KR100251510B1 - Floor device of solder ball bumping system of bga semiconductor package - Google Patents

Floor device of solder ball bumping system of bga semiconductor package Download PDF

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Publication number
KR100251510B1
KR100251510B1 KR1019970034520A KR19970034520A KR100251510B1 KR 100251510 B1 KR100251510 B1 KR 100251510B1 KR 1019970034520 A KR1019970034520 A KR 1019970034520A KR 19970034520 A KR19970034520 A KR 19970034520A KR 100251510 B1 KR100251510 B1 KR 100251510B1
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KR
South Korea
Prior art keywords
pcb
solder ball
holder
semiconductor package
floor device
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KR1019970034520A
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Korean (ko)
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KR19990011427A (en
Inventor
이규형
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김규현
아남반도체주식회사
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Priority to KR1019970034520A priority Critical patent/KR100251510B1/en
Publication of KR19990011427A publication Critical patent/KR19990011427A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Abstract

PURPOSE: A floor device of a solder ball bumping system for a BGA semiconductor package is provided to easily supply PCB to a material setting part of a table. CONSTITUTION: A floor device(40) receives a PCB from a pusher part of a solder ball bumping system to guide the PCB to a table. A guide rail(40A) is installed on a holder(40A) in left and right sides for the PCB to be slidably moved. A motor is installed on the guide rail(40A). A belt(41) is connected to the motor(42). A stopper(44) is installed on a cylinder(44A) to be upwardly and downwardly moved on a central part of the holder(40A). A cylinder(45A) is installed on a block, upwardly and downwardly moved on other end of the holder(40A), and permits the PCB to be seated therein. A sensor(43) is formed on an upper part of a side end of the holder(40A) to confirm whether a material is supplied and a right position of the PCB. A robot A(R1) is installed on a base of other side of the holder(40A), refracted in multi-steps, and grips the PCB.

Description

ＢＧＡ 반도체패키지의 솔더볼범핑시스템의 플로어장치Floor device for solder ball bumping system of semiconductor package

본 발명은 BGA 반도체패키지용 솔더볼범핑시스템의 플로어장치에 관한 것으로서, 특히 BGA 반도체패키지의 PCB에 형성된 랜드에 플럭스 도포와 솔더볼의 공급안치를 위한 PCB를 푸셔부에서 순차적으로 공급받아 테이블의 자재셋팅부로 공급될 수 있게 한 BGA 반도체패키지용 솔더볼범핑시스템의 플로어장치에 관한 것이다.The present invention relates to a floor device of a solder ball bumping system for a BGA semiconductor package, and in particular, a PCB for flux coating and solder ball supply to lands formed on a PCB of a BGA semiconductor package is sequentially supplied from a pusher to a material setting part of a table. A floor device of a solder ball bumping system for a BGA semiconductor package that can be supplied.

일반적으로 솔더볼범핑시스템은 BGA 반도체패키지의 랜드에 융착되는 솔더볼을 공급시킬 수 있게 한 것이다.In general, the solder ball bumping system enables the supply of solder balls fused to lands of a BGA semiconductor package.

이러한 BGA 반도체패키지는 PCB(P)의 일측면(배면)에 다수의 랜드(L)가 형성되고, 이 랜드에 각각 솔더볼을 융착구비하여 신호 인출단자의 기능을 갖도록 한 것이다.The BGA semiconductor package has a plurality of lands L formed on one side (back side) of the PCB P, and each solder ball is welded to the lands so as to have a function of a signal extraction terminal.

상기한 BGA 반도체패키지에 안착되는 솔더볼은 PCB에 형성된 랜드에 정확한 위치로 안착되도록 해야 안정된 제품의 BGA 반도체패키지를 구현할 수 있었다.The solder ball seated on the BGA semiconductor package has to be seated at the correct position on the land formed on the PCB to realize the stable BGA semiconductor package.

