JPS58223336A - Manufacture of casting mold - Google Patents
Manufacture of casting moldInfo
- Publication number
- JPS58223336A JPS58223336A JP10703482A JP10703482A JPS58223336A JP S58223336 A JPS58223336 A JP S58223336A JP 10703482 A JP10703482 A JP 10703482A JP 10703482 A JP10703482 A JP 10703482A JP S58223336 A JPS58223336 A JP S58223336A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- jig
- lead frame
- frame
- casting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005266 casting Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 238000007373 indentation Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
素子表面とキャスティングモールド表面との距離の精度
を向上させるキャスティングモールド製造法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a casting mold manufacturing method that improves the accuracy of the distance between an element surface and a casting mold surface.
ビデオディスク或いはディジタルオーディオディスクの
光学式ピックアップに用いられる半導体装置はその装置
の外形とリードフレームに搭載サれた半導体素子との相
対的位置、特に半導体素子表面とキャスティングモール
ド表面との距離（以下Ｚ方向の距離）の精度・が要求さ
れる，、従来のキャスティングモールド製造法では、リ
ードフレームの上端に開口した位置決め用孔にキャステ
ィング治具上端の位置決めピンを１茨合させることによ
りキャスティング治具にリードフレームを吊下げてキャ
スティング治具に対するリードフレ．−ムの位置決めを
行なっていた。そのためリードフレームの位置決めピン
側の上端はキャスティング治具上端に固定されるが、半
導体素子を搭載１一だ下端はその動きが規制されず、キ
ャスティング治具ニ対するリードフレームの傾きが不同
となってＺ方向の距離にバラツキが生じ、Ｚ方向の距離
の精度が要求精度を満足することができなくなり、光学
式ピックアップのフォトダイオードなどレーザー光の焦
点をその素子表面に結ばせるものについて問題となって
いた。A semiconductor device used for an optical pickup of a video disk or a digital audio disk is determined by the relative position between the external shape of the device and the semiconductor element mounted on the lead frame, especially the distance between the surface of the semiconductor element and the surface of the casting mold (hereinafter referred to as Z). In the conventional casting mold production method, which requires precision in the direction (distance) Hang the lead frame and adjust the lead frame to the casting jig. -I was positioning the system. Therefore, the upper end of the lead frame on the positioning pin side is fixed to the upper end of the casting jig, but the movement of the lower end is not restricted when the semiconductor element is mounted, and the inclination of the lead frame with respect to the casting jig becomes uneven. Dispersion occurs in the distance in the Z direction, making it impossible for the accuracy of the distance in the Z direction to meet the required accuracy, which is a problem for devices that focus laser light on the surface of the element, such as photodiodes in optical pickups. Ta.
本発明は前記問題点を解消するもので、ギヤスティング
治具に吊り下げられたリードフレームの下端を差込み溝
に差込んでその前後面を支え、リードフレームの姿勢を
キャスティング治具の凹窩内で規制して樹脂材１１−ず
・ることを特徴とするもので゛ある。The present invention solves the above-mentioned problems by inserting the lower end of the lead frame suspended in the gear casting jig into the insertion groove to support its front and rear surfaces, and adjusting the posture of the lead frame within the recess of the casting jig. It is characterized in that the resin material 11- is regulated by the following conditions.
以下、本発明の一実施例を図によって説明する。Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図に示すように、本発明に係るリードフレーム１の
−１一端には位置決め用孔２を設け、その下端には舌片
状の位置決め用凸片６を設ける。尚、位置決ｙ）用凸片
５の形状は特に限定されるものではない。As shown in FIG. 1, a positioning hole 2 is provided at one end of the lead frame 1 according to the present invention, and a tongue-shaped positioning convex piece 6 is provided at the lower end thereof. Note that the shape of the positioning protrusion 5 is not particularly limited.
一方第２図、第３図に示すように、本発明に係るギヤス
ティング治具４の上端にはリードフレーム１の位置決め
用孔２内に挿入する位置決め用ピン５を植立し、下端に
は治具４の凹窩６とは別にリードフレーム１の位置決め
用凸片５に対向させて位置決め用差込み溝７を設ける。On the other hand, as shown in FIGS. 2 and 3, a positioning pin 5 to be inserted into the positioning hole 2 of the lead frame 1 is installed at the upper end of the gear sting jig 4 according to the present invention, and a positioning pin 5 is installed at the lower end. Separately from the recess 6 of the jig 4, a positioning insertion groove 7 is provided facing the positioning protrusion 5 of the lead frame 1.
