KR100255184B1 - The solder ball tool apparatus for solder ball bumping system of bga semiconductor packages - Google Patents

The solder ball tool apparatus for solder ball bumping system of bga semiconductor packages Download PDF

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Publication number
KR100255184B1
KR100255184B1 KR1019970034526A KR19970034526A KR100255184B1 KR 100255184 B1 KR100255184 B1 KR 100255184B1 KR 1019970034526 A KR1019970034526 A KR 1019970034526A KR 19970034526 A KR19970034526 A KR 19970034526A KR 100255184 B1 KR100255184 B1 KR 100255184B1
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South Korea
Prior art keywords
solder ball
tool
pcb
solder
balls
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KR1019970034526A
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Korean (ko)
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KR19990011433A (en
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이규형
송봉근
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김규현
아남반도체주식회사
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Priority to KR1019970034526A priority Critical patent/KR100255184B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A solder ball tool apparatus for a solder ball bumping system of a BGA semiconductor package is provided to easily attach and detach a solder ball tool. CONSTITUTION: A solder ball tool apparatus(TS) is installed on a robot B to supply solder balls to a land which is formed on a PCB of a BGA semiconductor package. A tool fixing mechanism(81) is installed on a lower part of the robot B of the solder ball tool apparatus, and includes a road to be upwardly and downwardly movable in a pneumatic passage(81B), a plurality of balls on a lower part thereof, and a slant part(81A). A connecting mechanism(82B) is attachable and detachable by virtue of operation of the balls which are shorted by the operation of the road of the tool fixing mechanism(81), and includes a hollow part(82E) in an inside thereof and a latch protrusion(82E) on an outer peripheral surface thereof, with the balls being latched on the latch protrusion. The connecting mechanism(82B) has an adsorption hole(83) like the land of the PCB. A vibrator(85) shorts the adsorbed solder balls and is installed on an upper part of a holder(82A).

Description

ＢＧＡ 반도체패키지의 솔더볼범핑시스템의 솔더볼 툴장치솔더 A solder ball tool device for solder ball bumping system of semiconductor package

본 발명은 BGA 반도체패키지의 솔더볼범핑시스템의 솔더볼 툴장치에 관한 것으로서, 특히 BGA 반도체의 PCB에 솔더볼을 공급안치시키는 솔더볼 툴장치를 솔더볼범핑시스템에 구비하여 솔더볼의 공급작업성을 용이하게 한 BGA 반도체패키지의 솔더볼범핑시스템의 솔더볼 툴장치에 관한 것이다.The present invention relates to a solder ball tool device of a solder ball bumping system of a BGA semiconductor package. In particular, a solder ball bumping system is provided with a solder ball tool device for supplying solder balls to a PCB of a BGA semiconductor. A solder ball tooling device for a solder ball bumping system in a package.

일반적으로 솔더볼범핑시스템은 BGA 반도체패키지의 랜드에 융착되는 솔더볼을 공급시킬 수 있게 한 것이다.In general, the solder ball bumping system enables the supply of solder balls fused to lands of a BGA semiconductor package.

이러한 BGA 반도체패키지는 PCB(P)의 일측면(배면)에 다수의 랜드가 형성되고, 이 랜드에 각각 솔더볼(SB)을 융착구비하여 신호 인출단자의 기능을 갖도록 한 것이다.The BGA semiconductor package has a plurality of lands formed on one side (back side) of the PCB P, and each solder ball SB is fused to the lands to have a function of a signal extraction terminal.

상기한 BGA 반도체패키지에 안착되는 솔더볼(SB)은 PCB(P)에 형성된 랜드에 정확한 위치로 안착되도록 해야 안정된 제품의 BGA 반도체패키지를 구할 수 있었다.The solder ball (SB) seated on the BGA semiconductor package should be seated at the correct position on the land formed on the PCB (P) to obtain a stable BGA semiconductor package.