그러나 종래에는 솔더볼을 PCB의 랜드에 안치시킬 때 수작업으로 플럭스를 도포한 상태에서 티져(Tweezer) 및 핀셋을 이용하여 공급안치시킴에 따라 작업자의 부주위에 의한 솔더볼의 공급 정확성을 기하지 못하였고, 공급안치 작업성을 저하시키는 요인이 되었으며, 제품의 불량을 초래하는 문제점을 발생시켰다.However, in the past, when the solder ball is placed on the land of the PCB, the supply of the solder ball by the periphery of the operator cannot be determined by supplying the flux by using a tweezer and tweezers with flux applied by hand. It was a factor that lowered the settlement workability, and caused a problem that caused product defects.

본 발명의 상기와 같은 종래의 문제점을 해결하기 위하여 발명한 것으로, BGA 반도체패키지의 PCB에 구비된 랜드에 플럭스 도포와 솔더볼을 안치시키는 솔더볼범핑시스템의 푸셔부에서 순차적으로 공급되는 PCB가 정상적인 상태로 공급되는 지를 확인할 수 있도록 홀더에 센서와, 안내레일과 벨트와 스톱퍼와 블록을 가진한 플로어장치를 구비하여 다음 공정인 테이블의 자재 셋팅부로 용이하게 PCB를 공급시킬 수 있게 한 것을 목적으로 한다.Invented to solve the above conventional problems of the present invention, the PCB is sequentially supplied from the pusher portion of the solder ball bumping system to place the flux ball and solder ball on the land provided in the PCB of the BGA semiconductor package in a normal state A floor device with a sensor, a guide rail, a belt, a stopper, and a block is provided in the holder so that the supply can be easily supplied to the material setting part of the table.

도 1은 본 발명의 플로어장치가 적용된 솔더볼범핑시스템의 평면구성도.1 is a plan view of a solder ball bumping system to which the floor apparatus of the present invention is applied.

도 2는 본 발명의 플로어장치가 적용된 솔더볼범핑시스템의 정면구성도.Figure 2 is a front configuration diagram of a solder ball bumping system to which the floor device of the present invention is applied.

도 3은 본 발명의 플로어장치가 적용된 플로어장치의 평면도.3 is a plan view of a floor apparatus to which the floor apparatus of the present invention is applied.

도 4는 본 발명의 플로어장치의 정면도.4 is a front view of the floor apparatus of the present invention.

도 5는 본 발명의 플로어장치의 우측면도.5 is a right side view of the floor apparatus of the present invention.

도 6은 본 발명의 플로어장치의 작동상태도.Figure 6 is an operating state of the floor device of the present invention.

도 7 은 본 발명에 적용되는 PCB의 평면도.7 is a plan view of a PCB applied to the present invention.

도 8은 본 발명의 플로어장치가 적용된 전체시스템의 작동상태도.8 is an operating state of the entire system to which the floor apparatus of the present invention is applied.

(도면의 주요 부부에 대한 부호 설명)(Sign description for the main couple of drawings)

10 ; 솔더볼범핑시스템 11 ; 베이스10; Solder ball bumping system 11; Base

30 ; 푸셔부 40 ; 플로어장치30; Pusher 40; Floor device

40A ; 홀더 41 ; 벨트40A; Holder 41; belt

42 ; 모터 43 ; 센서42; Motor 43; sensor

44 ; 스톱퍼 44A ; 실린더44; Stopper 44A; cylinder

45 ; 블록 45A ; 실린더,45; Block 45A; cylinder,

P ; PCB R1 ; 로보트AP; PCB R1; Robot A

G ; 그립퍼G; Gripper

이 하 본 발명의 구성을 설명하면 다음과 같다.Hereinafter, the configuration of the present invention will be described.

