JPH0992664A - Mounter of chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a mounter of a chip capable of mounting a plural kinds of chips to a board, contriving to increase the rate of chip mounting. SOLUTION: This mounter provides a first magazine 6 for receiving a wafer 2, an elevator 9 and a pusher 11 on one side part of a pick-up station of a chip, and a second magazine 7 for receiving a try 8, an elevator 10 and a pusher 15 on the other side part. The wafer 2 in the first magazine 6 is carried in or out of the pick-up station by an arm 14 moving along a carry part 12. Further, the tray 8 of the second magazine 7 is carried in or out of the pick-up station by a withdrawing arm 16. The wafer 2 and the tray 8 are driven by an X table 4 and a Y table 5 in the pick-up station and horizontally moved, and a specific chip is moved to a pick-up position by a nozzle of a head part 50.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus for mounting various kinds of chips provided in a chip supply unit such as a wafer or a tray on a substrate.

[0002]

2. Description of the Related Art As a chip mounting apparatus for mounting a chip provided in a chip supply unit such as a wafer or a tray on a substrate, a device disclosed in Japanese Patent Laid-Open No. 2-56945 is known. The flip chip of the wafer is picked up by suctioning the flip chip of the wafer to the suction portion provided at the tip of the arm by vacuum suction, and the arm is rotated 180 ° up and down to invert the flip chip up and down and transfer the flip chip. It is delivered to a head and mounted on a substrate.

[0003]

However, the above-mentioned conventional chip mounting apparatus performs an operation of picking up a chip on a wafer and delivering the chip to a transfer head by rotating the arm 180 degrees vertically. Therefore, it has been difficult to mount the chip on the substrate at a high speed. In addition, depending on the type of substrate, various types of chips must be mounted, but the above-described conventional chip mounting apparatus has a problem in that multiple types of chips cannot be mounted on the substrate at the same time.

Therefore, an object of the present invention is to provide a chip mounting apparatus capable of speeding up chip mounting and mounting various kinds of chips on a substrate.

[0005]

To this end, the present invention provides a chip supply section, a substrate positioning section, a head section having a plurality of nozzles for picking up the chips of the chip supply section, and the nozzle to the chip. And a transfer head mounted on the substrate positioned by the positioning portion to form a chip mounting device. Then, the chip supply unit integrally holds the wafer and the tray, an X table and a Y table for moving a predetermined chip provided on the wafer or the tray to a pickup position by the nozzle, and a chip pickup. A first magazine provided on one side of the holding unit located at the station for stacking and storing wafers, an elevator for moving the first magazine up and down, the holding unit and the first magazine Between the wafers, a second magazine for stacking and storing trays provided on the other side of the holding unit, an elevator for moving the second magazine up and down, and the holding unit. And a delivery means for delivering the tray between the unit and the second magazine.

Further, the holding portion is provided with an upper plate having an opening for exposing the wafer held by the wafer holder and a guide provided on the lower surface of the upper plate, and the wafer holder is taken in and out along the guide. I decided to do it.

Further, the head portion is provided with a mechanism for causing the nozzle to perform horizontal rotation and vertical rotation, and the transfer head receives the tip of the upper end portion of the nozzle which is vertically inverted by the vertical rotation.

Further, preferably, the wafer and the tray are provided with a plurality of types of chips having different sizes, and the head portion is provided with a plurality of types of the nozzles which are selectively used according to the chip size, and the substrate positioned by the positioning portion. It has become possible to mount various types of chips on.

Further, preferably, a nozzle stocker equipped with a plurality of types of nozzles is provided, and the transfer head performs nozzle exchange with the nozzles provided in the nozzle stocker.

