JPS54162475A - Inspection unit for semiconductor device - Google Patents

Inspection unit for semiconductor device

Info

Publication number
JPS54162475A
JPS54162475A JP7193678A JP7193678A JPS54162475A JP S54162475 A JPS54162475 A JP S54162475A JP 7193678 A JP7193678 A JP 7193678A JP 7193678 A JP7193678 A JP 7193678A JP S54162475 A JPS54162475 A JP S54162475A
Authority
JP
Japan
Prior art keywords
tester
defective
set times
inspection
contents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7193678A
Other languages
Japanese (ja)
Inventor
Michio Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7193678A priority Critical patent/JPS54162475A/en
Publication of JPS54162475A publication Critical patent/JPS54162475A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To avoid the misjudgement due to failed prober and IC tester, by inspecting semiconductor chips according to an arbitrary set times and automatically stopping the inspection when defects are continued under the set times.
CONSTITUTION: The inspected semiconductor wafer 4 is vacuumadsorbed on the stand 3, and the measuring probe 2 is in contact with each chip. Fuether, the probe 2 is connected to the IC tester 6 by using the cable 5, and the tester 6 is connected to the control unit 8 via the continuous defect inspection circuit 7. Moreover, the tester 6 is connected to the control section 9 connecting the marker 1. Thus, the inspection unit is constituted and the contents between the continuous defect detection circuit 7 in which the number of counts is increased every time when the defective signal is incoming and the control section 9 memorizing the number of set times is compared with each other, and it is judged as defective when the contents are in agreement. Thus, it can avoid the misjudgement for non-defective devices as defective devices in error.
COPYRIGHT: (C)1979,JPO&Japio
JP7193678A 1978-06-13 1978-06-13 Inspection unit for semiconductor device Pending JPS54162475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7193678A JPS54162475A (en) 1978-06-13 1978-06-13 Inspection unit for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7193678A JPS54162475A (en) 1978-06-13 1978-06-13 Inspection unit for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54162475A true JPS54162475A (en) 1979-12-24

Family

ID=13474884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7193678A Pending JPS54162475A (en) 1978-06-13 1978-06-13 Inspection unit for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54162475A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165649A (en) * 1988-12-20 1990-06-26 Nec Corp Probe card
JPH0360140A (en) * 1989-07-28 1991-03-15 Tokyo Electron Ltd Semiconductor inspecting method and inspecting equipment using the same
JPH0466883A (en) * 1990-07-09 1992-03-03 Nec Kyushu Ltd Monitor burn-in apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165649A (en) * 1988-12-20 1990-06-26 Nec Corp Probe card
JPH0360140A (en) * 1989-07-28 1991-03-15 Tokyo Electron Ltd Semiconductor inspecting method and inspecting equipment using the same
JPH0466883A (en) * 1990-07-09 1992-03-03 Nec Kyushu Ltd Monitor burn-in apparatus

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