그러나 종래에는 솔더볼(SB)을 PCB(P)의 랜드에 안치시킬 때 수작업으로 플럭스를 도포한 상태에서 티져(Tweezer) 및 핀셋을 이용하여 공급안치시킴에 따라 작업자의 부주위에 의한 솔더볼의 공급 정확성을 기하지 못하였고, 공급안치 작업성을 저하시키는 요인이 되었으며, 제품의 불량을 초래하는 문제점을 발생시켰다.However, conventionally, when the solder ball (SB) is placed in the land of the PCB (P), the supply accuracy of the solder ball by the worker's sub-circumference is improved by supplying the supply using a tweezer and tweezers while the flux is applied manually. It was not a good reason, it was a factor that lowered the supply security workability, and caused a problem that caused a defect of the product.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 발명한 것으로서, BGA 반도체패키지의 PCB에 솔더볼을 공급안치시키는 솔더볼범핑시스템이 솔더볼 툴장치에 솔더볼을 흡착시키는 툴을 착탈식으로 설치 가능하도록 툴고정구를 구비하여 솔더볼 툴의 착탈이 용이하도록 한 것을 목적으로 한다.The present invention has been invented to solve the conventional problems as described above, and the tool fixture so that the solder ball bumping system for supplying the solder ball to the PCB of the BGA semiconductor package can be detachably installed a tool for adsorbing the solder ball to the solder ball tool device. It aims at making it easy to attach and detach a solder ball tool.

도 1은 본 발명이 적용된 솔더볼범핑시스템의 전체평면 구조도.1 is an overall plan view of a solder ball bumping system to which the present invention is applied.

도 2는 본 발명이 적용된 요부확대 정면도.Figure 2 is an enlarged front view of the main part to which the present invention is applied.

도 3은 본 발명의 솔더볼 툴장치의 설치상태 우측단면도.Figure 3 is a right sectional view of the installation state of the solder ball tool device of the present invention.

도 4는 본 발명의 솔더볼 툴장치의 작동상태도.Figure 4 is an operating state of the solder ball tool device of the present invention.

도 5는 본 발명에 적용된 PCB의 평면도.5 is a plan view of a PCB applied to the present invention.

도 6는 본 발명이 적용된 솔더볼범핑시스템의 전체 동작상태 평면도.Figure 6 is a plan view of the overall operating state of the solder ball bumping system to which the present invention is applied.

(도면의 주요 부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)

10 ; 솔더볼범핑시스템 TS ; 솔더볼툴장치10; Solder ball bumping system TS; Solder Ball Tool

81 ; 툴고정구 81A ; 경사부81; Tool fixture 81A; Slope

81B ; 공압유로 81C ; 요홈81B; Pneumatic flow path 81C; Groove

81D ; 돌부 RD ; 로드81D; Protrusion RD; road

BL ; 볼 82 ; 솔더볼툴BL; Ball 82; Solder Ball Tool

82A ; 홀더 82B ; 연결구82A; Holder 82B; Connector

82C ; 삽입공 82D ; 돌부82C; Insertion hole 82D; Stone

83 ; 흡착공 84 ; 버큠라인83; Adsorption holes 84; Birchline

85 ; 바이브레이터85; Vibrator

이하 본 발명의 구성을 설명하면 다음과 같다.Hereinafter, the configuration of the present invention will be described.

BGA 반도체패키지의 PCB(P)에 형성된 랜드에 솔더볼(SB)을 공급안치시킬 수 있도록 다단 굴절되는 로보트B(R2)에 설치된 솔더볼툴장치(TS)와 ;A solder ball tool device (TS) installed in the robot B (R2) which is multi-stage refracted to supply the solder balls SB to lands formed in the PCB P of the BGA semiconductor package;

상기 솔더볼툴장치(TS)의 로보트B(R2)의 하부에 설치되고 공압에 의해 공압유로(81B)에서 상하 이동가능하게 로드(RD)가 설치되며 하부에는 복수의 볼(BL)이 개재되고 경사부(81A)를 가진 툴고정구(81)와 ;The solder ball tool device (TS) is installed in the lower portion of the robot B (R2) and the rod (RD) is installed to move up and down in the pneumatic flow path (81B) by pneumatic, a plurality of balls (BL) is interposed and inclined at the bottom A tool fixture 81 having a portion 81A;

상기 툴고정구(81)의 로드(RD) 작동에 의해 단락되는 볼(BL)의 동작으로 착탈가능하고 내부에 중공부(82E)와 이 중공부(82E) 내주연에 볼(BL)이 걸려지도록 하는 걸림돌기(82E)를 가진 연결구(82B)와 ;Removable by operation of the ball BL shorted by the rod RD of the tool fixture 81 so that the hollow portion 82E and the ball BL are caught on the inner circumference of the hollow portion 82E. A connector 82B having a stopping projection 82E;

