JPS6086900A - Handler for measuring semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to a handler for semiconductor devices that inspects the electrical characteristics and external dimensions of semiconductor devices.

[Prior art]

In semiconductor devices, defects in external dimensions may occur due to bending of the leads, etc. Therefore, a separate visual inspection is performed when necessary.

An example of a semiconductor device measurement handler (hereinafter referred to as handler) that has been widely used in the past is shown in FIG.

In the figure, 1 is a magazine case containing a semiconductor device to be measured before electrical measurement, 2 is a measuring instrument for testing the electrical characteristics of the semiconductor device to be measured, 3 is a transport path, and 4 is a semiconductor device after measurement has been completed. It is a storage section that stores. In this type of conventional device, semiconductor devices to be measured placed in a magazine case 1 pass through a transport path 3 and stop at a measuring device 2, where their electrical characteristics are inspected, and only non-defective devices are passed through the transport path 3. It is stored in the storage section 4. Therefore, in this case, a semiconductor device with an abnormal lead shape and defective external dimensions cannot be removed in this process, so a separate process such as external appearance checking is required.

[Purpose of the invention]

The present invention provides an apparatus that can automatically inspect the external dimensions and electrical characteristics of a semiconductor device.

[Structure of the invention]

The present invention installs a measuring device for inspecting the electrical characteristics of the semiconductor device and a measuring device for inspecting whether the external dimensions of the semiconductor device are within the specifications, in the middle of a transportation path for transferring the semiconductor device, and This handler for semiconductor device measurement is characterized by being equipped with a mechanism for removing defective products from a conveyance path based on determination signals output from each measuring device.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 2 shows an embodiment of the present invention, and FIG.
FIG. 4 shows each measuring device in FIG. 1 in an enlarged manner.

In Figure 2, 1 is a magazine case, 2 is a measuring device for testing electrical characteristics, 3 is a transport path, and 5 and 6 are the external dimensions of the semiconductor device to be measured, respectively, in a plane perpendicular to the transport direction and parallel to the transport direction. It is a measuring instrument that measures from various aspects.

As shown in FIG. 3, the measuring instrument 5 for inspecting the external dimensions of a semiconductor device perpendicular to the transport direction is composed of an upper frame 5α and a lower frame 5b which are vertically combined at a separation surface 7. 5b is provided with a pedestal 5G that supports the semiconductor device IC between its leads R1 and R2, and side grooves 5d and 5d are provided on both sides of the pedestal 5c to receive the leads R□ and R2, which are opened in a square shape with standard external dimensions. . Further, a semiconductor device IC is provided on the lower surface of the upper frame 5a.
A recess 5e is provided to receive the semiconductor device, and the recess 5e and side groove 5d are monitored to see if a semiconductor device, such as a combination of a phototransistor and a light-receiving element, passes through the side groove and recess of 9% above and below 5a and 5b. A determination element 5f for determining defective products is installed. On the other hand, the measuring device 5 is provided with a handling mechanism 9 that pushes the upper frame 5a upward from the separation surface 7 and removes defective products from the conveyance path based on the cutting signal from the determination element 5f.

As shown in FIG. 4, the measuring device 6 for inspecting external dimensions in a plane parallel to the conveyance path has a main body 6a with a plurality of comb-shaped side grooves 6b corresponding to the leads R, R2 of the semiconductor device IC.
6b..., and in the gutter 6b, there is a determination element 6G that monitors whether a semiconductor device passes through the side groove, such as a combination of a phototransistor and a light receiving element, and determines whether it is in good condition or defective. Set up. On the other hand, a removal jig 8 is attached to the measuring device 6, which is inserted into the lower part of the defective semiconductor device IC and removed from the conveyance path based on the output signal of the determination element 6G.

Further, downstream of the measuring device 2, a handling mechanism 10 is installed which removes defective products from the conveyance path 3 based on the determination signal outputted by the measuring device 2.

In this embodiment, only when the external dimensions of the measured object as seen from two directions are within the standard, the measured object is equipped with two external dimension measuring instruments 5.
, 6, but cannot pass if it is out of specification.
Similar effects can be obtained using other types of external dimension measuring instruments.