[0010]

According to the above structure, wafers and trays having different types of chips can be stored in the first magazine and the second magazine, and various types of chips can be mounted on the substrate with good workability. Also, the chip can be turned upside down and mounted on the substrate at high speed. In addition, the head part is equipped with multiple types of nozzles, and the transfer head exchanges nozzles with the nozzles of the nozzle stocker, so that the chip can be mounted on the substrate using the optimum nozzle according to the type of chip. it can.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a front perspective view of a chip mounting apparatus according to an embodiment of the present invention, FIG. 2 is a rear perspective view thereof, and FIG. 3 is a side view thereof.
4 is a cross-sectional view of the head portion, FIGS. 5, 6 and 7 are plan views thereof, FIG. 8 is a perspective view of a main portion of the chip supply portion, and FIG. 9 is positioning of a wafer holder provided in the chip supply portion. FIG. 10 is a perspective view of a tray and a tray holder provided in the chip supply section, and FIG. 11 is a sectional view of a wafer sheet tensioning mechanism of the chip supply section.

First, the chip supply section will be described in detail with reference to FIGS. 1 and 5 to 10. In FIG. 1, the following elements are arranged on the base 1. A wafer 2 is held on the supply table 3. The supply table 3 is placed on an X table 4 and a Y table 5, which are movable tables installed on the front upper surface of the base 1, and the X motor (FIG. 3) MX1 and the Y motor MY1 drive the X table. When the table 4 and the Y table 5 are operated, they move horizontally in the X direction and the Y direction.

The wafer 2 shown in FIG. 1 is at a pickup station for picking up chips by nozzles (described later), and has a first magazine 6 on one side and two first magazines 6 on the other side. Two magazines 7 are installed. In the first magazine 6, wafer holders 2a on which a wafer sheet 2b for holding the wafers 2 is stretched are stacked and stored. The trays 8 are stored in the two second magazines 7 in a stacked manner. The tray 8 stores chips P2 (FIG. 9). Chip P on wafer 2
Chips P2 of 1 (FIG. 9) and two trays 8 are different types. Elevators 9 and 10 are provided on the sides of the first magazine 6 and the second magazine 7, respectively. When the elevators 9 and 10 are operated, the first magazine 6 and the second magazine 7 are separated from each other. Go up and down.

Behind the first magazine 6 is a pusher 11.
Is provided. Further, on the front edge of the base 1, there is provided a long transport section 12 in the X direction. An arm 14 having a chuck claw 13 at the distal end is connected to the transport section 12 (see also FIG. 3). The arm 14 is coupled to a rotating belt 12 a (FIG. 5) built in the transport unit 12, and moves along the transport unit 12 in the X direction. In FIG. 5, a pusher 15 is also provided behind the second magazine 7.
Further, a key-shaped recovery arm 16 (FIG. 1) projecting forward is provided in front of the second magazine 7.

Next, the detailed structure of the supply table 3 as the holding portion will be described with reference to FIG. The supply table 3 mainly includes an upper plate 91, a lower plate 92, and a tray holder 86. The feed screw 9 which is perpendicular to the four corners of the upper plate 91 and the lower plate 92
3 is inserted. On the lower surface of the upper plate 91, a guide 97 into which the wafer holder 2a can be inserted and removed is attached. 94 and 95 guide the wafer holder 2a 97
The chuck claw 1 of the arm 14 when taking in and out along the
It is a notch through which 3 passes. Further, a large circular opening 96 for exposing the wafer 2 is formed in the center of the upper plate 91 and the lower plate 92.

In FIG. 10, reference numeral 86 denotes two sets of tray holders mounted on the upper surface of the lower plate 92 on the second magazine 7 side. The planar shape of the tray holder 86 is a U-shape,
A notch 87 is formed at the tip thereof. Further, ball plungers 88 are mounted on the inner surfaces of both sides thereof. The tray 8 in the second magazine 7 is pushed by the pusher 15 and inserted into the tray holder 86, and is semi-fixed by the ball plunger 88. Further, the tip standing portion 16a of the collecting arm 16 enters through the notch 87 and the collecting arm 16 retracts to the second magazine 7 side, whereby the tray 8 is collected in the second magazine 7.