상기 연결구(82B)는 버큠흡착력에 의해 PCB(P)의 랜드와 동일한 흡착공(83)이 형성되고 흡착된 솔더볼(SB)을 단락시키는 바이브레이터(85)가 구비된 홀더(82A)의 상부에 설치될 수 있도록 한 솔더볼툴(82)과 ;The connector 82B is installed on the upper portion of the holder 82A provided with a vibrator 85 for shorting the absorbed solder ball SB by forming a suction hole 83 that is identical to the land of the PCB P by the suction force. A solder ball tool 82 which can be made;

를 포함하는 것이다.It will include.

이와 같이 구성된 본 발명의 일 실시예를 첨부도에 의하여 상세히 설명하면 다음과 같다.An embodiment of the present invention configured as described above will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 솔더볼범핑시스템의 전체 평면도이고, 도 2는 요부확대 정면도로서, 솔더볼범핑시스템(10)의 베이스(11) 일측 상부 전후방으로 인풋부(20)를 구비하고, 인풋부(20)의 전장에는 푸셔부(30)를 구비한다.1 is an overall plan view of a solder ball bumping system of the present invention, and FIG. 2 is an enlarged front view of a main portion of the solder ball bumping system. Is provided with a pusher section 30.

상기 푸셔부(30)의 타측방향 베이스(11) 상부에는 플로어부(40)를 구비한다.The floor part 40 is provided on the other side of the base 11 of the pusher part 30.

상기한 플로어부(40)의 후방측인 베이스(11)의 중앙부에는 회전가능한 테이블을 구비하고, 테이블(50) 상부에는 다수의 자재셋팅부(60)를 구비한다.The central part of the base 11, which is the rear side of the floor part 40, is provided with a rotatable table, and the upper part of the table 50 is provided with a plurality of material setting parts 60.

상기 플로어부(40)의 후방과 인풋부(20)의 타측부인 베이스(11) 상부에는 프린터부(70)를 구비하고, 프린터부(70)의 후방과 인풋부(20)의 후방위치인 베이스(11) 상부에는 솔더볼 공급부(80)를 구비한다.The printer unit 70 is provided on the rear of the floor unit 40 and the upper portion of the base 11, which is the other side of the input unit 20, and is located at the rear of the printer unit 70 and the rear of the input unit 20. The solder ball supply unit 80 is provided on the base 11.

상기한 테이블(50)의 중앙 후방에는 검사부(90)를 구비하고, 테이블(50)의 타측 베이스(11)상부에는 자재배출부(100)를 구비하며, 자재배출부(100)의 타측 베이스(11)에는 노(120)로 PCB(P)를 배출시키는 이송벨트(V)를 구비한다.The inspection unit 90 is provided at the center rear of the table 50, the material discharging unit 100 is provided on the other side base 11 of the table 50, and the other side base of the material discharging unit 100 ( 11) is provided with a transfer belt (V) for discharging the PCB (P) to the furnace (120).

또한 상기 테이블(50) 외부의 베이스(11)에는 플로어부(40) 타측과 볼 공급부(80) 타측과 자재배출부(100) 후방에 각각 다단 굴절 및 상/하 업다운되는 로보트A, B, C(R1)(R2)(R3)를 구비하고, 상기 로보트A, C(R1)(R3)의 하부에는 PCB(P)를 그립하는 그립퍼(G)와 로보트B(R2)의 하부에 솔더볼(SB)을 흡착시키는 솔더볼 툴(82)을 착탈식으로 고정하는 솔더볼툴장치(TS)가 구비된다.In addition, the base 11 outside the table 50 has a multi-stage refraction and up / down up and down robots A, B, and C on the other side of the floor part 40, the other side of the ball supply part 80, and the material discharge part 100, respectively. (R1) (R2) and (R3), and the lower portion of the robot A, C (R1) (R3), the gripper (G) for grip the PCB (P) and the solder ball (SB) in the lower portion of the robot B (R2) The solder ball tool apparatus TS which detachably fixes the solder ball tool 82 which adsorb | sucks) is provided.