In the handler shown in FIG. 2, a semiconductor device to be measured passes through a conveyance path 3 from a magazine case 1, is once placed in a measuring device 2, and its electrical characteristics are measured, and if it is a good product, it is transferred to an external dimension measuring device 5. Defective products are removed from the conveyance path 3 by the handling mechanism 10.

Next, when the non-defective products pass through an external dimension measuring device 5 installed in the middle of the transport path 3, the external dimensions in a plane perpendicular to the transport direction are measured to see if they meet the standards. It is sent to the external dimension measuring device 6. -1 Defective products are removed by the handling mechanism 9 attached to the measuring device 5. Finally, when passing through the external dimension measuring device 6, the external dimensions on a plane parallel to the conveyance path are measured to see if they meet the specifications, and non-defective products that meet the specifications are stored in the storage section 4. -1 Defective product is measuring device 6
It is removed by a removal jig 8 attached to the. Therefore,
A semiconductor device that has passed through this handler undergoes electrical measurements and external dimension measurements at the same time, and the handler according to the present invention can simultaneously perform electrical measurements and external dimension measurements of a semiconductor device, which were conventionally performed separately. In this case, if there is a defect in the external dimensions, the semiconductor device to be measured will get caught in the external dimension measuring device 5 or 6, but an example of preventing this unnecessary time loss is shown in FIG.

In FIG. 5, a conveyance path 3cL is connected to the magazine case 1, and a measuring device 2 for testing electrical characteristics is installed in the middle of the conveying path 3a. A handling mechanism 10 is installed to remove defective products from the conveyance path 3α based on the handling mechanism.

The conveyance path 3CL is branched, and external dimension measuring instruments 5 and 5' of the same type shown in FIG. External dimension measuring instruments 6 and 6' of the same type shown in FIG. 4 are installed in parallel on the branch paths 3d and 3g. And two branch roads 3d.

3e are merged and connected to the storage section 4. Further, a path switching device 11 is provided at the confluence of the branch paths 3b, 3c, 3d, and 3g.
12 are installed respectively, and the upstream passage switching device 11 is driven by the judgment signal output from the measuring devices 5 and 5', and the -1 downstream passage switching device 12 is driven by the judgment signal output at measurement 2S6+6'. Driven by a signal. In FIG. 5, by installing the same type of external dimension measuring instruments 5' and 6' in parallel with the external dimension measuring instruments 5 and 6, if the semiconductor device to be measured gets caught in the external dimension measuring instruments 5 or 6', the Switcher ii, 12
This is to prevent time loss for the handler by switching the conveyance path and guiding the subsequent semiconductor device to be measured to the external dimension measuring device 5' or 6' installed in parallel.

In the above explanation, the measuring devices 5 and 6 for measuring the product external shape are installed after the measuring device 2 that measures the electrical characteristics, but by reversing the arrangement, the measuring devices 5 and 6 for measuring the product external shape are placed in front of the measuring device 2. It becomes even more effective by providing the That is, it is possible to prevent the measuring device 2 from being damaged if a product with an abnormal external dimension flows, or from discarding a product with a mild external dimension that should normally be a non-defective product as having a defective electrical characteristic.

〔Effect of the invention〕

As explained above, the present invention has the effect of being able to simultaneously perform the inspection of electrical characteristics and external dimensions, which have conventionally been carried out separately, thereby improving work efficiency.

[Brief explanation of drawings]

Fig. 1 is a block diagram of a conventional handler, Fig. 2 is a block diagram showing an embodiment of the handler according to the present invention, Fig. 3 is a sectional view showing one of the external dimension measuring instruments in Fig. FIG. 2 is a perspective view showing the other external dimension measuring instrument, and FIG. 5 is a configuration diagram showing another embodiment of the present invention. 2... Measuring device, 3... Conveyance path, 5, 5', 6
, 6'... Measuring instrument, 8゜9.10... Mechanism for removing defective products from the conveyance path Patent applicant Nippon Denki Shiki Co., Ltd.

Claims (1)

[Claims] (1) A measuring device is installed along the transport path for semiconductor devices to check the electrical characteristics of the semiconductor devices, and whether the external dimensions of the semiconductor devices, such as width, length, thickness, and lead spacing, are within the specifications. A handler for measuring semiconductor devices, characterized in that the handler is equipped with a measuring device for inspecting the quality of the product, and a no-undling mechanism that removes defective products from a conveyance path based on judgment signals output from each measuring device. .