JPS54152971A - Transfer molding method for semiconductor device - Google Patents
Transfer molding method for semiconductor deviceInfo
- Publication number
- JPS54152971A JPS54152971A JP6110778A JP6110778A JPS54152971A JP S54152971 A JPS54152971 A JP S54152971A JP 6110778 A JP6110778 A JP 6110778A JP 6110778 A JP6110778 A JP 6110778A JP S54152971 A JPS54152971 A JP S54152971A
- Authority
- JP
- Japan
- Prior art keywords
- header
- size
- resin
- semiconductor device
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prevent the generation of a resin flash on the reverse surface of the header of a semiconductor device under no influence of the dispersion of the thickness of a header plate and its curvature, by providing an open part for the header to the mold surface of an upper mold.
CONSTITUTION: To the mold surface of cavity block 13 of the upper mold, escape part 14 of size (d) [0.1 to 0.2mm] equivalent to the size and shape of header 6 is provided and at its circumference, chamfering of =45° or taper 14a is provided to absorb the dispersion of the shape and size, so that the circumference of header 6 will come in contact at taper 14a without fail. With this contact setting, resin injection causes no immersion of resin into the reverse surface of the header, and consequently no resin flash occurs, so that since the metal surface of the reverse surface of header 6 is exposed, heat-dissipation effect will be excellent at the time of fixation to the heat sink.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6110778A JPS54152971A (en) | 1978-05-24 | 1978-05-24 | Transfer molding method for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6110778A JPS54152971A (en) | 1978-05-24 | 1978-05-24 | Transfer molding method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54152971A true JPS54152971A (en) | 1979-12-01 |
Family
ID=13161514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6110778A Pending JPS54152971A (en) | 1978-05-24 | 1978-05-24 | Transfer molding method for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54152971A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5441684A (en) * | 1993-09-24 | 1995-08-15 | Vlsi Technology, Inc. | Method of forming molded plastic packages with integrated heat sinks |
-
1978
- 1978-05-24 JP JP6110778A patent/JPS54152971A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5441684A (en) * | 1993-09-24 | 1995-08-15 | Vlsi Technology, Inc. | Method of forming molded plastic packages with integrated heat sinks |
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