상기한 솔더볼툴장치(82)는 도 2 및 도 3에서 보는 바와 같이 로보트B(R2)의 하부에 툴고정구(81)가 구비되고, 툴고정구(81)는 하부가 협소한 경사부(81A)에 다수의 볼(BL)을 개재시키며 내부에는 공압유로(81B)와 이 내부에 상하 이동하는 로드(RD)를 구비하고, 툴고정구(81)의 하부면에는 복수개의 요홈(81C)과 다수의 돌기(81D)를 형성한다.As shown in FIGS. 2 and 3, the solder ball tool device 82 is provided with a tool fixing tool 81 at a lower portion of the robot B (R2), and the tool fixing tool 81 has an inclined portion 81A having a narrow lower portion. It is provided with a plurality of balls (BL) in the interior and has a pneumatic flow path (81B) and the rod (RD) to move up and down therein, a plurality of grooves (81C) and a plurality of grooves on the lower surface of the tool fixture 81 The protrusion 81D is formed.

상기한 툴고정구(81)에는 착탈식으로 설치되는 솔더볼툴(82)의 홀더(82A) 상부에 연결구(82B)를 구비하고, 연결구(82B)의 상부면에는 상기 툴고정구(81)의 돌기(81D)와 요홈(81C)에 대응하는 삽입공(82C)과 돌부(82D)를 형성하고, 내부의 상하방향에는 중공부(82E)를 형성하며, 중공부(82E)의 상부 내주연에는 걸림돌기(82F)를 형성한다.The tool fixture 81 is provided with a connector 82B on an upper portion of the holder 82A of the solder ball tool 82 detachably installed, and the projection 81D of the tool fixture 81 on the upper surface of the connector 82B. ) And the insertion hole 82C corresponding to the recess 81C and the projection 82D are formed, and the hollow portion 82E is formed in the up and down direction of the inside thereof, and the locking protrusions are formed on the upper inner circumference of the hollow portion 82E. 82F).

상기한 홀더(82A)는 하부에 PCB(P)의 랜드와 동일한 수량의 흡착공(83)이 형성되어 버큠라인(84)과 연결되고, 상부에는 바이브레이터(85)가 구비된 것이다.The holder 82A has a suction hole 83 having the same quantity as the land of the PCB P, is connected to the vacuum line 84 at the lower portion thereof, and the vibrator 85 is provided at the upper portion thereof.

이러한 솔더볼툴장치(TS)의 툴고정구(81)는 솔더볼툴(82)의 연결구(82B)가 삽입될 수 있게 하여 착탈식으로 설치 가능하도록 한 것이다.The tool fixing tool 81 of the solder ball tool device TS allows the connector 82B of the solder ball tool 82 to be inserted to be detachably installed.

이와 같이 된 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention as described above is as follows.

탑재부에 반도체 칩이 부착되고, 패키지성형이 완료된 BGA 반도체패키지의 PCB(P)를 도 6과 같이 매거진(M)에 적층수납시킨 상태에서 인풋부(20)의 벨트(22) 상부에 다수의 매거진(M)을 안치시키면 모터(21)의 작동으로 이송하는 벨트(22)에 의해 매거진(M)이 순차적으로 이동하여 스톱퍼(25)에 접촉된다.A plurality of magazines are mounted on the belt 22 of the input unit 20 in a state in which a semiconductor chip is attached to the mounting unit and the PCB P of the BGA semiconductor package in which package molding is completed is stacked and stored in the magazine M as shown in FIG. 6. When (M) is settled, the magazine (M) is sequentially moved by the belt 22 which is transported by the operation of the motor 21 to contact the stopper (25).

상기 스톱퍼(25)에 매거진(M)이 접촉되면 그립퍼(27)의 센서(26)가 매거진(M)을 감지한 그립퍼(27)를 동작시킴으로서 매거진(M)의 좌우 양측을 그립하고, 동시에 스톱퍼(25)가 하향 이송하여 매거진(M)의 전방을 개방시킨다.When the magazine M is in contact with the stopper 25, the sensor 26 of the gripper 27 operates the gripper 27 that senses the magazine M to grip the left and right sides of the magazine M, and at the same time, the stopper. (25) transfers downward to open the front of the magazine (M).

이 상태에서 그립퍼(27)는 전방으로 이송하여 엘리베이터(29A)에 구비된 매거진 안치구(29)에 매거진(M)을 안치시키고 동시에 센서의 감지에 의해 상부의 매거진 고정부(29B)가 하강하여 매거진(M)을 고정시킨다.In this state, the gripper 27 moves forward to settle the magazine M in the magazine fixture 29 provided in the elevator 29A, and at the same time, the upper magazine fixing part 29B is lowered by the detection of the sensor. Secure the magazine (M).

