JP4022154B2 - Die bonding equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a die bonding apparatus for bonding a chip such as a semiconductor to a lead frame.
[0002]
[Prior art]
Conventionally, when bonding a semiconductor chip to a lead frame, a die bonding apparatus has been used.
[0003]
The die bonding apparatus includes: a transport rail that transports a lead frame; a feed mechanism that pitch-feeds the lead frame on the transport rail; a dispenser that applies an epoxy agent in advance to bonding points of the lead frame; and a wafer ring. A supporting stage, a push-up mechanism that pushes up a chip on a sheet stretched on the wafer ring from below, and a bonding head that picks up the chip pushed up by the push-up mechanism are provided.
[0004]
The pickup point by the bonding head is fixed, and the stage is supported so as to be movable in the XY directions so that the chip to be bonded can be positioned at the pickup point.
[0005]
[Problems to be solved by the invention]
However, in recent years, the wafer size has been increased, and the stage supporting the wafer ring has been increased in diameter.
[0006]
This stage is provided so as to be movable in the XY directions so that the chip to be bonded can be positioned at the pickup point, and the movable range of the stage increases as the stage becomes larger. As a result, the die bonding apparatus is increased in size, and there is a problem that installation space is required.
[0007]
The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a die bonding apparatus capable of preventing an increase in installation space.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, in the die bonding apparatus of the present invention, a dispenser for applying a bonding agent to bonding points of a strip-shaped lead frame and a wafer ring chip held at a holding position are picked up and bonded. In a die bonding apparatus comprising a bonding head that transfers to the bonding point coated with a material, a pair of slide rails that are spaced apart and extend in the Y direction, and the wafer ring that extends between both slide rails A pair of wafer support rails slidably supported, a vertically movable stage for holding the wafer ring supported by the wafer support rail from the lower side at the holding position, and the wafer at the front end side of the wafer support rail Select a plurality of wafer holders provided at a position lower than the height of the support rail. In particular, a wafer changer that moves up and down in accordance with the height position of the wafer support rail, a wafer ring moving mechanism that moves the wafer ring between the wafer accommodating portion and the holding position, and a slide rail that is movably supported. A first Y table, an elevating unit provided on the first Y table and movable in the X direction intersecting with the Y direction, and a unit for selectively elevating the dispenser and the bonding head provided in the elevating unit. An elevating mechanism, a second Y table movably supported by the slide rail, and provided in the second Y table, extending in the X direction for supporting the lead frame slidably at a higher position than the stage. A work support rail and a work for holding the lead frame supported by the work support rail. A tray is provided with a drive arm that drives the work tray to the X direction and the vertical direction.
[0009]
That is, when bonding the wafer ring chip to the lead frame, the strip-shaped lead frame is held by the work tray, and the second Y table moving in the Y direction and the drive arm driving in the X direction are operated, The work tray is moved so that the bonding point of the lead frame is separated from the pickup point of the chip of the wafer ring by a predetermined distance.
[0010]
At this time, the work tray is disposed at a higher position than the stage that supports the wafer ring, and interference between the work tray and the stage when the work tray is moved onto the stage is reliably prevented.
[0011]
Next, after driving the first Y table that moves in the Y direction and the lifting unit that moves in the X direction to recognize the lead frame, the dispenser of the lifting unit is placed on the lead frame and the bonding agent is applied to the bonding point To do. After that, after driving the lifting unit to recognize the chip, the bonding head of the lifting unit is moved to the pickup point to pick up the chip, and the bonding head is moved to the bonding point to apply the chip to the bonding point. Place and fix on the bonding agent.
[0012]
Thus, when picking up the wafer ring chip on the stage, the bonding head is moved in accordance with the chip to be bonded, and the pick-up point by the bonding head is varied with respect to the stage. For this reason, the wafer ring chips can be sequentially picked up by the bonding head and transferred to the lead frame without moving the stage that supports the wafer ring.
[0013]
At this time, the dispenser and the bonding head provided in the lifting unit are selectively lifted and lowered by a unit lifting mechanism.
[0014]
On the other hand, when the bonding of the wafer ring chip held on the stage is completed, the first and second Y tables are moved to the back side along the slide rail to open the upper space of the wafer changer, and the wafer changer. The empty wafer accommodating portion is raised in accordance with the height position of the wafer support rail. Then, the stage is lowered to release the holding state of the wafer ring, and the wafer ring is accommodated in the wafer accommodating portion by the wafer ring moving mechanism.
[0015]
Next, the wafer containing part containing the wafer ring is moved up and down to the height position of the wafer support rail, and the unused wafer ring is moved from the wafer containing part to the holding position by the wafer ring moving mechanism. Raise the stage and fix the wafer ring. Thereafter, the first and second Y tables are returned to their home positions, and the wafer changer is lowered to a position lower than the height position of the wafer support rail.
