JPS5484476A - Semiconductor pellet with improved juncture - Google Patents

Semiconductor pellet with improved juncture

Info

Publication number
JPS5484476A
JPS5484476A JP15263677A JP15263677A JPS5484476A JP S5484476 A JPS5484476 A JP S5484476A JP 15263677 A JP15263677 A JP 15263677A JP 15263677 A JP15263677 A JP 15263677A JP S5484476 A JPS5484476 A JP S5484476A
Authority
JP
Japan
Prior art keywords
pellet
maximum
die
semiconductor pellet
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15263677A
Other languages
Japanese (ja)
Inventor
Takao Fujizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15263677A priority Critical patent/JPS5484476A/en
Publication of JPS5484476A publication Critical patent/JPS5484476A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Abstract

PURPOSE: To improve the operational yield of an automatic die-bonding device by providing unevenness of 0.3 to 4μm in maximum rounghness and less than 5μm in maximum undulation to the reverse surface of a pellet when die-bonding semiconductor pellets.
CONSTITUTION: To die-bond semicondcvtor pellets, the maximum surface roughness of the pellet should by between 0.3 and 4μm, and the maximum undulation less than 5μm. As a result, the wet area of the pellet is wide and the electric contact resistance, therefere, decreases, so that the yield will improve by 15 to 20%.
COPYRIGHT: (C)1979,JPO&Japio
JP15263677A 1977-12-19 1977-12-19 Semiconductor pellet with improved juncture Pending JPS5484476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15263677A JPS5484476A (en) 1977-12-19 1977-12-19 Semiconductor pellet with improved juncture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15263677A JPS5484476A (en) 1977-12-19 1977-12-19 Semiconductor pellet with improved juncture

Publications (1)

Publication Number Publication Date
JPS5484476A true JPS5484476A (en) 1979-07-05

Family

ID=15544718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15263677A Pending JPS5484476A (en) 1977-12-19 1977-12-19 Semiconductor pellet with improved juncture

Country Status (1)

Country Link
JP (1) JPS5484476A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142640A (en) * 1986-12-05 1988-06-15 Sumitomo Electric Ind Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142640A (en) * 1986-12-05 1988-06-15 Sumitomo Electric Ind Ltd Manufacture of semiconductor device

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