BGA 반도체패키지의 PCB(P)에 형성된 랜드(L)에 플럭스 도포와 솔더볼(SB)을 공급안치시킬 수 있게 한 솔더볼범핑시스템(10)의 푸셔부(30)에서 PCB(P)가 순차적으로 공급된 것을 테이블(50)로 안내하는 플로어장치(40)와 ;The PCB (P) is sequentially supplied from the pusher part 30 of the solder ball bumping system 10 which allows flux application and solder ball SB to be settled on the land L formed on the PCB P of the BGA semiconductor package. A floor device 40 for guiding the old one to the table 50;

상기 PCB(P)가 슬라이드 이동될 수 있도록 상부의 좌우 양측으로 안내레일(40A)과 안내레일(40A)에 모터(42) 와 연결된 벨트(41)가 구비된 홀더(40A)와 ;A holder (40A) provided with a guide rail (40A) and a belt (41) connected to the motor (42) on the guide rails (40A) and the guide rails (40A) on both sides of the upper side to slide the PCB (P);

상기 홀더(40A)의 중앙부에 상하 업다운될 수 있도록 실린더(44A)에 설치된 스톱퍼(44)와 ;A stopper 44 mounted to the cylinder 44A so as to be moved up and down in the center portion of the holder 40A;

상기 홀더(40A)의 타측단에 상하 업다운되고 PCB(P)가 안치될 수 있도록 실린더(45A)가 설치된 블록(4)과 ;A block (4) provided with a cylinder (45A) so as to be vertically up and down at the other end of the holder (40A) and the PCB (P) can be placed therein;

상기 홀더(40A)의 일측단 상부에 PCB(P)의 정위치와 자재의 공급유무를 확인할 수 있는 센서(43)와 ;A sensor (43) capable of checking the exact position of the PCB (P) and the presence or absence of material supply on an upper end of one side of the holder (40A);

상기 홀더(40A)의 타측 베이스(11)에 다단 굴절되고 하부에 PCB(P)를 그립할 수 있게 한 로보트A(R1)와 ;A robot A (R1) which is multi-stage refracted to the other base 11 of the holder 40A and grips the PCB (P) at the bottom thereof;

를 포함하는 것이다.It will include.

이와 같이 구성된 본 발명의 일 실시예를 첨부도에 의하여 상세히 설명하면 다음과 같다.An embodiment of the present invention configured as described above will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 플로어장치가 적용된 솔더볼범피시스템의 전체 평면도이고, 도 2는 본 발명의 정면도이며, 도 3은 본 발명의 우측면도로서, 솔더볼범핑시스템(10)의 베이스(11) 일측상부 전후방으로 인풋부(20)를 구비하고, 인풋부(20)의 전방에는 푸셔부(30)를 구비한다.1 is an overall plan view of a solder ball bumping system to which a floor apparatus of the present invention is applied, FIG. 2 is a front view of the present invention, and FIG. 3 is a right side view of the present invention, and an upper portion of the base 11 of the solder ball bumping system 10 is provided. The input unit 20 is provided in front and rear, and the pusher unit 30 is provided in front of the input unit 20.

상기 푸셔부(30)의 타측방향 베이스(11) 상부에는 플로어장치(40)를 구비한다.The floor device 40 is provided on the other side of the base 11 of the pusher 30.

상기 플로어장치(40)는 홀더(40B)의 상부에 좌우측으로 안내레일(40A)을 구비하고, 안내레일(40A)에는 벨트(41)를 구비하여 모터(42)에 연결시킨다.The floor device 40 includes a guide rail 40A on the left and right sides of the holder 40B, and a belt 41 is connected to the motor 42 by the guide rail 40A.

상기 홀더(40B)의 중앙부에는 업다운되는 스톱퍼(44)를 구비하고, 스톱퍼(44)의 하부는 실린더(44A)와 연결시킨다.A central portion of the holder 40B is provided with a stopper 44 which is up and down, and a lower portion of the stopper 44 is connected to the cylinder 44A.

상기 홀더(40B)의 일측 상부에는 PCB(P)를 감지하는 센서(43)를 설치한다.The upper side of one side of the holder 40B is installed with a sensor 43 for detecting the PCB (P).

상기 홀더(40B)의 타측 상부 중앙에는 업/다운되는 블록(45)을 구비하고, 블록(45)의 하부에는 실린더(45A)를 구비하고, 상기 스톱퍼(44)는 좌우측단 상부를 돌출시켜 중앙부에 PCB(P)가 안치될 수 있는 안치부(45B)를 형성한 것이다.The upper portion of the upper portion of the holder 40B has a block 45 that is up / down, a lower portion of the block 45 has a cylinder 45A, and the stopper 44 protrudes from the upper left and right ends thereof. PCB (P) is to form a settled portion (45B) that can be placed on.