[0016]
In this manner, the wafer changer that has been raised to the height position of the wafer support rail during the wafer ring replacement can be lowered to a position lower than the wafer support rail after the replacement is completed. For this reason, since the upper space of the wafer changer can be used at the start of bonding, the wafer changer can be built into the die bonding apparatus without affecting the bonding operation.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a die bonding apparatus 1 according to the present embodiment. The die bonding apparatus 1 is an apparatus for bonding a chip 2 such as a semiconductor to a lead frame 3.
[0018]
As shown in FIG. 2, the die bonding apparatus 1 is provided with a pair of slide rails 12, 12 extending in the Y direction 11 so as to be separated from each other. It extends to the back side. A pair of wafer support rails 13 and 13 are provided on the inner side of both slide rails 12 and 12, and a wafer changer 14 is provided on the front side thereof.
[0019]
The wafer support rails 13 and 13 are formed in an L-shaped cross section so that the wafer ring 21 can be slid along the wafer support rails 13 and 13 while supporting the edge of the wafer ring 21. It is configured. A holding position 22 for holding the supported wafer ring 21 is set between the wafer support rails 13 and 13. The wafer ring 21 is located immediately below the holding position 22 as shown in FIG. A stage 24 having a circular groove for holding the wafer ring 21 at the holding position 22 is disposed in a state where the sheet 23 stretched on the bottom surface is adsorbed from the lower surface, and the stage 24 is not shown in the left and right sides. It is supported by an elevating mechanism so as to be movable up and down. The stage 24 is formed in a ring shape with an open center.
[0020]
As shown in FIG. 3, the wafer changer 14 includes a standing tower 41, a cassette lifter 42 slidably supported on the tower 41, and a lift mechanism 43 that moves the cassette lifter 42 up and down along the tower 41. And. The cassette lifter 42 is configured to be moved up and down by the lift mechanism 43. The upper surface of the cassette lifter 42 constitutes a support surface 47 that supports a wafer cassette 46 that is detachably set. A positioning portion 48 that positions the wafer cassette 46 projects from the support surface 47. Yes.
[0021]
The wafer cassette 46 is formed of a box having handles 51 and 51, and a plurality of upper and lower stages of wafer accommodating portions 52 for accommodating the wafer ring 21 are provided therein. Each wafer accommodating portion 52 is open on the wafer support rails 13 and 13 side. As a result, the lift mechanism 43 is operated to selectively move the entrance / exit of each of the wafer accommodating portions 52,... According to the height position of the wafer support rails 13, 13, as shown in FIG. As described above, the wafer cassette 46 can be lowered below a height position of a push-up mechanism 103 (described later) located at a position lower than the wafer support rails 13 and 13.
[0022]
As shown in FIG. 4, a wafer ring moving mechanism 61 for moving the wafer ring 21 of the wafer support rails 13, 13 is provided on the side portions of the wafer support rails 13, 13. The wafer ring moving mechanism 61 includes a replacement rail 62 that extends along the wafer support rails 13 and 13 and a slider 63 that is slidably supported by the replacement rail 62. The slider 63 is configured to be moved along the replacement rail 62 by a drive mechanism including a belt and a pulley. The slider 63 includes a central portion of the wafer support rails 13 and 13. An extending exchange arm 64 is provided. A gripper 65 that sandwiches the wafer ring 21 is provided at the tip of the exchange arm 64 so as to be freely opened and closed.
[0023]
As a result, the wafer ring 21 supported by the wafer support rails 13 and 13 at the holding position 22 is pressed by the gripper 65 in the closed state and positioned at the height position of the wafer support rails 13 and 13. It is configured to be accommodated in the wafer accommodating portion 52 of the wafer cassette 46. Further, the wafer ring 21 of the wafer accommodating portion 52 at the height position of the wafer support rails 13 and 13 is pulled out by being sandwiched by the gripper 65 and moved along the wafer support rails 13 and 13 to hold the wafer. It can be moved to the position 22.
[0024]
As shown in FIG. 1, the first Y table 71 is slidably supported on the both sides of the slide rails 12 and 12, and the second Y table 72 is slidably supported on the front side. Yes.
[0025]
A tray driving mechanism 81 is provided above the second Y table 72, and the tray driving mechanism 81 is provided with a driving mechanism for moving the second Y table 72 along the slide rails 12 and 12. Yes. As shown in FIG. 2, the tray drive mechanism 81 is provided with support arms 82 and 82 extending toward the first Y table 71 at a higher position than the wafer support rails 13 and 13. The support arms 82, 82 are provided with work support rails 85, 85 extending in the X direction 84 that support the strip-shaped lead frame 3 received from the work loader 83.
[0026]
The tray drive mechanism 81 is provided with a drive arm 91 that is slid in the X direction 84 by the built-in drive mechanism and is driven up and down in the Z direction 86. The length is set to reach between the support rails 85. At the front end of the drive arm 91, a work tray 92 is provided that sucks and holds the lead frame 3 supported by the work support arms 82 and 82.