Next, a mechanism for applying tension to the wafer sheet 2b will be described. In FIG. 8, Y
A base plate 100 is placed on the table 5, and the base plate 1
A movable table 101 is installed on 00. The moving table 101 moves in the Y direction on the Y table 5 driven by the Y motor MY1. The motor 10 is provided on the outer surface of the moving base 101.
2 is installed. In FIG. 9, a belt 104 is attached to a pulley 103 mounted below the feed screw 93. The belt 104 is driven by the motor 102 to rotate. A nut 98 is attached to the upper plate 91, and the feed screw 93 is screwed into the nut 98. Mobile stand 101
A lower plate 92 is fixed to the upper surface of the. In FIG. 9, the feed screw 93 is rotatably mounted on the lower plate 92 by a bearing 106. Opening 96 of the upper plate 91
A cylindrical body 105 is provided in the central portion of the lower plate 92 immediately below. The cylindrical body 105 is held by the feed screw 93 via a bearing 106. A tray holder 86 is held at the end of the lower plate 92. That is, the chip supply table 3 integrally holds the wafer holder 2a and the tray 8, and by driving the X table 4 and the Y table 5, the predetermined chips P1 and P2 of the wafer 2 and the tray 8 are moved to the pickup position by the nozzle 73. To move.

In FIG. 9, the wafer holder 2 a is chucked by the chuck claw 13 of the arm 14 and inserted into the guide 97. Then, when the motor 102 is driven, the belt 1
04 rotates along the pulley 103, and the feed screw 93 rotates. Then, the upper plate 91 is lowered in FIG.
As shown in FIG. 3, the cylindrical body 105 receives the wafer sheet 2b from below, and the wafer sheet 2b is tensioned to be in a horizontal posture. The nozzle 73 picks up the chip P1 on the wafer sheet 2b in the state where the wafer sheet 2b is horizontal as described above. When the motor 102 is driven in the reverse direction, the feed screw 93 reversely rotates, the upper plate 91 rises, and the wafer holder 2a returns to the original height.

5 to 7 show the exchange operation of the wafer holder 2a and the tray 8. FIG. 5 shows that the wafer 2 has the base 1
Is located in front of the pickup station A in the central portion of FIG. From this state, the wafer 2 is moved and positioned right above the pepper pot 81 of the die ejector provided in the pickup station A, and in this state, the chips provided on the wafer 2 are transferred to the nozzles (described later) 73 of the head 70. After being picked up, it is mounted on the substrate 20 positioned at the mounting station B. When the chips of the wafer 2 are out of stock or when the product type of the wafer 2 is exchanged, the wafer holder 2 a is put into and taken out of the first magazine 6. That is, in this case, as shown in FIG.
The table 4 is driven to bring the chip supply table 3 on the Y table 5 close to the first magazine 6, and the wafer holder 2a held by the chip supply table 3 is stored in the first magazine 6. Next, the elevator 9 is driven to set the desired wafer holder 2 a in the first magazine 6 to the same level as the pusher 11 and the chuck claw 13. Therefore, the pusher 11 allows the wafer holder 2 in the first magazine 6 to be
The wafer holder 2 a is set on the chip supply table 3 by pushing a toward the chuck claw 13 side and chucking it with the chuck claw 13, and then moving the chuck claw 13 to the right. Next, the chucked state by the chuck claw 13 is released, and the X table 4 is driven to move the new wafer holder 2a to the pickup station A shown in FIG.
Move to

When replacing the tray 8, the tray 8 on the chip supply table 3 is brought close to the second magazine 7 as shown in FIG. Then, the tray 8 is collected in the second magazine 7 by causing the collection arm 16 to perform a vertical operation or a movement operation in the X direction, and the second magazine 7 is moved.
New tray 8 in the Y table 5 by the pusher 15
Push up. Also in this case, the elevator 10 is driven to move the second magazine 7 up and down. As described above, the first magazine 6 and the second magazine 7 are arranged on the left and right sides of the pickup station A, and the transfer unit 12, pushers 11, 15, and
By disposing the arm 14, the collection arm 16, and the like, the replacement of the wafer holder 2a and the tray 8 can be performed quickly.