상기한 플로어장치(40)의 타단 베이스(11)에는 자유 굴절 및 상하 업다운되는 로보트A(R1)를 설치하고, 로보트A(R1)의 하부에는 전후 이송가능한 그립퍼(G)를 설치하며, 상기 로보트A(R1)의 후방 베이스(11) 에는 회전가능한 테이블(50)을 구비하고, 테이블(50)의 상부에는 다수의 자재셋팅부(60)를 구비한다.The other end base 11 of the floor device 40 is provided with a robot A (R1) that is freely deflected and up and down, and a gripper (G) that can be moved back and forth is installed below the robot A (R1). The rear base 11 of A (R1) is provided with a rotatable table 50, and the upper portion of the table 50 is provided with a plurality of material setting portion (60).

상기 플로어장치(40)의 후방과 인풋부(20)의 타측부인 베이스(11)에는 회전가능한 테이블(50)을 구비하고, 테이블(50) 상부에는 다수의 자재 셋팅부(60)를 구비한다.The base 11, which is the rear of the floor apparatus 40 and the other side of the input unit 20, includes a rotatable table 50, and a plurality of material setting units 60 is provided on the table 50. .

상기 플로어장치(40)의 후방과 인풋부(20)의 타측부인 베이스(11) 상부에는 프린터부(70)를 구비하고, 프린터부(70)의 후방과 인풋부(20)의 후방위치인 베이스(11) 상부에는 솔더볼 공급부(80)를 구비한다.The printer unit 70 is provided on the rear of the floor apparatus 40 and the upper portion of the base 11, which is the other side of the input unit 20, and is located at the rear of the printer unit 70 and the rear of the input unit 20. The solder ball supply unit 80 is provided on the base 11.

또한 볼 공급부(80) 타측과 자재배출부(100)후방의 베이스(11)에는 각각 다단 굴절 및 상/하 업다운되는 로보트B, C(R2)(R3)를 구비하고, 로보트B(R2)의 하부에는 솔더볼(SB)을 흡차시킬 수 있도록 솔더볼 툴(82)을 착탈식으로 고정하는 툴 고정구(81)가 구비되며, 로보트C(R3)의 합에는 PCB(P)를 그립하는 그립퍼(G)를 구비한다.In addition, the base 11 of the other side of the ball supply unit 80 and the rear of the material discharge unit 100 is provided with robots B, C (R2) and R3 which are multi-stage refracted and up / down, respectively. The lower part is provided with a tool fixture 81 for detachably fixing the solder ball tool 82 to suck the solder ball (SB), the gripper (G) to grip the PCB (P) to the sum of the robot C (R3). Equipped.

이와 같이 된 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention as described above is as follows.

탑재부에 반도체 칩이 부착되고, 패키지성형이 완료된 BGA 반도체패키지의 PCB(P)를 도 8과 같이 매거진(M)에 적층수납시킨 상태에서 인풋부(20)의 벨트(22) 상부에 다수의 매거진(M) 을 안치시키면 모터(21)의 작동으로 이송하는 벨트(22)에 의해 매거진(M)이 순차적으로 이동하여 스톱퍼(25)에 접촉된다.A plurality of magazines are mounted on the belt 22 of the input unit 20 in a state in which a semiconductor chip is attached to the mounting portion and the PCB P of the BGA semiconductor package in which package molding is completed is stacked and stored in the magazine M as shown in FIG. 8. When M is settled, the magazine M is sequentially moved by the belt 22 conveyed by the operation of the motor 21, and it contacts the stopper 25. As shown in FIG.

