sealed semiconductor device
JPS57188857A (en) Semiconductor device
JPS5623765A (en) Molded type electronic device
JPS52104550A (en) Compositions for rapid adhesion
JPS5379381A (en) Production of resin seal type semiconductor device and lead frame used forthe same
JPS54133877A (en) Semiconductor device
JPS522282A (en) Semiconductor device
JPS5516439A (en) Resin seal semiconductor device
JPS538570A (en) Semiconductor device
JPS52156562A (en) Semiconductor device
JPS57210639A (en) Semiconductor device
JPS5484476A (en) Semiconductor pellet with improved juncture
JPS5536975A (en) Resin sealed type semiconductor device
JPS547272A (en) Semiconductor package
JPS54152961A (en) Semiconductor device
JPS5333064A (en) Semiconductor device
JPS5443676A (en) Circuit device and circuit element fitting substrate
JPS57114266A (en) Resin-sealed semiconductor device
JPS57210649A (en) Semiconductor device and lead frame used for assembling the same
JPS55150258A (en) Semiconductor device
JPS6469038A (en) Resin-sealed semiconductor device
JPS5349952A (en) Semiconductor device
JPS5315759A (en) Electronic parts