In FIG. 2, two guide rails 21 as positioning portions for the board 20 are provided on the upper surface on the rear side of the base 1. The substrate 20 is conveyed in the X direction along the guide rails 21 and is clamped by the guide rails 21 and positioned at the chip mounting station B. A first frame 22 and a second frame 23 are installed on a pair of Y-axis frames 1a provided on both sides of the base 1. A Y screw 24 is provided between the first frame 22 and the second frame 23. MY2 is Y screw 24
Is a motor for rotating. Nut 25 for Y screw 24
Are screwed together. A long frame 26 is coupled to the lower surface of the nut 25 in the X direction. An X screw 27 is housed inside the frame 26, and is driven by the X motor MX2 to rotate. The sliders 26a on both sides of the frame 26 are slidably mounted on guide rails 28 in the Y direction fixed to the Y-axis frame 1a. X screw 2
A nut 29 (FIG. 5) is screwed into the nut 7,
A transfer head 31 is coupled to the. Transfer head 31
Has a nozzle 32 for vacuum suction of the chip. Therefore, when the X motor MX2 and the Y motor MY2 are driven,
The transfer head 31 moves in the X direction and the Y direction.

2 and 5, the transfer head 31
A camera 33 for chip recognition, a nozzle stocker 34, and a flux coating unit 35 are disposed below the moving path of the chip. The transfer head 31 moves above the camera 33,
The camera 33 observes the chip vacuum-adsorbed to the lower end of the nozzle 32 and recognizes the position of the chip. When the nozzles are replaced for changing the type of chip, the transfer head 31 moves above the nozzle stocker 34 to replace the nozzles. As a method of replacing the nozzle, for example, a method described in JP-A-2-36600 can be applied. When the chip is a flip chip having solder bumps, the transfer head 31 moves above the flux applying section 35 to attach the flux to the solder bumps protruding from the lower surface of the flip chip. A camera 36 for board recognition is integrally provided on the side surface of the transfer head 31 (FIG. 3). The camera 36 moves above the board 20 and observes board recognition marks and features of the board 20 to detect the position of the board 20. Reference numeral 37 is a motor for driving the board conveyer built in the guide rail 21, 38
Is a width-adjusting motor for the guide rails 21, 39 is a width-adjusting ball screw, and the spacing between the guide rails 21 is adjusted according to the change in the type of the substrate 20 (see also FIG. 3).

In FIG. 3, 49 is the second frame 23.
Is a horizontal frame provided below the
It is connected to the shaft frame 1a. The head 50 is mounted on the horizontal frame 49. Next, a detailed structure of the head unit 50 will be described with reference to FIG. Reference numeral 51 denotes a center rod whose upper end is fixed to the horizontal frame 49. Inside the center rod, suction holes 52 are formed in the same number as the heads 70 (only one suction hole 52 is shown in FIG. 4). A bearing part 5 is provided above the center rod 51.
The rotating cylinder 54 is mounted via the third cylinder 3. A pulley 55 is mounted on the rotary cylinder 54, and a timing belt 56 is tuned to the pulley 55. As shown in FIG.
The timing belt 56 is tuned to the rotation axis of the motor 57 (see also FIG. 7). Therefore, when the motor 57 is driven, the rotary cylinder 54 horizontally rotates about its axis.

