JPH0714884A - Device and method for bonding equipment - Google Patents

Abstract

PURPOSE:To provide a means which is capable of bonding devices of two kinds accurately to a display panel at a high speed. CONSTITUTION:A first supply section 70a which keeps first devices P1 and a second supply section 70b which keeps second devices P2 are provided. A turntable 80 equipped with a first nozzle 84 which picks up the first device P1 and a second nozzle 85 which picks up the second device P2 is provided between a display panel 10 and the supply sections 70a and 70b. A first head 91a which bonds the first device P1 vacuum-sucked by the first nozzle 84 on the long side of the display panel 10 and a second head 91b which bonds the second device P2 vacuum-sucked by the second nozzle 85 on the short side of the display panel 10 are provided between the turntable 80 and the display panel 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device bonding apparatus and a bonding method for bonding a device electrode to a display panel electrode.

[0002]

2. Description of the Related Art A liquid crystal panel or the like is used as a display panel of a display of electronic equipment. The display panel is assembled by bonding outer leads (electrodes) of a driver to electrodes formed at bonding positions on a plurality of sides of a panel made of a glass plate or the like. As a driver, TAB (Tape Automated)
Devices manufactured by the Bonding method are generally used. In the TAB method, a lead is formed on the surface of a film carrier with a conductive material, a chip cut from a wafer is bonded on the lead, and then the outer lead portion of the lead is punched by a cutting device to obtain a device. The film carrier is formed of an extremely thin synthetic resin film such as polyimide.

At present, various types of device bonding apparatuses have been proposed for bonding outer leads, which are device electrodes, to electrodes of a display panel.
For example, the one described in JP-A-3-217033 is
The device is vacuum-sucked by the mounting head and conveyed to the vicinity of the mounting position, and the outer lead of the device and the electrode of the display panel are imaged in the same field of view by the camera, and the shift amount between the two is obtained. Then, after moving the substrate stage to correct this misalignment and performing alignment, the backup mechanism backs up the lower surface of the display panel, lowers the mounting head, and bonds the outer leads of the device to the display panel. To do. When the bonding is completed, the backup mechanism is returned to the original state, the substrate stage is moved, and the bonding of the next device is repeated by repeating the above-mentioned operation.

As a driver of the display panel, T
Besides the device manufactured by the AB method, a flip chip is also used. The flip chip has bumps (electrodes) formed on its circuit surface. The bumps are generally bonded to the electrodes of the display panel via an anisotropic conductive sheet (hereinafter referred to as "ACF"). In this case, first AC
After F is bonded to the electrode of the display panel, the bumps of the flip chip are accurately aligned and bonded to the electrodes formed on the sides of the display panel, or A
After the CF is attached to the bumps of the flip chip, the bumps of the flip chip must be accurately aligned and bonded to the electrodes of the display panel. Of course, also in this case, it is desirable that the bonding work is performed at the highest speed possible.

[0005]

The outer leads of the device are extremely thin and their pitch is extremely small. Thus, in bonding the narrow pitch outer leads to the electrodes of the display panel, the outer leads must be accurately aligned with the electrodes. Moreover, since a large number of devices must be bonded to the display panel, it is desirable that the bonding work be performed at the highest speed possible. That is, a bonding apparatus for bonding a device to a display panel is required to have high accuracy and high speed.

However, in the conventional bonding apparatus, after the display panel and the device are imaged by the camera and the positional deviation between the two is obtained, the display panel is received by the backup mechanism, so that the backup is displayed when the backup is transferred. Since the position of the display panel is displaced by touching the panel, the bonding cannot be performed with high precision. In addition, since it is necessary to operate the backup device every time one device is bonded, the bonding work is delayed accordingly.

Further, the display panel is a quadrangle, and the device is bonded to the side portion thereof, and the device to be bonded to one side portion (long side) and the device to be bonded to the other side portion (short side). The type of device used is different. Therefore, in terms of work efficiency, it is desirable that the device bonding apparatus be capable of bonding two types of devices of different types to the display panel. Further, it is desirable that the bonding work can be continuously performed on a plurality of sides.

[0008] Therefore, it is a first object of the present invention to provide a device bonding apparatus and a bonding method for bonding a device to a display panel with high accuracy and high speed. Further, it is a second object of the present invention to provide a device bonding apparatus and a device bonding method capable of bonding two types of devices to electrodes of a display panel at high speed and with high accuracy.

[0009]

To this end, the present invention provides a bonding apparatus for aligning and bonding the electrodes of a device to electrodes formed at a plurality of bonding positions on the sides of a display panel. A first supporting portion that supports the lower side of the display panel, a second supporting portion that supports a plurality of bonding positions of the side portion of the display panel from the lower side, and an electrode on the electrode formed on the upper surface of the end portion of the display panel. The positioning means for positioning and the bonding means for bonding the electrodes of the aligned device to the electrodes of the display panel by pressing them.

[0010]

According to the above structure, the second supporting member supports from below the bonding positions of the plurality of devices formed on the sides of the display panel, and in this state, the bonding of the devices to the plurality of positions is continued. By doing so, the device can be bonded to the electrode of the display panel with high accuracy and high speed.

Further, the first support member is a θ table device, and the θ table device is horizontally rotated in 90 ° units to change the orientation of the display panel, and at the same time, the θ table device and the second support are provided by the distance changing means. By changing the distance from the means, it is possible to automatically bond the devices formed on the plurality of sides of the display panel to the bonding positions.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an overall perspective view of a device bonding apparatus in a first embodiment of the present invention. See also FIG.
5 is a perspective view of a moving mechanism of a display panel of the bonding apparatus of the same device, FIG. 3 is a sectional view of a bonding station of the bonding apparatus of the same device, FIG. 4 is a sectional view of a pole lifting mechanism of the bonding apparatus of the same device, and FIG. Is a front view of a first supply unit of the bonding apparatus for the same device, FIG. 6 is a cross-sectional view of the bonding apparatus for the same device during pickup of the first device, and FIG. 7 is a first head for the bonding apparatus for the same device. FIG. 8 is a perspective view, FIG. 8 is a cross-sectional view of a first head of a bonding apparatus for the same device, and FIG.
Is a perspective view of a main part of the bonding apparatus of the same device during bonding, FIG. 10 is a perspective view of an observing apparatus of the bonding apparatus of the same device, FIG. 11 is a sectional view of an observing apparatus of the bonding apparatus of the same device, and FIG. Is a plan view of the first device being observed by the bonding apparatus of the same device, FIG. 12B is a view of a first camera of the bonding apparatus of the same device, and FIG. 12C is a view of the bonding apparatus of the same device. Field of view of the second camera, FIG.
(B), (c) and (d) are sectional views of the positioning mechanism of the display panel of the bonding apparatus of the same device, FIG. 14 is a schematic plan view of the bonding apparatus of the same device, and FIG.
(A) and (b) are the first bonding equipment of the same device.
16A and 16B are cross-sectional views of the same device being bonded to the display panel, FIGS. 16A and 16B are cross-sectional views of the first bonding device of the same device being bonded to the display panel, and FIG. 17 is a bonding device of the same device. FIG. 18 is a cross-sectional view of the first device of FIG.
19 is a schematic plan view of a bonding apparatus for the device, FIG.
(A), (b) is a top view of the display panel and the 3rd long board of the bonding apparatus of the same device.

