JPS54152971A - Transfer molding method for semiconductor device - Google Patents

Transfer molding method for semiconductor device

Info

Publication number
JPS54152971A
JPS54152971A JP6110778A JP6110778A JPS54152971A JP S54152971 A JPS54152971 A JP S54152971A JP 6110778 A JP6110778 A JP 6110778A JP 6110778 A JP6110778 A JP 6110778A JP S54152971 A JPS54152971 A JP S54152971A
Authority
JP
Japan
Prior art keywords
header
size
resin
semiconductor device
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6110778A
Other languages
Japanese (ja)
Inventor
Keizo Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6110778A priority Critical patent/JPS54152971A/en
Publication of JPS54152971A publication Critical patent/JPS54152971A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the generation of a resin flash on the reverse surface of the header of a semiconductor device under no influence of the dispersion of the thickness of a header plate and its curvature, by providing an open part for the header to the mold surface of an upper mold.
CONSTITUTION: To the mold surface of cavity block 13 of the upper mold, escape part 14 of size (d) [0.1 to 0.2mm] equivalent to the size and shape of header 6 is provided and at its circumference, chamfering of =45° or taper 14a is provided to absorb the dispersion of the shape and size, so that the circumference of header 6 will come in contact at taper 14a without fail. With this contact setting, resin injection causes no immersion of resin into the reverse surface of the header, and consequently no resin flash occurs, so that since the metal surface of the reverse surface of header 6 is exposed, heat-dissipation effect will be excellent at the time of fixation to the heat sink.
COPYRIGHT: (C)1979,JPO&Japio
JP6110778A 1978-05-24 1978-05-24 Transfer molding method for semiconductor device Pending JPS54152971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6110778A JPS54152971A (en) 1978-05-24 1978-05-24 Transfer molding method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6110778A JPS54152971A (en) 1978-05-24 1978-05-24 Transfer molding method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54152971A true JPS54152971A (en) 1979-12-01

Family

ID=13161514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6110778A Pending JPS54152971A (en) 1978-05-24 1978-05-24 Transfer molding method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54152971A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks

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