상기 스톱퍼(25)에 매거진(M)이 접촉되면 그립퍼(27)의 센서(26)가 매거진(M)을 감지하여 그립퍼(27)를 동작시킴으로서 매거진(M)의 좌우 양측을 그립하고, 동시에 스톱퍼(25)가 하향 이송하여 매거진(M)의 전방을 개방시킨다.When the magazine M comes into contact with the stopper 25, the sensor 26 of the gripper 27 detects the magazine M to operate the gripper 27 to grip the left and right sides of the magazine M, and simultaneously the stopper. (25) transfers downward to open the front of the magazine (M).

이 상태에서 그립퍼(27)는 전방으로 이송하여 엘리베이터(29A)에 구비된 메거진 안치구(29)에 매거진(M)을 안치시키고 동시에 센서의 감지에 의해 상부의 매거진 고정부(29B)가 하강하여 매거진(M)을 고정시킨다.In this state, the gripper 27 moves forward to settle the magazine M in the magazine fixture 29 provided in the elevator 29A, and at the same time, the upper magazine fixing part 29B is lowered by the detection of the sensor. Secure the magazine (M).

매거진(M)이 고정되면 엘리베이터(29A)의 순차적인 하강 작동과 푸셔부(30)의 순차적인 좌우 작동으로 매거진(M) 내의 PCB(P)를 밀어 도 6과 같이 플로어장치(40)의 안내부(40A)에 공급시킨다.When the magazine M is fixed, the floor device 40 is guided by pushing the PCB P in the magazine M by the sequentially descending operation of the elevator 29A and the sequential left and right operation of the pusher unit 30. It supplies to the part 40A.

안내부(40A)에 공급된 PCB(P)는 모터(42)에 의해 작동하는 벨트(41)를 따라 타측으로 이동하여 블록(45)의 상부에 위치한다.The PCB P supplied to the guide portion 40A moves to the other side along the belt 41 operated by the motor 42 and is positioned above the block 45.

PCB(P)가 블록(45)의 상부에 위치되면 실린더(45A)의 작동으로 상기 블록(45)이 상승되어 안치부(45B) 상부면에 PCB(P)가 안치된 상태로 안내레일(40A)에서 PCB(P)를 분리시킨다.When the PCB (P) is located on the upper portion of the block 45, the guide 45 (40A) in a state in which the block 45 is raised by the operation of the cylinder 45A and the PCB (P) is placed on the upper surface of the mounting portion 45B. ) Separate PCB (P) from

상기 PCB(P)가 분리되면 로보트A(R1)의 그립퍼(G)가 하강하여 PCB(P)의 전후방 양면(길이방향의 양측면)을 그립시킨 상태에서 상승한후 플로어장치(40)와 근접되는 위치에 있는 테이블(50)의 자재셋팅부(60) 상부에 PCB(P)를 공급 안치시킨다.When the PCB (P) is separated, the gripper (G) of the robot A (R1) descends and rises in a state where the front and rear surfaces (both sides in the length direction) of the PCB (P) are gripped, and then the position close to the floor device 40 PCB (P) is placed in the upper part of the material setting part 60 of the table 50 in the supply.

이때 플로어장치(40)의 안내레일(40A)에 연속적으로 공급되는 PCB(P)는 센서(43)가 PCB(P) 양측에 어긋나도록 형성된 홀(H)의 위치를 감지하여 정상적으로 PCB(P)의 공급이 이루어진 것을 확인할 수 있게 하고, 블록(45)에 안치된 PCB(P)가 다음 공정인 테이블(50)로 이동되지 않은 상태에서 공급되는 차순의 PCB(P)가 블록(50)으로 공급되지 못하도록 실린더(44A)의 작동으로 스톱퍼(44)를 상승시켜 PCB(P)의 진행을 일시 정지시킨 다음 PCB(P)가 블록(50)에서 배출된 다음 이송되도록 한 것이다.At this time, the PCB (P) continuously supplied to the guide rail (40A) of the floor device 40 detects the position of the hole (H) formed so that the sensor 43 on both sides of the PCB (P), the PCB (P) normally It is possible to confirm that the supply of, and the PCB (P) in the order that is supplied in the state that the PCB (P) placed in the block 45 is not moved to the table 50 which is the next process is supplied to the block 50 In order to prevent the operation of the cylinder 44A, the stopper 44 is raised to pause the progress of the PCB P, and then the PCB P is discharged from the block 50 and then transported.