In FIG. 1, at the front part of the upper surface of the base 5,
A moving means 1 for moving the display panel 10 in the X direction, the Y direction, and the θ direction is provided. This moving means 1 mounts the Y table device 3 on the X table device 2, and mounts the θ table device 4 (see FIG. 2) having the suction portion 12 on the Y table device 3. (Hereinafter simply referred to as X table 2, Y table 3, and θ table 4). The θ table 4 is a first support portion that supports the central portion of the display panel 10 from below. The X table 2 and the Y table 3 are installed orthogonal to each other. The X table 2 has a motor MX1 and the Y table 3 has a motor MY1. 1 and 2, a guide rail 2a in the X direction is provided on the upper surface of the X table 2. A slider 3a fitted to the guide rail 2a is provided on the lower surface of the Y table 3. When the motor MX1 is driven, the Y table 3 moves to the guide rail 2
Move horizontally in the X direction along a.

In FIG. 2, a base plate 6 is placed on the Y table 3.
Is provided. A guide rail 3b in the Y direction is provided on the upper surface of the Y table 3. A slider 6a fitted to the guide rail 3b is provided on the lower surface of the base plate 6. When the motor MY1 is driven, the base plate 6 horizontally moves in the Y direction along the guide rails 3b. Further, when the motor MX1 is driven, the base plate 6 moves in the X direction together with the Y table 3. That is, the X table 2 and the Y table 3 horizontally move the base plate 6 in the X and Y directions.

In FIG. 2, the θ table 4 is placed on the base plate 6.
Is provided. The θ table 4 is composed of a suction unit 12 that vacuum-fixes the display panel 10 in the suction holes 13 and fixes it, and a motor Mθ that horizontally rotates the suction unit 12. The suction hole 13 is connected to a vacuum device (not shown). As shown in FIG. 9, the display panel 10 is arranged on the suction section 12 of the θ table 4. Therefore, when the motors MX1 and MY1 are driven, the display panel 10 horizontally moves in the X and Y directions, and when the motor Mθ is driven, the display panel 10 horizontally rotates in the θ direction. As described below, θ
By horizontally rotating the display panel 10 by 90 ° on the table 4, the device is bonded to the electrodes formed on the long side and the short side orthogonal to each other of the display panel 10.

As shown in FIGS. 1 and 2, a box 20 is provided in parallel with the X table 2. FIG. 3 shows a device bonding station c.
In FIG. 3, a plate 21 is provided inside the box 20.
Two a and 21b are arranged on the left and right. Box 20
Guide rails 22a and 22b in the X direction are provided on the bottom surface of the sliders 23a and 23b provided on the lower surfaces of the plates 21a and 21b.
It is fitted to b. Nuts 24a and 24b are fixed to the outer ends of the plates 21a and 21b. Nut 24
Ball screws 25a and 25b in the X direction are screwed into a and 24b. The ball screws 25a and 25b are used in the box 2
The motors MXa and MXb (FIGS. 1 and 2) provided on the side surface of No. 0 rotate. When the motors MXa and MXb are driven and the ball screws 25a and 25b rotate, the plates 21a and 21b move in the X direction along the guide rails 22a and 22b.

2 and 3, guide rings 27a and 27b are provided on the upper surfaces of both sides of the box 20, and the poles 26 are provided on the guide rings 27a and 27b.
a and 26b are inserted so that they can be raised and lowered. A first elongated plate 28 that is elongated in the X direction is provided on the top of one pole 26a. As will be described later, the first long plate 28 is provided with the devices P1 and P2 vacuum-adsorbed by the nozzles 84 and 85.
It serves as a support member for supporting from below.

In FIG. 3, a second elongated plate 29 is provided above the other pole 26b. Pole 26a,
Blocks 31a and 31b are fixed to the lower portion of 26b, and coil springs 32a and 32b are mounted on the blocks 31a and 31b. Due to the spring force of the coil springs 32a, 32b, the poles 26a, 26
b is bullied downward. Rollers 33a and 33b are rotatably mounted on the sides of the blocks 31a and 31b. Further, plate cams 34a, 34b elongated in the X direction are installed at the inner ends of the plates 21a, 21b (FIG. 4), and the rollers 33a, 33b are provided with the plate cams 34a, 34b.
Roll on the inclined upper surface of b. Therefore, the motor MX
When a and MXb are driven and the ball screws 25a and 25b rotate, the plate cams 34a and 34b move in the X direction. Then, the rollers 33a and 33b roll on the inclined upper surfaces of the plate cams 34a and 34b, and the poles 26a and 26b and the first long plate 28 and the second long plate 29 move up and down.

2 and 3, the second long plate 29
A slide plate 41 is provided above. A guide rail 42 in the X direction is provided on the upper surface of the second long plate 29. A slider 43 provided on the lower surface of the slide plate 41 is fitted on the guide rail 42. A third long plate 44 is provided on the slide plate 41.
The third elongated plate 44 is formed with a suction hole 45 for vacuum-sucking the side portion of the display panel 10. The suction hole 45 is connected to a vacuum device (not shown). As will be described later, the third elongated plate 44 serves as a support member that supports the side portion of the display panel 10 from below when the device is bonded to the display panel 10.

As shown in FIG. 3, a slider 46 is provided on the upper surface of the slide plate 41. Also, the third long plate 4
A guide rail 47 in the Y direction, which is fitted to the slider 46, is provided on the lower surface of 4. In FIG. 2, a pin 51 is projected on the side surface of the third elongated plate 44, and a pin 52 is projected on the end of the slide plate 41. A coil spring 53 is coupled to the pins 51 and 52. A stopper 50 is provided upright on the upper surface of the slide plate 41. The third elongated plate 44 is urged to the right in FIG. 3 by the spring force of the coil spring 53 and hits the stopper 50 to stop (see the chain line in FIG. 3). In this way, the third long plate 44 is mounted on the second long plate 29 so as to be movable in the horizontal direction.