매거진(M)이 고정되면 엘리베이터(29A)의 순차적인 하강 작동과 푸셔부(30)의 순차적인 작동으로 PCB(P)를 밀어 플로어부(40)의 안내부(40A)에 공급시킨다.When the magazine M is fixed, the PCB P is pushed and supplied to the guide part 40A of the floor part 40 by the sequentially descending operation of the elevator 29A and the sequential operation of the pusher part 30.

안내부(40A)에 공급된 PCB(P)는 벨트(41)의 작동으로 타측으로 이동하여 블록(45)의 상부에 위치한다.The PCB P supplied to the guide portion 40A moves to the other side by the operation of the belt 41 and is positioned above the block 45.

이때 차순으로 공급되는 PCB(P)는 블록(45)에 PCB(P)가 안치하고 있을 때 스톱퍼(44)가 상승하여 차순의 PCB(P)의 진행을 일시 차단시킨다.At this time, the PCB (P) to be supplied in sequence, the stopper 44 is raised when the PCB (P) is placed in the block 45 to temporarily block the progress of the PCB (P) in the sequence.

상기 PCB(P)가 블록(45)에 안치되면 블록(45)이 상승하고, 동시에 로보트A(R1)의 그립퍼(G)가 하강한 상태에서 PCB(P)의 양단을 그립한후 테이블(50)에 구비된 자재셋팅부(60)의 자재셋팅블록(61)에 공급시킨다.When the PCB (P) is placed in the block 45, the block 45 is raised, and at the same time grip the both ends of the PCB (P) in the state that the gripper (G) of the robot A (R1) is lowered, the table 50 It is supplied to the material setting block 61 of the material setting unit 60 provided in).

PCB(P)가 자재셋팅부(61)의 자재셋팅블록(60)에 안치되면 구동모터(51)의 구동으로 테이블(50)을 회전시켜 상기 PCB(P)를 프린터부(70)의 하부에 위치시킨다.When the PCB P is placed in the material setting block 60 of the material setting unit 61, the table 50 is rotated by driving the driving motor 51 to move the PCB P to the lower portion of the printer unit 70. Position it.

상기 프린터부(70)는 PCB(P)의 표면에 접촉되도록 하강한 상태에서 스크린(72) 상부에 구비된 브레이드(71)를 좌우 이동시켜 플럭스를 고르게 밀면 스크린(72)에 형성된 홀(72A)을 통해 PCB(P)의 각 랜드에 도포된다.The printer unit 70 moves left and right by moving the braid 71 provided on the upper screen 72 in a state where the printer 70 is lowered to contact the surface of the PCB P. The hole 72A is formed in the screen 72 by pushing the flux evenly. It is applied to each land of the PCB (P) through.

플럭스의 도포가 완료되면 테이블(50)의 회전으로 PCB(P)를 솔더볼이 공급되는 볼공급부(80)로 이동한다.When the application of the flux is completed, the PCB 50 is moved to the ball supply unit 80 to which the solder balls are supplied by the rotation of the table 50.

PCB(P)가 볼공급부(80)에 위치하면 도 4에서 보는 바와 같이 로보트B(R2)의 볼공급부(80)에 설치된 솔더볼툴장치(TS)가 솔더볼(SB)이 수납된 수납케이스(84)에서 솔더볼(SB)을 흡착시킨 상태로 PCB(P)의 상부에 위치하여 각 랜드에 안치시킨다.When the PCB (P) is located in the ball supply unit 80, as shown in Figure 4, the solder ball tool device TS installed in the ball supply unit 80 of the robot B (R2) is a storage case 84 in which the solder ball SB is stored. ) Is placed on the upper portion of the PCB (P) in the state of adsorbing the solder ball (SB) in the land.