이렇게 테이블(50)의 자재셋팅부(60)에 PCB(P)가 안치되면 구동모터(51)의 구동으로 테이블(50)을 회전시켜 PCB(P)를 프린터부(70)의 하부에 위치시킨다.When the PCB (P) is placed in the material setting part 60 of the table 50, the table 50 is rotated by driving the driving motor 51 to place the PCB P below the printer part 70. .

상기 프린터부(70)는 PCB(P)의 표면에 접촉되도록 하강한 상태에서 스크린(72) 상부에 구비된 브레이드(71)를 좌우 이동시켜 플럭스를 고르게 밀면 스크린(72)에 형성된 홀(72A)을 통해 PCB(P)의 각 랜드(L)에 도포된다.The printer unit 70 moves left and right by moving the braid 71 provided on the upper screen 72 in a state where the printer 70 is lowered to contact the surface of the PCB P. The hole 72A is formed in the screen 72 by pushing the flux evenly. It is applied to each land (L) of the PCB (P) through.

플럭스의 도포가 완료되면 테이블(40)의 회전으로 PCB(P)를 솔더볼이 공급되는 볼공급부(80)로 이동한다.When the application of the flux is completed, the PCB 40 is moved to the ball supply unit 80 to which the solder balls are supplied by the rotation of the table 40.

PCB(P)가 볼공급부(80)에 위치하면 로보트B(R2)의 볼공급부(80)에 설치된 솔더볼 툴(82)이 솔더볼(SB)이 수납된 수납케이스(84)에서 솔더볼(SB)을 흡착시킨 상태로 PCB(P)의 상부에 위치하여 각 랜드(L)에 안치시킨다.If the PCB (P) is located in the ball supply unit 80, the solder ball tool 82 installed in the ball supply unit 80 of the robot B (R2) is the solder ball (SB) in the storage case 84 in which the solder ball (SB) is accommodated Located in the upper portion of the PCB (P) in the adsorbed state and placed in each land (L).

이때 솔더볼(SB)을 수납케이스(82)에서 흡착시킨 솔더볼 툴(82)이 이동할 때 더블볼 감지부(86)의 센서에 의해 솔더볼 툴(82)에 흡착된 더블볼 및 미스볼을 감지하여 비정상적으로 공급되는 솔더볼(SB)을 방지할 수 있게 한다.At this time, when the solder ball tool 82 having the solder ball SB adsorbed in the storage case 82 moves, the double ball and miss balls adsorbed to the solder ball tool 82 are detected by the sensor of the double ball detecting unit 86 and abnormal. It is possible to prevent the solder ball (SB) supplied to the.

상기 솔더볼(SB)의 안치가 완료되면 테이블(40)의 회동으로 검사부(90)에 위치하여 PCB(P)에 안치된 솔더볼(SB)의 정위치 확인 및 더블볼을 검사한다.When the settlement of the solder ball (SB) is completed, it is positioned in the inspection unit 90 by the rotation of the table 40 to check the correct position and double ball of the solder ball (SB) placed on the PCB (P).

검사완료된 PCB(P)는 테이블(50)의 회동으로 자재배출부(100)로 공급되는 제품의 PCB(P)가 로보트C(R3)의 그립퍼(G)그립에 의하여 노(120)와 연결된 이송벨트(V)로 공급되고 솔더볼(SB)의 안치가 불량품인 PCB(P)는 자재배출부(100)에서 빈 매거진(BM)에 순차적으로 배출시킬 수 있게 한 것이다.Inspected PCB (P) is transferred to the furnace 120 by the gripper (G) grip of the robot C (R3) of the product supplied to the material discharge unit 100 by the rotation of the table 50 PCB (P) which is supplied to the belt (V) and the placement of the solder ball (SB) is defective is to be sequentially discharged to the empty magazine (BM) in the material discharge unit (100).