In FIG. 2, a hook-shaped first bracket 61 is connected to the side surface of the third elongated plate 44. Further, a key-shaped second bracket 62 is provided above the base plate 6. A slider 64 provided on the outer surface of the second bracket 62 is fitted to a Z-direction guide rail 63 provided on the front surface of the first bracket 61. Further, on the guide rail 65 in the Y direction provided on the upper surface of the base plate 6,
The slider 66 provided on the lower surface of the second bracket 62
Are fitted.

In FIG. 2, when the motor MX1 is driven, the Y table 3 and the base plate 6 move in the X direction along the guide rail 2a. At this time, the first bracket 61 and the second bracket 62 are used. Third connected to the base plate 6
The long plate 44 and the slide plate 41 of the guide rail 42
Move in the X direction. When the motor MY1 of the Y table 3 is driven, the base plate 6 moves in the Y direction along the guide rails 3b. At this time, the slider 66 slides on the guide rails 65, so that the third long plate 44 moves. It remains stopped. When the motor MXb is driven, the pole 26b moves up and down as described with reference to FIG. 3, and the third long plate 44 moves up and down together with the pole 26b.
At this time, the guide rail 63 (FIG. 2) also moves up and down along the slider 64.

As described above, the motor MXb shown in FIG.
When is driven, the ball screw 25b rotates in FIG. 3, and the plate 21b moves in the X direction. Then, the roller 33b rolls on the inclined upper surface of the plate cam 34b, and the pole 26b and the third long plate 4 supported by the pole 26b.
4 moves up and down. FIG. 3 shows the pole 26b and the third long plate 4.
4 shows a state in which the third long plate 44 is supporting the long side of the display panel 10 from below, and as shown in FIG. 9, bonding of the long side of the display panel 10 is performed in this state. The device P1 is attached to the electrode 30a formed at the position 10L.
The outer lead L which is the electrode of is bonded.
When the bonding is completed, the motor MXb operates in the reverse direction, the plate 21b moves in the reverse direction, and the pole 2
6b and the 3rd long board 44 descend | fall, and the support state of the long side of the display panel 10 is cancelled | released. That is, the pole 26b, the roller 33b, the plate cam 34b, the plate 21b, and the nut 24.
b, the ball screw 25b, the motor MXb, the third long plate 4
It serves as an elevating and lowering driving means for moving up and down 4.

In FIG. 9, the display panel 10 is a lower plate 1.
It is made by stacking the upper plate 10b on the lower plate 10a.
A large number of electrodes 30a are formed at a plurality of bonding positions 10L on the long side that is one side of a,
In addition, a large number of electrodes 30b are formed at a plurality of bonding positions 10S on the short side that is the other side. The first device P1 is bonded to the bonding position 10L one by one, and the first device P1 is bonded to the bonding position 10S.
The second devices P2 (not shown) are bonded one by one. Although not shown, each bonding position 10
An anisotropic conductive sheet (ACF) is previously attached to L and 10S. As shown in FIGS. 3 and 8, the first device P1 and the second device P2 have a chip C cut out from the wafer and an outer lead L extending forward from the chip C. As will be described later, the first device P1 is picked up by the first nozzle 84, and the outer lead L of the first device P1 is provided on the long side electrode 30a of the display panel 10.
Bonded to. The second device P2 is picked up by the second nozzle 85, and its outer lead L is bonded to the electrode 30b on the short side of the display panel 10.

In FIG. 1, behind the base 5, a first supply unit 70a for supplying the first film carrier 74a to the first cutting device 55a and a second film carrier 74 are provided.
2nd supply part 70 which supplies b to the 2nd cutting device 55b
b is provided. The first supply unit 70a includes a first case 71a. A first supply reel 72a and a first take-up reel 73a are provided inside the first case 71a. A first film carrier 74a and a first interlayer tape 75a are wound around the first supply reel 72a. The first take-up reel 73a is an interlayer tape 7
Wind up 5a. Further, inside the first case 71a are provided a first guide roller 76a and a first sprocket 77a for guiding the traveling of the first film carrier 74a. Chips C are bonded to the first film carrier 74a with a pitch. First
The film carrier 74a is supplied to the first cutting device 55a through the opening 78a of the first case 1a.
The first film carrier 74a is attached to the first cutting device 5
First tab device P1 obtained by punching with 5a
Is bonded to the electrode 30a formed on the long side of the display panel 10.

The second supply section 70b is the first supply section 70b.
The second case 71b has the same structure as the second case 71b, and the second case 71b is also provided inside the second case 71b. The second supply reel 72b, the second take-up reel 73b, the second film carrier 74b, and the second interlayer tape 75b. , A second guide roller 76b, and a second sprocket 77b. Chips C are bonded to the second film carrier 74b with a pitch. The second tab device P2 obtained by punching the second film carrier 74b with the second cutting device 55b is bonded to the electrode 30b formed on the short side of the display panel 10.

In FIG. 1, a first cutting device 55a is provided on the side of the first case 71a. This first
A first cylinder 57a is provided on the first frame 56a, which is the main body of the cutting device 55a. Inside the first frame 56a, a first upper die 58a, which is a die, is provided. A Y-direction guide rail 60a is provided below the first frame 56a, and a first lower die 59a, which is a die, is provided on the guide rail 60a.

In FIGS. 1 and 5, the first case 7 is used.
A first supply reel 72a and a first take-up reel 73 are driven by a motor (not shown) provided behind 1a.
When a and the sprocket 87 rotate, the first film carrier 74a and the interlayer tape 75a wound around the first supply reel 72a are drawn out from the first supply reel 72a, and the first film carrier 74a is guided by the guide roller 76a.
Or around the first sprocket 77a and the first upper mold 58
It is introduced below a. At this time, the first lower mold 59a slides on the first guide rail 60a to move the first upper mold 5a.
It is located directly below 8a. Therefore, the first cylinder 57
When the rod 61a of "a" projects downward, the first upper mold 58
a is lowered, the first film carrier 74a is punched by the first upper mold 58a and the first lower mold 59a, and the first device P1 is obtained. Next, when the rod 61a of the first cylinder 57a rises and the first upper die 58a rises,
The first device P1 punched from the first film carrier 74a is placed on the first lower die 59a. 69
Is a film carrier 74a in which the device P1 is punched out.
Is a collection box of No. 1 and is installed below the first upper mold 58a.