이렇게 솔더볼(SB)을 흡착시켜 PCB(P)의 랜드에 공급시키는 솔더볼툴장치(82)는 로보트B(R2)의 연속작동으로 자유방향 이동이 가능하고, 툴고정구(81) 내의 공압유로(81B)에 구비된 로드(RD)가 상하 이동할 때 경사부(81A)의 볼(BL)에 단락되므로 인해 홀더(82A)에 구비된 연결구(82B)가 경사부(81A)에 삽입되었을시 볼(BL)이 중공부(82E)내의 걸림돌기(82F)에 걸림 및 해제 되도록 하여 솔더볼 툴(82)의 홀더(82A)를 착탈식으로 설치할 수 있게 한다.The solder ball tool device 82 which sucks the solder ball SB and supplies it to the land of the PCB P can move freely by the continuous operation of the robot B R2, and the pneumatic flow path 81B in the tool fixing tool 81 can be moved. When the rod RD provided in the up / down movement moves up and down, it is short-circuited to the ball BL of the inclined portion 81A, so that when the connector 82B provided in the holder 82A is inserted into the inclined portion 81A, the ball BL ) Is engaged and released to the engaging projection 82F in the hollow portion 82E, so that the holder 82A of the solder ball tool 82 can be detachably installed.

또한 툴고정구(81)에 형성된 돌기(81D)와 요홈(81C)은 연결구(82B)의 삽입공(82C)과 돌부(82D)에 각각 상호 삽착됨에 따라 솔더볼 툴(82)의 착탈시 더욱 견고하도록 한다.In addition, the protrusions 81D and the recesses 81C formed in the tool fixing tool 81 are inserted into the insertion holes 82C and the protrusions 82D of the connector 82B, respectively, so that the solder ball tool 82 is more firmly attached and detached. do.

이렇게 솔더볼툴(82)이 로보트B(R2)의 툴고정구(81)에 설치되면 솔더볼범핑시스템(10)에 구비된 솔더볼수납케이스(84)에 툴고정구(81)를 안치시킨 상태에서 버큠라인(84)으로 흡입되는 버큠흡착력에 의해 다수의 흡착공(83)으로 솔더볼(SB)이 흡착된다.When the solder ball tool 82 is installed in the tool fixing tool 81 of the robot B (R2), the tool line 81 is placed in the solder ball storage case 84 provided in the solder ball bumping system 10. The solder ball SB is adsorbed to the plurality of adsorption holes 83 by the suction force absorbed by the air 84.

솔더볼(SB)이 흡착되면 로보트B(R2)의 작동으로 테이블(50)의 자재셋팅부(60)에 구비된 PCB(P)의 랜드에 솔더볼툴(82)을 위치시킨 후 버큠력을 해제시킨 상태에서 바이브레이터(85)를 작동시켜 솔더볼(SB)의 흡착력을 해제시키면 다수의 솔더볼(SB)이 랜드에 각각 공급안치되는 것이다.When the solder ball (SB) is adsorbed by the operation of the robot B (R2) to place the solder ball tool 82 in the land of the PCB (P) provided in the material setting portion 60 of the table 50 to release the holding force When the vibrator 85 is operated in the state to release the attraction force of the solder balls SB, a plurality of solder balls SB are supplied to land respectively.

따라서, 다양한 종래의 BGA 반도체패키지에 적용되는 여러 가지의 솔더볼툴의 교체가 용이하여 작업성을 좋게 한 것이다.Therefore, it is easy to replace the various solder ball tools applied to various conventional BGA semiconductor packages to improve workability.

상기 솔더볼(SB)의 안치가 완료되면 테이블(50)의 회동으로 검사부(90)에 위치하여 PCB(P)에 안치된 솔더볼(SB)의 정위치 확인 및 더블볼을 검사한다.When the settlement of the solder ball (SB) is completed, it is located in the inspection unit 90 by the rotation of the table 50 to check the correct position and double ball of the solder ball (SB) placed on the PCB (P).

검사완료된 PCB(P)는 테이블(50)의 회동으로 자재배출부(100)로 공급되는 제품의 PCB(P)가 로보트C(R3)의 그립퍼(G) 그립에 의하여 노(120)와 연결된 이송벨트(V)로 공급되고 솔더볼(SB)의 안치가 불량품인 PCB(P)는 자재배출부(100)를 통해 빈 매거진(BM)에 순차적으로 배출시킬 수 있게 한 것이다.Inspected PCB (P) is the transfer of the PCB (P) of the product supplied to the material discharge unit 100 by the rotation of the table 50 is connected to the furnace 120 by the gripper (G) grip of the robot C (R3). PCB (P) that is supplied to the belt (V) and the placement of the solder ball (SB) is defective is to be sequentially discharged to the empty magazine (BM) through the material discharge unit (100).