이상에서와 같이 본 발명은 BGA 반도체패키지의 PCB에 구비된 랜드에 플럭스 도포와 솔더볼을 안치시키는 솔더볼범핑시스템의 푸셔부에서 순차적으로 공급되는 PCB가 정상적인 상태로 공급되는 지를 확인할 수 있도록 홀더에 센서와, 안내레일과 벨트와 스톱퍼와 블록을 가진한 플로어장치를 구비하여 푸셔부에서 매거진에 수납된 PCB를 공급받아 순차적으로 테이블의 자재셋팅부에 공급안치될 수 있게 하므로서 PCB의 자재공급을 원활하게 하고, 솔더볼의 작업성을 향상시킬 수 있는 효과가 있다.As described above, the present invention provides a sensor and a holder in the holder so that the PCB sequentially supplied from the pusher part of the solder ball bumping system for flux application and land of the solder ball is placed on the land provided on the PCB of the BGA semiconductor package. It is equipped with a floor device with guide rail, belt, stopper and block, so that PCB can be supplied to the material setting part of the table in order by receiving the PCB stored in the magazine from the pusher part. There is an effect that can improve the workability of the solder ball.

Claims (1)

BGA 반도체패키지의 PCB(P)에 형성된 랜드(L)에 플럭스 도포와 솔더볼(SB)을 공급안치시킬 수 있게 한 솔더볼범핑시스템(10)의 푸셔부(30)에서 PCB(P)가 순차적으로 공급된 것을 테이블(50)로 안내하는 플로어장치(40)와 ;The PCB (P) is sequentially supplied from the pusher part 30 of the solder ball bumping system 10 which allows flux application and solder ball SB to be settled on the land L formed on the PCB P of the BGA semiconductor package. A floor device 40 for guiding the old one to the table 50; 상기 PCB(P)가 슬라이드 이동될수 있도록 상부의 좌우 양측으로 안내레일(40A)과 안내레일(40A)에 모터(42) 와 연결된 벨트(41)가 구비된 홀더(40A)와 ;A holder (40A) having a guide rail (40A) and a belt (41) connected to the motor (42) on the guide rails (40A) and the guide rails (40A) to the left and right sides of the upper part to slide the PCB (P); 상기 홀더(40A)의 중앙부에 상하 업다운될 수 있도록 실린더(44A)에 설치된 스톱퍼(44)와 ;A stopper 44 mounted to the cylinder 44A so as to be moved up and down in the center portion of the holder 40A; 상기 홀더(40A)의 타측단에 상하 업다운되고 PCB(P)가 안치될 수 있도록 실린더(45A)가 설치된 블록(4)과 ;A block (4) provided with a cylinder (45A) so as to be vertically up and down at the other end of the holder (40A) and the PCB (P) can be placed therein; 상기 홀더(40A)의 일측단 상부에 PCB(P)의 정위치와 자재의 공급유무를 확인할 수 있는 센서(43)와 ;A sensor (43) capable of checking the exact position of the PCB (P) and the presence or absence of material supply on an upper end of one side of the holder (40A); 상기 홀더(40A)의 타측 베이스(11)에 다단 굴절되고 하부에 PCB(P)를 그립할 수 있게 한 로보트A(R1)와 ;A robot A (R1) which is multi-stage refracted to the other base 11 of the holder 40A and grips the PCB (P) at the bottom thereof; 를 포함하는 것을 특징으로 하는 BGA 반도체패키지의 솔더볼범핑시스템의 플로어장치.Floor device of the solder ball bumping system of the BGA semiconductor package comprising a.
KR1019970034520A 1997-07-23 1997-07-23 Floor device of solder ball bumping system of bga semiconductor package KR100251510B1 (en)

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KR1019970034520A KR100251510B1 (en) 1997-07-23 1997-07-23 Floor device of solder ball bumping system of bga semiconductor package

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Application Number Priority Date Filing Date Title
KR1019970034520A KR100251510B1 (en) 1997-07-23 1997-07-23 Floor device of solder ball bumping system of bga semiconductor package

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KR100251510B1 true KR100251510B1 (en) 2000-05-01

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