FIG. 6 shows the moving means of the lower die 59a. The first device P1 punched from the film carrier 74a is mounted on the lower die 59a. Lower mold 59a
A key-shaped nut 151 is attached to the side surface of the. A ball screw 152 that is horizontal in the Y direction is screwed into the nut 151. The ball screw 152 is supported by the frame 153. The ball screw 152 is driven by a motor 155 via a belt 154 to rotate. When the motor 155 drives and the ball screw 152 rotates, the first lower mold 59
A moves in the Y direction along the guide rail 60a between the pick-up station a directly below the first nozzle 84 and the punching station b immediately below the upper die 58a.

A push-up means 160 for the first device P1 is installed below the pickup station a of the first device P1. This pushing means 160
Is a vertical cylinder 161, a frame 163 supported by a rod 162 of the cylinder 161, and the frame 1
It is composed of a motor 164 mounted on 63 and a push-up pin 165 connected to the rotating shaft of the motor 164.
A slider 166 is attached to the back surface of the frame 163. The slider 166 is fitted on a vertical guide rail 167.

In FIG. 6, when the first device P1 is punched from the first film carrier 74a at the punching station b, the motor 155 is driven and the ball screw 15 is driven.
2 rotates, the first lower die 59a is punching station b
To pickup station a. Next, when the rod 162 of the cylinder 161 projects, the frame 16
3 rises along the guide rail 167, the pin 165 enters the inside of the lower mold 59a, and pushes up the first device P1 on the lower mold 59a (see the chain line). Then, the first nozzle 84 vacuum-sucks and picks up the first device P1 pushed up by the pin 165. Alternatively, with the pin 165 pushing up the first device P1, the motor 164 is driven, and the first device P1 supported by this pin 165 is horizontally rotated by 90 ° or 180 ° to change its direction. Then, the first nozzle 84 may pick up the first device P1. Nozzle 8
If 4 picks up device P1, rod 162 of cylinder 161 moves down and pin 165 retracts downwards.

In FIG. 1, a second cutting device 55b is also provided on the side of the second case 71b. The structure of the second cutting device 55b is the same as that of the first cutting device 55a, and it includes the second frame 56b and the second cylinder 5b.
7b, a second upper mold 58b, a second lower mold 59b, and the like. The second upper die 58b and the second lower die 59b punch the second device P2 from the second film carrier 74b. Further, a push-up means similar to the push-up means 160 described above is provided below the second cutting device 55b. Second film carrier 74
The second device P2 punched from b and located on the second lower mold 59b is vacuum-adsorbed by the second nozzle 85 and picked up.

In FIG. 1, box 20 and box 6
A turntable 80 is provided between the nine. The turntable 80 is supported by columns 81. Stanchion 8
1 is erected on a moving table 86 in the X direction. A ball screw, a nut (not shown), etc. are built inside the moving table 86, and when the motor MX2 is driven, the turntable 80 moves on the moving table 86 in the X direction.

The turntable 80 has a first arm 82.
And the second arm 83 are orthogonal to each other and are held in a cross shape. The first lower mold 5 is attached to the tip of the first arm 82.
A first nozzle 84 for vacuum-sucking and picking up the first device P1 on 9a is provided (see also FIG. 6). Further, a second nozzle 85 for vacuum-sucking and picking up the second device P2 on the second lower die 59b is provided at the tip of the second arm 83. The dimensions of the first device P1 and the second device P2 are different,
Therefore, the first device P1 and the second device P2 cannot be vacuum-sucked by the nozzle having the same size. Therefore, the turntable 80 is provided with the first arm 82 and the second arm 83, and the first nozzle 82 and the second nozzle 85 having different dimensions are provided at both ends of the first arm 82 and the second arm 83, respectively. The first device P1 is picked up by the first nozzle 84, and the second device P2 is
Nozzle 85 is used for picking up. Figure 2
As shown in FIG. 3, a motor 82a as a rotating means for horizontally rotating the first nozzle 84 is provided inside the first arm 82.
Is built in, and the orientation of the device P1 can be finely adjusted. Such rotating means is also incorporated in the second arm 83. In this embodiment, the rotating means 82a and the moving means 1 described above function as a positioning means for positioning the electrodes (outer leads) of the device and the electrodes of the display panel.

In FIG. 1, when the motor MX2 is driven and the turntable 80 slides to the left, the first nozzle 84 moves above the first lower mold 59a (see also FIG. 14). Further, in FIG. 1, the turntable 80 is rotated by 90 °.
When horizontally rotated, the second arm 83 moves in the Y direction.
Then, when the motor MX2 is driven and the turntable 80 slides to the right, the second nozzle 85 causes the second lower mold 5 to move.
It moves above 9b (see also FIG. 18).

In FIG. 1, a frame 90 is installed on the side of the base 5. The frame 90 is provided with a first head 91a and a second head 91b. The first head 91a and the second head 91b have the outer leads L of the first device P1 and the second device P2 that are vacuum-adsorbed by the first nozzle 84 and the second nozzle 85, respectively.
The electrodes 30a and 30b of the display panel 10 are pressed and bonded. FIG. 7 is a perspective view of the first head 91a, and FIG. 8 is a sectional view of the same. The first head 91a is
The case 92, a vertical ball screw 93 provided in the case 92, and a nut 94 screwed to the ball screw 93 are provided. Slider 9 integrally formed with nut 94
5 slides along a vertical guide rail 96 provided on the inner surface of the case 92.

The ball screw 93 has a key-shaped bracket 9
7 is fitted. An upper surface of the case 92 is attached to the frame 90, and a motor 99a for rotating the ball screw 93 is installed on the upper surface of the frame 90. Therefore, the motor 99a is driven to drive the ball screw 93
When is rotated, the nut 94 moves up and down along the ball screw 93. A cylinder 101 is attached to the lower surface of the frame 90. The rod 102 of the cylinder 101 is coupled to the shoulder portion of the bracket 97 via the metal fitting 103.

A slider 104 is provided on the inner surface of the bracket 97.
Is installed. The slider 104 is fitted to a Z-direction guide rail 105 provided on the outer surface of the case 92. The front side of the bracket 97 has flanges 106 and 107.
Is projected. A rod 108 is inserted into the flanges 106 and 107. A long plate-shaped pusher 109 is coupled to the lower end of the rod 108. A thermocompression bonding element 111 is attached to the outer surface of the bracket 97. The height of the lower surface of the thermocompression-bonding element 111 is slightly higher than the height of the lower surface of the pressing element 109. A cartridge heater 112 is housed inside the thermocompressor 111, and the thermocompressor 111 is heated to about 110 ° C. by the cartridge heater 112. The presser 109 temporarily presses the outer lead L on the electrode 30a when the outer lead L is bonded to the electrode 30a by the thermocompression-bonding element 111, and the devices P1, P.
It also corrects the deformation of the outer lead L of No. 2.