In FIG. 4, a first bevel gear 61 is mounted below the center rod 51. A second bevel gear 62 is engaged with the first bevel gear 61 at a gear ratio of 1: 1. A rotating block 63 is connected to the outside of the second bevel gear 62. The rotating cylinder 54 and the rotating block 63 described above are connected to a horizontal axis NA via a bearing 64.
It is rotatably connected around. When the motor 57 drives and the rotary cylinder 54 rotates horizontally, the rotary block 63 coupled to the rotary cylinder 54 via the bearing portion 64 also rotates horizontally about the axis of the center rod 51. At this time, the second bevel gear 62 horizontally rotates around the first bevel gear 61 (the first bevel gear 61 is fixed to the center rod 51 and therefore does not rotate), whereby the second bevel gear 62 is rotated. 62 is a vertical 180 ° centering on the horizontal axis NA
Rotate. That is, when the motor 57 drives, the rotation block 63 performs horizontal rotation and vertical rotation in parallel.

A U-shaped bracket 69 is attached to the outside of the rotary block 63. A head 70 is mounted on the bracket 69. The head 70 has a vertical nozzle shaft 71. A flip chip P is adhered on the wafer sheet 2b with the bump B facing upward. The nozzle shaft 71 is elastically urged upward by a coil spring 72. The bracket 69 has an L-shaped lever 7
The pin 5 is rotatably supported by a pin 76 in the vertical direction. Rollers 77 and 78 are attached to both ends of the lever 75. The lower roller 78 is in contact with a seat plate 79 connected to the nozzle shaft 71. The upper roller 7
A pusher 65 (see also FIG. 1) is provided on the side of 7. The pusher 65 is driven by a drive unit such as a motor or a cam (not shown) fixed to the horizontal frame 49,
Move in the lateral direction N.

In FIG. 4, when the pusher 65 moves to the right, the roller 77 is pushed by the pusher 65 and the lever 75 rotates clockwise. Then, the roller 78 becomes the coil spring 7
While compressing 2, the seat plate 79 is pushed down, and the nozzle shaft 71 descends. When the pressing element 65 is moved to the left to release the pressing state of the roller 77, the lever 75 rotates counterclockwise, and the nozzle shaft 71 is raised by the spring force of the coil spring 72. Thus, the nozzle shaft 7
When the nozzle 1 and the nozzle 73 move up and down, the nozzle 73 vacuum-adsorbs and picks up the flip chip P of the wafer 2. In FIG. 4, reference numeral 52 is a suction hole formed in the center rod 51. Although only one suction hole 52 is shown in FIG. 4, the same number as the head 70 is actually formed. Reference numeral 51a is an outer cylinder rotatably attached to the lower portion of the center rod 51, and a plurality of cylindrical grooves 51b are formed on the inner peripheral surface thereof. Multiple cylindrical grooves 5
1b communicates with the corresponding suction holes 52, and this cylindrical groove 51b communicates with a tube 66 attached to the outer peripheral surface of the outer cylinder 51a. Tube 66
Is connected to the lower part of the rotary cylinder 54. A ring-shaped ring member 54a is mounted between the bearing portions 64 of the rotary cylinder 54, and cylindrical grooves 54b and 54c are formed on the outer peripheral surface and the inner peripheral surface of the ring member 54a. The cylindrical grooves 54b and 54c communicate with each other by a hole formed in the ring member 54a. The cylindrical groove 54b communicates with the tube 66, and the cylindrical groove 54c communicates with a suction hole 67 formed in the rotation block 63. A tube 63 a communicating with the nozzle 73 is connected to the suction hole 67. Therefore, the nozzle 73 includes the tube 63a, the suction hole 67,
It is connected to a suction device (not shown) via the ring member 54a, the tube 66, the outer cylinder 51a, and the suction hole 52.

As shown in FIG. 5, the head section 50 has three heads 70. The three heads 70 are provided at equal intervals of 120 ° in plan view. Above the pickup station A, a camera 68 for chip recognition is provided (see FIG. 3). This camera 68
Before the nozzle 73 picks up the flip chip P of the wafer 2, the flip chip P is observed and inspected to see if it is a good flip chip P without chipping or a bad mark. It is used to detect the position of the flip chip P.