差込み溝７の溝ｒｌＪはリ−ドフレーｌｙ １の位置決
め用凸片３の板厚にほぼ一致させてあり、差込まれた位
置決め用凸片５の前後面を挟持させてこれの動きを規制
するものである３、
本発明の方法においては、先ずリードフレーム１の位置
決ｙ）用孔２にキャスティング治具４の位置決め用ピン
５を通して°キャスティング治具４にリードフレー ム
１を吊下げるとともに、リードフレーム１の位置決め用
凸片５をキャスティング冶具４の位置決め用差込み溝７
に差込んでその前後面を支え、ギヤスティング治具４の
凹窩６内に挿入されたリードフレーム１の姿勢を親制御
〜、凹窩６の前後内面とり−ドフレーノ・１との距餅（
を一定に保たせる。The groove rlJ of the insertion groove 7 is made approximately equal to the thickness of the positioning protrusion 3 of the lead frame ly 1, and clamps the front and rear surfaces of the inserted positioning protrusion 5 to restrict its movement. 3. In the method of the present invention, first, the positioning pin 5 of the casting jig 4 is passed through the positioning hole 2 of the lead frame 1, and the lead frame 1 is suspended from the casting jig 4. The positioning convex piece 5 of the lead frame 1 is inserted into the positioning insertion groove 7 of the casting jig 4.
The position of the lead frame 1 inserted into the concave cavity 6 of the gearing jig 4 is controlled by inserting it into the gear sting jig 4 to support its front and rear surfaces.
keep constant.
次に、キャスティング治具４の凹窩６内に樹脂８を流し
込みリードフレーム１に搭載された半導体素子９を樹脂
材ＩＦする。Next, resin 8 is poured into the recess 6 of the casting jig 4, and the semiconductor element 9 mounted on the lead frame 1 is covered with the resin material IF.
以上のように、本発明はキャスティング治具に吊下げら
れたリードフレーム下端をキャスティング治具の差込み
溝に差込んでその前後面を支え、リードフレームの姿勢
をキャスティング治具の凹窩内で規制して樹脂封止する
ので、キャスティング治具の四窩の前後内面とリードフ
レームとの距離が一定になり、Ｚ方向の距離のバラツギ
を極力小さくすることができ、その精度を出すことがで
きるからＺ方向の距離精度が要求精度を満足さぜろこと
かできるという効果を有するものである。As described above, the present invention supports the front and rear surfaces of the lead frame by inserting the lower end of the lead frame suspended from the casting jig into the insertion groove of the casting jig, and regulating the posture of the lead frame within the recess of the casting jig. Since it is sealed with resin, the distance between the front and rear inner surfaces of the four cavities of the casting jig and the lead frame is constant, and the variation in the distance in the Z direction can be minimized, achieving high accuracy. This has the effect that the distance accuracy in the Z direction can more than satisfy the required accuracy.
第１図は本発明におけるリードフレームの正面図、第２
図は本発明のキャスティングモールド製造法を示す断面
模式図、第６図は第２図のＡ −Ａ’線断面図、第４図
はＢ −Ｂ’線断面図である。
１・・・・・・リードフレーム ２・・・・・・位置
決め用孔６・・・・・・位置決め用凸片 ４・・曲キ
ャスティング治具５・・・・・・位置決め用ピン ６
・・・・・・凹 窩７・・・・・・位置決め用差込み溝Figure 1 is a front view of the lead frame in the present invention, Figure 2 is a front view of the lead frame in the present invention;
The figure is a schematic cross-sectional view showing the casting mold manufacturing method of the present invention, FIG. 6 is a cross-sectional view taken along the line A-A' in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line B-B'. 1... Lead frame 2... Positioning hole 6... Positioning convex piece 4... Curved casting jig 5... Positioning pin 6
・・・・・・Concave socket 7・・・・・・Positioning insertion groove
Claims (1)
ム下端をキャスティング治具の差込み溝に差込んでその
前後面を支え、リードフレームの姿勢をキャスティング
治具の凹窩内で規制して樹脂封止することを特徴とする
キャスティングモールド製造法。(1) Insert the lower end of the lead frame suspended from the casting jig into the insertion groove of the casting jig to support its front and rear surfaces, regulate the posture of the lead frame within the recess of the casting jig, and seal with resin. A casting mold manufacturing method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10703482A JPS58223336A (en) | 1982-06-22 | 1982-06-22 | Manufacture of casting mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10703482A JPS58223336A (en) | 1982-06-22 | 1982-06-22 | Manufacture of casting mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58223336A true JPS58223336A (en) | 1983-12-24 |
| JPS6255297B2 JPS6255297B2 (en) | 1987-11-19 |
Family
ID=14448836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10703482A Granted JPS58223336A (en) | 1982-06-22 | 1982-06-22 | Manufacture of casting mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58223336A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469063A (en) * | 1977-11-11 | 1979-06-02 | Omron Tateisi Electronics Co | Manufacture of electronic device |
-
1982
- 1982-06-22 JP JP10703482A patent/JPS58223336A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469063A (en) * | 1977-11-11 | 1979-06-02 | Omron Tateisi Electronics Co | Manufacture of electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6255297B2 (en) | 1987-11-19 |
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