The two rods 108, 108 are connected by a plate 113 which determines the height of the lower limit of the pusher 109, and the plate 113 is connected to the flanges 107 by the coil springs 110, 110 mounted on the rods 108, 108. Is pressed against the upper surface of.

In the cylinder 101, the bracket 97 is constantly pressed against the upper surface of the nut 94 with a predetermined bonding load. That is, the cylinder 101 is a means for applying a bonding load. This bonding load can be freely changed. The motor 99a, the ball screw 93, and the nut 94 are elevating means for elevating and lowering the thermocompressor 111, and adjust the descending speed and height of the thermocompressor 111. Second
The head 91b has the same structure as the first head 91a, is provided on the frame 90, and is driven by the motor 99b, but the first device P1 and the second device P2.
According to the dimensions of the first head 91a and the second head 9
The dimensions of the pressing element 109 of 1b and the thermocompression bonding element 111 are different. In this embodiment, the first head 91a and the second head 91b are fixed to the frame 90, but the first head 91a and the second head 91b are provided on a movable table and can be moved in the horizontal direction. You may

In FIGS. 2 and 3, below the bonding station c, an observing device having a first camera 121 and a second camera 122 is provided. These cameras 121 and 122 are used for the electrodes 3 of the display panel 10.
Outer leads L of 0a, 30b and devices P1, P2
Observe the position of.

FIG. 10 is a perspective view of the observation device 120, and FIG. 11 is a sectional view. The lower part of the first camera 121 and the second
A first nut 123 and a second nut 124 are attached to the lower portion of the camera 122. A ball screw 125 in the X direction is inserted into the first nut 123 and the second nut 124. A right screw 126 and a left screw 127 are formed on the ball screw 125, the first nut 123 is screwed on the right screw 126, and the second nut 124 is screwed on the left screw 127. . Ball screw 125 is first
It is supported by the frame 128. A motor 129 for rotating the ball screw 125 is mounted on a side portion of the frame 128. When the motor 129 is driven, the ball screw 125 rotates, and the first camera 121 and the second camera 1
22 moves in opposite directions along the ball screw 125, and the distance between the first camera 121 and the second camera 122 is adjusted. That is, the nuts 123 and 124, the ball screw 125, and the motor 129 are connected to the first camera 121 and the second camera 121.
It is an interval adjusting means for the camera 122.

A slider 131 is attached to the lower portion of the first frame 128. This slider 131 is shown in FIG.
As shown in FIG. 3, the guide rail 132 is fitted on the X-direction guide rail 132 provided on the box 20. First frame 128
A second frame 133 is provided behind the. The second frame 133 has a ball screw 134 in the X direction.
Is supported. A motor 135 for rotating the ball screw 134 is provided on the side surface of the second frame 133. The ball screw 134 is attached to the first frame 12
8 is screwed into a nut 136 provided on the back surface. Therefore, when the motor 135 is driven and the ball screw 134 rotates, the first frame 128 moves to the guide rail 132.
Move in the X direction. Here, when the motor 135 rotates in the forward direction, the cameras 121 and 122 move below the first head 91a shown in FIGS. 3 and 14, and are vacuum-adsorbed on the lower end of the first nozzle 84 to be attached to the display panel 10. The outer lead L of the first device P1 to be bonded and the electrode 30a of the display panel 10 are observed. When the motor 135 rotates in the reverse direction, the cameras 121 and 122 are moved to the positions shown in FIG.
8 is moved below the second head 91b shown in FIG.
The display panel 10 is vacuum-adsorbed on the lower end of the nozzle 85 of
The outer lead L of the second device P2 and the electrode 30b of the display panel 10 which are bonded to the substrate are observed.

In FIGS. 10 and 11, the first camera 1
A lens barrel 141 elongated in the X direction is provided above the first camera 21 and the second camera 122. Inside the lens barrel 141,
A light source 142, a half mirror 143, and a mirror 144 are provided. A window 145 is opened above the mirror 144. Through the window 145, the display panel 10
The electrodes 30a, 30b and outer leads L of the devices P1, P2 are observed. By driving the motor 135 to move the first frame 128 in the X direction, the two cameras 121 and 122 are positioned below the outer lead L. Further, the width W of the outer lead L differs depending on the type of device. Therefore, according to the width W, the motor 129 is driven to move the first camera 121 and the second camera 122 in the opposite directions along the ball screw 125, so that the window portion 145 and the window portion 145 become outer leads. The distance D is adjusted so that it is located below both ends of L.

The bonding apparatus for this device has the above-mentioned structure, and the overall operation will be described below. First, a case where the outer lead L of the first device P1 is bonded to the electrode 30a on the long side of the display panel 10 will be described. First, with reference to FIGS. 13A, 13B, and 13C, a method of moving the long side electrode 30a of the display panel 10 to directly below the thermocompression-bonding element 111 of the first head 91a will be described. . First, the display panel 10 is transferred onto the upper surface of the θ table 4 by a transfer device (not shown). Next, the motors MX1, MY1 (FIG. 1) are driven to drive the display panel 10
Is moved in the X direction or the Y direction to move the side portion of the display panel 10 above the third long plate 44 (FIG. 13A).
In this case, as shown in FIG.
The side portion of is projected from the third long plate 44 by a predetermined length d1 so that the electrode 30a of the display panel 10 can be observed by the observation device 120. At this time, the display panel 1
The third long plate 44 is retreating downward so as not to hinder the movement of 0.

Next, the motor MXb (FIG. 1) is driven to move the plate 21b shown in FIG. 3 in the X direction. Then, the roller 33b is pushed up by the plate cam 34b, and the pole 2
6b rises, the third elongated plate 44 contacts the lower surface of the side portion of the display panel 10, and the display panel 10 is vacuum-sucked and fixed by the suction holes 45 (FIG. 13B). Next, the motor M
Y1 (FIG. 1) is driven again to move the display panel 10 horizontally, and the electrode 30a on the long side thereof is positioned within the visual fields of the first camera 121 and the second camera 122 (FIG. 13C).
reference). At this time, as shown in FIG. 9, the suction portion 12 of the θ table 4 and the third long plate are connected by the display panel 10. Therefore, when the θ table 4 is moved in the arrow N direction, the third long plate 44 is also horizontally moved in the N direction together with the display panel 10.