In FIG. 3, a die ejector 80 is installed below the pickup station A. The pepper pot 81 of the die ejector 80 is directly below the wafer 2, and when the nozzle 73 picks up the flip chip P, the pin 82 projects from the upper surface of the pepper pot 81, breaks through the wafer sheet 2b, and lifts the flip chip P from below. (See also Figure 4). In FIG. 4, reference numeral 85 denotes a cover plate attached to the lower end of the center rod 51, which prevents dust from dropping onto the wafer 2 or the tray 8 and soiling the flip chip P.

The device for mounting this chip has the above-mentioned structure, and the overall operation will be described below. First, the flip chip P to be picked up is moved to the pickup station A (operation 1). Next, pepper pot 8
1 is raised and brought into contact with the lower surface of the wafer sheet 2b (operation 2). When picking up the flip chip P from the tray 8, this operation is not performed. Camera 6
The flip chip P of the pickup station A is imaged at 8 and the position of the flip chip P is recognized. In addition, it is inspected whether the flip chip P has a chip or a bat mark (operation 3). If the inspection result is NG, another flip chip P is moved to the pickup station A and the operation 3 is performed again. The position of the chip supply table 3 is corrected based on the position of the flip chip P obtained by the above recognition, and the flip chip P is accurately positioned at the pickup station A (operation 4).

Next, the motor 57 is driven to move the head 70 for picking up the flip chip P to the pickup station A (operation 5). Next, the pressing element 65
Is moved in the direction of arrow N (FIG. 4) to raise and lower the nozzle 73 to adsorb and pick up the flip chip P. At this time, when picking up the flip chip P from the wafer sheet 2b, the pins 82 are removed from the pepper pot 81.
(Operation 6). Next, the motor 57 is driven to horizontally rotate the head 70 by 180 ° from the pickup station A. At this time, upside down is also performed (operation 7).
At this time, the flip chip P to be picked up next time
Are moved to pickup station A (operation 8).

Next, the flip chip P is picked up by the nozzle 32 of the transfer head 31 (operation 9). At this time, the operation 3 is performed on the flip chip P of the pickup station A. Next, the transfer head 31 moves above the camera 33, and the position of the flip chip P is recognized by the camera 33 (operation 10). At this time, operations 4 and 5 are performed. The transfer head 31 moves to the flux applying unit 35 to attach the flux to the bumps, and mounts the bumps of the flip chip P on the electrodes of the substrate 20 whose positions are obtained by the substrate recognition performed in advance (operation 11). . Note that the board recognition is performed in advance by the camera 36 while performing the operations 1 to 7. During the operation 10, the operations 6 and 7 are performed on the next flip chip P. The transfer head 31 repeats the operations 9 to 11 to mount the flip chips P on the substrate 20 one after another.

In FIG. 5, the head 70 picking up the flip chip P moves to the substrate 20 side and moves to the transfer head 3.
1 shows a state in which the flip chip P is delivered. In this state, all three heads 70 are retracted from directly under the camera 68. So at this time, X table 4 and Y
The table 5 is driven to move the flip chip P of the wafer 2 to be picked up next to just below the camera 68.
It is observed by the camera 68 to inspect whether it is a defective product. If the product is defective, another flip chip P of the wafer 2 is moved to a position immediately below the camera 68, and the same inspection is performed.

When the type or size of the flip chip P to be mounted is changed, the pickup station A stops the head 70 having the nozzle 73 suitable for the flip chip P. The selection of the head 70 is performed by controlling the driving of the motor 57. The nozzle 32 of the transfer head 31 is replaced.

This nozzle mounting device can be operated in various ways. That is, for example, in FIG. 1, only the wafer 2 or the tray 8 may be provided in the pick-up station A, and only a single type of chip provided on the wafer 2 or the tray 8 may be mounted on the substrate 20. Further, a wafer 2 having different kinds of chips and two trays 8 may be arranged in the pickup station A. As described above, the plurality of heads 70 of the head unit 50 are provided with the plurality of types of nozzles 73 that are selectively used depending on the chip size or the type, and the chip supply unit is provided with the plurality of types of chips, so that various types of substrates 20 can be obtained. Chips can be mounted with good workability.