이상에서와 같이 본 발명은 BGA 반도체패키지의 PCB에 솔더볼을 공급안치시키는 솔더볼범핑시스템이 솔더볼 툴장치에 솔더볼을 흡착시키는 툴을 착탈식으로 설치 가능하도록 툴고정구를 구비하여 솔더볼 툴의 착탈이 용이하도록 하므로서, 다양한 종래의 BGA 반도체패키지의 PCB에 공급안치되는 솔더볼의 작업성 증대와 제품의 품질로 높일 수 있는 효과가 있다.As described above, the present invention provides a solder ball bumping system for supplying solder balls to a PCB of a BGA semiconductor package, so that the solder ball tool is provided with a tool fixture to detachably install a tool for adsorbing solder balls to the solder ball tool device. In addition, there is an effect of increasing the workability of the solder ball is placed in the PCB of the various conventional BGA semiconductor packages and the quality of the product.

Claims (2)

BGA 반도체패키진의 PCB(P)에 형성된 랜드에 솔더볼(SB)을 공급안치시킬 수 있도록 다단 굴절되는 로보트B(R2)에 설치된 솔더볼툴장치(TS)와 ;A solder ball tool device (TS) installed in the robot B (R2) which is multi-stage refracted to supply the solder balls SB to lands formed on the PCB P of the BGA semiconductor package; 상기 솔더볼툴장치(TS)의 로보트B(R2)의 하부에 설치되고 공압에 의해 공압유로(81B)에서 상하 이동 가능하게 로드(RD)가 설치되며 하부에는 복수의 볼(BL)이 개재되고 경사부(81A)를 가진 툴고정구(81)와 ;The solder ball tool device (TS) is installed in the lower portion of the robot B (R2) and the rod (RD) is installed to move up and down in the pneumatic flow path (81B) by pneumatic, a plurality of balls (BL) is interposed and inclined at the bottom A tool fixture 81 having a portion 81A; 상기 툴고정구(81)의 로드(RD) 작동에 의해 단락되는 볼(BL)의 동작으로 착탈가능하고 내부에 중공부(82E)와 이 중공부(82E) 내주연에 볼(BL)이 걸려지도록 하는 걸림돌기(82E)를 가진 연결구(82B)와 ;Removable by operation of the ball BL shorted by the rod RD of the tool fixture 81 so that the hollow portion 82E and the ball BL are caught on the inner circumference of the hollow portion 82E. A connector 82B having a stopping projection 82E; 상기 연결구(82B)는 버큠흡착력에 의해 PCB(P)의 랜드와 동일한 흡착공(83)이 형성되고 흡착된 솔더볼(SB)을 단락시키는 바이브레이터(85)가 구비된 홀더(82A)의 상부에 설치될 수 있도록 한 솔더볼툴(82)과 ;The connector 82B is installed on the upper portion of the holder 82A provided with a vibrator 85 for shorting the absorbed solder ball SB by forming a suction hole 83 that is identical to the land of the PCB P by the suction force. A solder ball tool 82 which can be made; 를 포함하는 것을 특징으로 하는 BGA 반도체패키지의 솔더볼범핑시스템의 솔더볼 툴장치.Solder ball tool device of the solder ball bumping system of the BGA semiconductor package comprising a. 제1항에 있어서, 상기 툴고정구(81)의 하부면에 형성된 돌기(81D)와 요홈(81C)은 솔더볼툴(82)의 연결구(82B)가 구비된 삽입공(82C)과 돌부(82D)에 상호 결합될 수 있게 한 것을 특징으로 하는 BGA 반도체패키지의 솔더볼범핑시스템의 솔더볼 툴장치.The protrusion 81D and the recess 81C formed on the lower surface of the tool fixing tool 81 are inserted into the insertion hole 82C and the protrusion 82D provided with the connector 82B of the solder ball tool 82. Solder ball tool system of the solder ball bumping system of the BGA semiconductor package, characterized in that it can be coupled to each other.
KR1019970034526A 1997-07-23 1997-07-23 The solder ball tool apparatus for solder ball bumping system of bga semiconductor packages KR100255184B1 (en)

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KR100255184B1 true KR100255184B1 (en) 2000-05-01

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