Next, a method of punching the first film carrier 74a will be described. 1 and 5, as the first supply reel 72a, the first take-up reel 73a, and the sprocket 87 rotate in the arrow direction, the first film carrier 74a is led out below the upper mold 58a. At this time, the first lower mold 59a is guided by the guide rail 60a.
And is located at the punching station b immediately below the upper die 58a (see the chain line in FIG. 6). Next, when the first cylinder 57a is operated, the first upper die 58a is lowered, and the film carrier 74a is punched by the first upper die 58a and the first lower die 59a.

Then, the rod of the first cylinder 57a is retracted, the first upper mold 58a is retracted upward, and the first supply reel 72a and the sprocket 87 are rotated, so that the first film carrier 74a is removed. It is sent one pitch and collected inside the box 69. The first lower die 59a is the first die punched from the film carrier 74a.
The device P1 is moved along the guide rail 60a to the pickup station a indicated by the solid line in FIGS. FIG. 14 shows a plan view at this time. At this time, the turntable 80 is moved in the X direction by driving the motor MX2 shown in FIG. 1, and the first nozzle 84 at the tip of the first arm 82 is
It stands by in advance above the first lower mold 59a, that is, at the position shown in FIGS.

Next, as described with reference to FIG.
By the rod 162 of the cylinder 161 protruding,
The pin 165 pushes up the first device P1 on the lower die 59a from below, and the first nozzle 84 picks up the first device P1 by vacuum suction.

Next, referring to FIG. 14, the turntable 8 is shown.
0 horizontally rotates 180 ° in the direction of the arrow, and the first nozzle 84
The first device P1 that has been vacuum-sucked to is moved above the electrode 30a on the long side of the display panel 10 (see FIG. 3). In this embodiment, the nozzles 84 and 85 are connected to the turntable 8
The devices P1 and P2 are moved from the pickup station b to the bonding station c by holding them at 0 and rotating the turntable 80. Instead of the turntable 80, the nozzles 84 and 85 are moved linearly. The nozzles 84 and 85
The devices P1 and P2 may be moved from the pickup station e to the bonding station c by linearly moving.

Next, a method of bonding the first device P1 vacuum-adsorbed by the first nozzle 84 to the electrode 30a of the display panel 10 will be described with reference to FIGS. 15, 16 and 17. 15 to 17 show a series of operations.

In FIG. 15A, the first device P1 on the first lower mold 59a is picked up and the first arm 8 is moved.
2 rotates 180 °, and the outer lead L of the first device P1 vacuum-sucked by the first nozzle 84 becomes the window portion 1 of the lens barrel 141 of the first camera 121 and the second camera 122.
The state of being located directly above 45 is shown. here,
As shown by the chain line in the figure, the presser 109 is lowered to press the outer lead L against the electrode 30a, and the outer lead L and the electrode 30a are observed by the first camera 121 and the second camera 122. As shown in FIG. 12A, the left end portion of the outer lead L is the first camera 121.
Is taken into the field of view A of. The right end is the second camera 1
It is taken into the visual field B of 22. 12 (b), (c)
6A and 6B are field views of fields of view A and B, where the positional deviation ΔX, Δ between the outer lead L and the electrode 30a in the X, Y, and θ directions.
Y and Δθ are detected. Detected positional deviation ΔX, Δ
Y and Δθ are corrected as follows.

As shown in FIG. 15 (b), the arm 82 is raised by a not-shown elevating means, and a nozzle 84 is made by a motor 82a as a rotating means built in the arm 82.
Is slightly rotated in the θ direction to correct the positional deviation Δθ in the θ direction. In that state, the motor MX1,
MY1 (FIG. 1) is driven to move the display panel 10 in the X direction or Y direction.
By moving in the X direction, the positional deviation ΔX in the X direction and the positional deviation ΔY in the Y direction are corrected.

In this way, the positional deviations ΔX, ΔY, Δθ
If the correction is made, the first nozzle 84 is lowered to land the outer lead L on the electrode 30a of the display panel 10, and then the presser 109 is lowered to press the outer lead L1 against the electrode 30a to outer lead. The deformation of L is corrected (see FIG. 16 (a)). In this state, the first camera 121 and the second camera 122 detect whether or not the outer lead L and the electrode 30a match. This detection method is the same as the method shown in FIG. Then, if the positional deviation between the outer lead L and the electrode 30a is within the allowable value, the thermocompressor 111 is lowered as it is and the outer lead L is pressed against the electrode 30a for bonding (see the chain line in FIG. 16A).

By the way, in the outer lead bonding, the required accuracy in the X direction (the parallel direction of the outer leads L) is extremely stricter than the accuracy in the Y direction or the θ direction. Therefore, when the positional deviation Δx between the outer lead L and the electrode 30a in the X direction is equal to or larger than the allowable value, the positional deviation Δx is corrected again as follows. That is, FIG.
As shown in (b), the motor MXa (FIG. 2) is driven to push up the plate 21a in FIG. 3 to raise the pole 26a, and the first elongated plate 28 pushes up the device P1. Then, the motor MX1 is driven to drive the display panel 1
0 is moved in the X direction to correct the positional deviation Δx. Next, the first long plate 28 is lowered to the original height to overlap the outer lead L and the electrode 30a, and then the thermocompression bonding element 111 is lowered to bond the outer lead L to the electrode 30a (see FIG. 17). . This bonding is performed as follows. That is, the ball screw 93 is driven by the motor 99a.
Rotate the nut 94, bracket 97, thermocompressor 1
11 is lowered according to a predetermined speed pattern. When the thermocompressor 111 lands on the outer lead, the thermocompressor 11
1 and the bracket 97 stop descending, but the nut 94
Goes further down. The bonding load generated by the cylinder 101 in this state is the rod 102 and the bracket 9
7. It is added to the outer lead L via the thermocompressor 111. In this way, when the first device P1 is bonded to the first bonding position 10L on the long side of the display panel 10, the motor MX1 of the X table 2 in FIG. 10 is moved in the X direction by the pitch of the bonding position 10L, and the next first device P1 is bonded to the bonding position 10L adjacent to the previously bonded first device P1. By repeating the series of operations shown in FIGS. 15 to 17 in this manner, the first devices P1 are sequentially bonded to the bonding positions 10L on the long sides of the display panel 10. In this case, the third long plate 44 allows the plurality of bonding positions 1 on the long side of the display panel 10.
Since 0L is supported from below, it is not necessary to lower the third long plate 44 each time one device is bonded as in the conventional case, and the bonding work can be continuously performed at high speed. .