[0035]

According to the present invention, the first magazine and the second magazine
It is possible to store wafers and trays having different types of chips in the magazine, and mount various types of chips on the substrate with good workability. Also, the chip can be turned upside down and mounted on the substrate at high speed. In addition, the head part is equipped with multiple types of nozzles, and the transfer head exchanges nozzles with the nozzles of the nozzle stocker, so that the chip can be mounted on the substrate using the optimum nozzle according to the type of chip. You can
In particular, it exerts its advantage as a means for mounting a flip chip on a substrate.

[Brief description of drawings]

FIG. 1 is a front perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a rear perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of a chip mounting device according to an embodiment of the present invention.

FIG. 4 is a sectional view of a head portion of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 5 is a plan view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 6 is a plan view of a chip mounting device according to an embodiment of the present invention.

FIG. 7 is a plan view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 8 is a perspective view of a main part of a chip supply section of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 9 is a cross-sectional view of a wafer holder positioning mechanism provided in a chip supply unit of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 10 is a perspective view of a tray and a tray holder provided in a chip supply unit of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 11 is a sectional view of a wafer sheet tension applying mechanism of a chip supply unit of a chip mounting apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 2 Wafer 2a Wafer holder 4 X table 5 Y table 6 First magazine 7 Second magazine 8 Tray 9,10 Elevator 11,15 Pusher 12 Transfer unit 13 Chuck claw 14 Arm 16 Recovery arm 20 Substrate 21 Guide rail 31 Transfer Head 32 Nozzle 34 Nozzle Stocker 50 Head 51 Center Rod 57 Motor 61 First Bevel Gear 62 Second Bevel Gear 68 Camera 70 Head 73 Nozzle 86 Tray Holder 91 Upper Plate 95 Opening 97 Guide

Claims (5)

[Claims] 1. A chip supply section, a positioning section for a substrate, a head section provided with a plurality of nozzles for picking up the chip of the chip supply section, and a substrate which receives chips from the nozzle and is positioned in the positioning section. A chip mounting apparatus including a transfer head mounted on a wafer, wherein the chip supply unit integrally holds a wafer and a tray, and a predetermined chip provided on the wafer or tray by the nozzle. An X table and a Y table for moving to a pickup position, a first magazine provided on one side of the holding unit located at a chip pickup station for stacking and storing wafers, and a first magazine
An elevator for raising and lowering the magazine, a transfer means for transferring wafers between the holding unit and the first magazine, and a tray provided on the other side of the holding unit for stacking and storing trays. Device, an elevator for moving the second magazine up and down, and a delivery means for delivering trays between the holding unit and the second magazine. 2. The holding section includes an upper plate having an opening for exposing the wafer held by the wafer holder, and a guide provided on the lower surface of the upper plate. The wafer holder is provided along the guide. The chip mounting apparatus according to claim 1, wherein the chip mounting apparatus is for taking in and out. 3. The head unit comprises a mechanism for horizontally rotating and vertically rotating the nozzle, and the transfer head receives a chip at an upper end portion of the nozzle which is vertically inverted by the vertical rotation. The chip mounting device according to claim 1. 4. A substrate positioned on the positioning part, wherein the wafer and the tray are provided with a plurality of types of chips having different sizes, and the head part is provided with a plurality of types of the nozzles that are selectively used according to the chip size. 2. The chip mounting device according to claim 1, wherein various kinds of chips can be mounted. 5. The chip mounting apparatus according to claim 1, further comprising a nozzle stocker equipped with a plurality of types of nozzles, wherein the transfer head exchanges nozzles with the nozzles provided in the nozzle stocker.