The first electrode 30a on the long side of the display panel 10 is
After the device P1 is bonded, the second device P2 is bonded to the short-side electrode 30b.
FIG. 18 shows a state in which the outer lead L of the second device P2 is bonded to the electrode 30b on the short side of the display panel 10. In this case, the vacuum suction state by the suction holes 45 of the third long plate 44 is released, and the third long plate 44 is released.
And then the display panel 10 is horizontally rotated 90 ° by the θ table 4 shown in FIG. 2 to move the short side of the display panel 10 above the third long plate 44 as shown in FIG. 19B. . In addition, the motor MY1 is driven to project the short side from the third long plate 44 by a predetermined length d2, and the third long plate 44 is raised again, and is vacuum sucked and fixed by the suction holes 45. The motor MX2 is driven to turn the turntable 80.
Is moved in the X direction (to the right) to position the second nozzle 85 at the tip of the second arm 83 above the second lower mold 59b. The motor 129 of FIG. 10 is driven to position the two window portions 145 below both side portions of the outer lead L.

Since the method of bonding the second device P2 to the short side of the display panel 10 is the same as the method of bonding the first device P1 to the long side of the display panel 10, the description thereof will be omitted. When the first device P1 and the second device P2 are all bonded to the long side and the short side of the display panel 10, the suction holes 13 of the θ table 4 (FIG. 2) and the suction holes of the third long plate 44 are formed. The vacuum suction state of the display panel 10 by 45 is released, and the display panel 10 is removed from the θ table 4 by a transfer device (not shown). Then, a new display panel 10 is placed on the θ table 4, and the first device P1 and the second device P2 are bonded to the display panel 10 by the same method as described above.

Thus, the central portion of the display panel 10 is supported by the θ table 4, and the horizontal distance between the θ table 4 and the third elongated plate 44 is changed by the motor MY1 so that the length of the display panel is increased. The bonding work of the devices P1 and P2 to the bonding positions on the side and the short side can be automatically performed.

Next, a second embodiment of the present invention will be described. 20 is a partial cross-sectional view of the bonding apparatus for a device in the second embodiment of the present invention during bonding of an ACF, and FIG. 21 is a cross-sectional view of a main part of a bonding apparatus for the same device during bonding of a flip chip. First, Figure 2
As shown in 0, the ACF (anisotropic conductive sheet) 201 is vacuum-sucked to the nozzle 200, and the lower plate 10 of the display panel 10 is
a The electrode 30a on the long side is attached. At this time, the side portion of the lower plate 10a is supported from below by the third long plate 44. Next, the θ table 4 is driven to rotate the display panel 10 by 90 °, and in the same manner, the short side of the lower plate 10a is connected to the third long plate 4.
4 from below, supporting the ACF 201 on the electrode 30b.
Affix.

After the ACF 201 is attached in this way, a flip chip as a device is then bonded onto the ACF 201. FIG. 21 shows a state in which flip chips are bonded. As shown in the figure, the flip chip 202 is vacuum-sucked to the collet 203 and bonded onto the ACF 201. in this case,
As shown in FIG. 21, the bumps (electrodes) formed on the lower surface of the flip chip 202 and the long side electrodes 30a of the lower plate 10a are observed by the first camera 121 or the second camera 122, and based on the observation results. Position the bumps and the electrodes 30a, and then flip-chip 202 the ACF.
Bond to 201. Of course, also in this case, the third long plate 44 supports the lower plate 10a near the sides from below.

Next, the θ table 4 is driven to drive the display panel 1
0 is rotated by 90 °, and similarly, a flip chip is bonded onto the ACF 201 attached on the electrode 30b on the short side. In the case of flip chip bonding, only one camera is required, and the first head 91a and the second head 91b shown in FIG. 3 are unnecessary. As described above, the present invention can be applied not only to the device manufactured by the TAB method but also to a bonding device for bonding a flip chip.

[0062]

As described above, according to the present invention, the following effects can be obtained.

(1) Since a plurality of bonding positions provided on the sides of the display panel are supported from below by the third elongated plate, the supporting state of the display panel by the third elongated plate is maintained. Since a plurality of devices can be continuously bonded, the bonding work on one side can be efficiently and rapidly performed.

(2) Since the positional deviation between the electrodes of the display panel and the outer leads of the device is detected while the side portion of the display panel is supported by the third elongated plate, the third elongated plate contacts the display panel. Since the alignment can be performed in consideration of the positional deviation that occurs at the time of contact, highly accurate bonding can be realized.

(3) Since the central portion of the display panel is supported by the θ table, and the horizontal distance between the θ table and the third elongated plate is adjusted by the Y table equipped with a motor, the orientation of the display panel is θ. The table is changed, and the lower side of the side of the bonding station is accurately supported by the third elongated plate, so that the bonding work to different sides of the display panel can be automatically and continuously performed. Moreover, it is possible to easily cope with the change of the size of the display panel.

(4) A supply unit for supplying a film carrier, a cutting device for punching a device from the film carrier,
By providing two types of nozzles each for transferring the device to the upper part of the display panel and two heads for bonding the outer leads of the device to the electrodes of the display panel, the first device and the second device, which are different types, can be used for a long display panel. Can be automatically bonded to sides and short sides.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a device bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a moving mechanism of the display panel of the device bonding apparatus in the first embodiment of the present invention.

FIG. 3 is a sectional view of a bonding station of a device bonding apparatus according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of a lifting mechanism for a pole of a device bonding apparatus according to the first embodiment of the present invention.

FIG. 5 is a front view of the first supply unit of the device bonding apparatus according to the first embodiment of the present invention.

FIG. 6 is a sectional view of the first device of the device bonding apparatus according to the first embodiment of the present invention during pickup.

FIG. 7 is a perspective view of a first head of a device bonding apparatus according to the first embodiment of the present invention.

FIG. 8 is a sectional view of the first head of the device bonding apparatus in the first embodiment of the present invention.

FIG. 9 is a perspective view of an essential part of the device bonding apparatus during bonding according to the first embodiment of the present invention.

FIG. 10 is a perspective view of an observation apparatus of a device bonding apparatus according to the first embodiment of the present invention.

FIG. 11 is a cross-sectional view of an observation device of a device bonding apparatus according to the first embodiment of the present invention.

FIG. 12 (a) is a plan view of the first device being observed by the device bonding apparatus according to the first embodiment of the present invention. FIG. 12 (b) is a first camera of the device bonding apparatus according to the first embodiment of the present invention. (C) View of the second camera of the device bonding apparatus in the first embodiment of the present invention

13A is a sectional view of a positioning mechanism of a display panel of a device bonding apparatus according to the first embodiment of the present invention. FIG. 13B is a sectional view of a positioning mechanism of a display panel of a device bonding apparatus according to the first embodiment of the present invention. Sectional view (c) Sectional view of the positioning mechanism of the display panel of the device bonding apparatus in the first embodiment of the present invention

FIG. 14 is a schematic plan view of a device bonding apparatus according to the first embodiment of the present invention.

FIG. 15A is a sectional view of the first device of the device bonding apparatus in the first embodiment of the present invention during bonding of the first device to the display panel; FIG. 15B is a sectional view of the device bonding apparatus of the first embodiment of the present invention. Sectional view during bonding of device 1 to the display panel

16A is a sectional view of the first device of the device bonding apparatus in the first embodiment of the present invention during bonding of the first device to the display panel; FIG. 16B is a cross-sectional view of the device bonding apparatus of the first embodiment of the present invention; Sectional view during bonding of device 1 to the display panel

FIG. 17 is a cross-sectional view during bonding of the first device of the device bonding apparatus in the first embodiment of the present invention to the display panel.

FIG. 18 is a schematic plan view of the device bonding apparatus in the first embodiment of the present invention.

19 (a) is a plan view of a device bonding apparatus display panel and a third elongated plate in the first embodiment of the present invention. FIG. 19 (b) is a device bonding apparatus display panel of the first embodiment of the present invention. Plan view of the third long plate

FIG. 20 is a partial cross-sectional view during bonding of the ACF of the device bonding apparatus in the second embodiment of the present invention.

FIG. 21 is a cross-sectional view of essential parts during bonding of a flip chip of a device bonding apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Moving means 2 X table device 3 Y table device 4 (theta) table device (1st support part) 10 display panel 30a electrode 30b electrode 44 3rd long board (2nd support part) 55a 1st cutting device 55b 1st 2 cutting device 58a 1st upper mold 58b 2nd upper mold 59a 1st lower mold 59b 2nd lower mold 70a 1st supply part 70b 2nd supply part 74a 1st film carrier 74b 2nd Film carrier 80 Turntable 82a Motor (rotating means) 84 First nozzle 85 Second nozzle 91a First head 91b Second head 111 Thermocompressor 120 Observation device 201 ACF (device) 202 Flip chip (device) P1 First device P2 Second device L Outer lead

Claims (13)

[Claims] 1. A bonding apparatus for aligning and bonding electrodes of a device to electrodes formed at a plurality of bonding positions on a side portion of a display panel, the first support supporting the display panel from below. Part, a second support part for supporting the bonding positions at a plurality of sides of the display panel from below, and a position for aligning the electrode of the device with the electrode formed on the upper surface of the end part of the display panel. A device bonding apparatus comprising: a matching unit; and a bonding unit that bonds the electrodes of the aligned device to the electrodes of the display panel by pressing them. 2. The device bonding apparatus according to claim 1, further comprising moving means for horizontally moving the first supporting part together with the second supporting part. 3. A θ table device in which the first support part supports the central part of the display panel and horizontally rotates, and the horizontal distance between the θ table device and the second support part is changed. The device bonding apparatus according to claim 1, further comprising distance changing means. 4. The device bonding apparatus according to claim 3, wherein the distance changing means is a Y table device that moves the θ table device toward the second support portion. 5. The device according to claim 1, further comprising lifting drive means for lifting and lowering the second support portion to support and release the bonding position of the display panel. Bonding equipment. 6. A first supporting portion for supporting the display panel from below, a second supporting portion for exposing a side portion of the display panel to support a device bonding position from below, and the second supporting portion. In a state where the side portion of the display panel is supported by a section, an observing device for observing the exposed side portion of the display panel from below, an electrode of the display panel detected by the observing device, and an outer lead of a device. Alignment means for aligning the outer lead of the device with the electrode formed on the side portion of the display panel based on the displacement, and bonding means for pressing the aligned outer lead to the electrode for bonding A device bonding apparatus characterized in that 7. The device bonding apparatus according to claim 6, wherein the observing device is provided with two caramers, and the two fields are simultaneously observed by respective fields of view of these cameras. 8. The device bonding apparatus according to claim 7, further comprising a space adjusting means for adjusting a size of the space between the fields of view. 9. A moving means for horizontally moving the display panel relative to the device in order to correct the positional deviation between the electrode of the display panel and the outer lead of the device detected by the observation device. 7. The device bonding apparatus according to claim 6, further comprising rotating means for horizontally rotating a nozzle for vacuum-sucking the device. 10. The device according to claim 9, wherein the moving means is an X table device, a Y table device, or a θ table device that moves the display panel in the X, Y, and θ directions. Bonding equipment. 11. A moving means for horizontally moving the display panel, a supporting portion below the bonding position of the device, for supporting a side portion of the display panel on which electrodes are formed from below, and an end portion from below. Elevating and lowering driving means for supporting and releasing the supporting state for raising and lowering the supporting portion, a nozzle for vacuum-adsorbing the device to position the outer lead of the device right above the electrode, and the bonding Below the position, an observation device for observing the positions of the electrode and the outer lead, and a head for bonding the outer lead to the electrode by elevating the thermocompressor at the bonding position are provided. Device bonding equipment. 12. A step of driving a moving means on which a display panel is mounted to move the display panel to a bonding position, and raising and lowering a supporting portion provided at a bonding position of a device by a lifting drive means, The process of supporting the side part of the display panel from below and the outer lead of the device vacuum-adsorbed by the nozzle,
Positioning above the electrodes formed on the sides of the display panel, and locating the outer lead and the electrodes in the X, Y, and θ directions by an observation device provided below the device bonding position. And the display panel is relatively moved in the X direction, the Y direction, and the θ direction in order to correct the positional deviation in the X direction, the Y direction, and the θ direction detected in the step. And a step of lowering a thermocompressor of the head to bond the outer lead to the electrode. 13. An X for horizontally moving a display panel in the X direction.
Moving means including a table device, a Y table device for horizontally moving in the Y direction, and a θ table device for horizontally rotating, a first supply unit for supplying a first film carrier, and a second film carrier. A second supply unit, a first cutting device for punching the first film carrier supplied from the first supply unit by a first upper die and a first lower die, and the second supply unit A second cutting device for punching a second film carrier supplied from a second section with a second upper mold and a second lower mold; and a second cutting device punched by the first cutting device on the first lower mold. A first nozzle for vacuum-sucking and picking up a first device located on the second device, and a second device punched by the second cutting device and located on the second lower mold by vacuum-sucking and picking up. To the second nozzle and the first nozzle A first head for bonding the outer lead of the first device picked up by an electrode to an electrode on one side of the display panel, and the outer lead of the second device picked up by the second nozzle. And a second head for bonding to the electrode on the other side of the display panel.