[0027]
As a result, the lead frame 3 attracted and held by the work tray 92 is moved to an arbitrary position in the X direction 84 and the Y direction 11 by the tray driving mechanism 81 and moved onto the wafer ring 21 held by the stage 24. It is configured to be able to. Further, when the lead frame 3 is discharged out of the work support rails 85, 85, the work tray 92 is lowered to release the residual pressure of the vacuum adsorbing the lead frame 92, and the work tray 92 by extrusion is released. It is comprised so that rubbing with can be prevented.
[0028]
As shown in FIGS. 1 and 5, a lower arm 101 extending toward the first Y table 71 is provided below the second Y table 72. A push-up mechanism 103 is provided at the tip of the lower arm 101 via a push-up portion moving mechanism 102. The push-up mechanism 103 is driven in the X direction 84 by the push-up portion moving mechanism 102 and The 2Y table 72 is driven in the Y direction 11 by a drive mechanism that moves along the slide rails 12 and 12 so that the 2Y table 72 can be moved to a pickup point 104 for picking up the chip 2. The push-up mechanism 103 includes a push-up stage 105 that is in sliding contact with the lower surface of the sheet 23 of the wafer ring 21 in a state where the push-up mechanism 103 is disposed in the opening of the stage 24, and a push-up pin in the stage 105. By moving upward, the chip 2 at the pickup point 104 is configured to be pushed up higher than the surrounding chips 2.
[0029]
The push-up mechanism 103 is provided at a position away from the work tray 92 toward the first Y table 71 by a predetermined distance. Thus, the length in the Y direction 11 from the pickup point 104 on the push-up pin of the push-up mechanism 103 to the bonding point 111 of the lead frame 3 held on the work tray 92 is set to be always constant. The bonding point 111 determined by the position of the work tray 92 and the pickup point 104 determined by the position of the push-up mechanism 103 do not overlap.
[0030]
As shown in FIG. 1, the first Y table 71 is provided with a unit driving mechanism 121, and the unit driving mechanism 121 has the first Y table 71 attached to the slide rails 12 and 12. A drive mechanism that moves along is provided. The unit driving mechanism 121 is provided with an elevating unit 123 on the second Y table 72 side via an X-direction driving mechanism 122, and the chip 2 is detachably attached to the elevating unit 123. A bonding head 124 is provided. Thereby, when picking up the chip 2 of the wafer ring 21, the bonding head 124 is moved in accordance with the chip 2 to be picked up, and the pick-up point 104 of the chip 2 by the bonding head 124 is fixed to the wafer ring 21. The stage 24 is configured to be variable.
[0031]
As shown in FIG. 6, an extruding claw 132 for feeding the lead frame 3 that has been bonded from above the work support rails 85, 85 is supported on the base 131 of the elevating unit 123 in a tiltable manner. A recognition camera 133 is provided on the side of the push-out claw 132 so that an image of the lower part of the lifting unit 123 can be acquired and image analysis (position and angle correction) can be performed by a control device (not shown). ing.
[0032]
Slide rails 141 extending in the vertical direction are provided on the side portion of the recognition camera 133, and an L-shaped first base 142 moves up and down via the slider on the slide rail 141. It is supported freely. The first base 142 is urged upward by a coil spring (not shown), and the upper limit position is regulated by abutting against a stopper 144 provided on the top plate 143 of the elevating unit 123. The first base 142 is provided with the bonding head 124.
[0033]
A movable base 151 is provided on the side of the first base 142, and the movable base 151 is also supported on the slide rail 141 so as to be movable up and down. A unit elevating mechanism 153 made of a ball screw that is operated by a drive motor 152 is provided at a side portion of the movable base 151, and the movable base 151 moves up and down according to the rotation of the drive motor 152. As a result, when the movable base 151 is lowered, the contact portion 155 presses the first base 142 downward and moves the first base 142 together with the bonding head 124.
[0034]
As shown in FIG. 7, a second base 161 is supported on the side of the base 131 of the elevating unit 123 via a slide rail (not shown) extending vertically. The 2 base 161 is provided with a dispenser 162 for applying an epoxy agent as a bonding agent to the lead frame 3. The second base 161 is urged downward by a coil spring 163, and an L-shaped piece 164 provided at the end of the second base 161 is freely rotatable on the side plate 165 of the lifting unit 123. The cam plate 166 is pivotally supported by the cam follower 167 at one end of the cam plate 166 from above.
[0035]
The other end of the cam plate 166 is biased downward by a coil spring 172 supported by the bottom plate 171, and the other end abuts on an L-shaped piece 173 provided on the side plate 165. In this state, downward rotation is restricted. As shown in FIG. 6, an operating plate 175 extending from the movable base 151 is slidably contacted with the cam follower 174 provided at the other end of the cam plate 166 from below, thereby forming a cam mechanism 176. ing. As a result, when the movable base 151 rises and the operation plate 175 presses and pushes up the other end of the cam plate 166, one end of the cam plate 166 allows the second base 161 to descend. The second base 161 is configured to move downward together with the dispenser 162.
[0036]
This embodiment according to the above configuration will be described with reference to the flowcharts shown in FIGS.
[0037]
That is, when the control device (not shown) performs the bonding process, the strip-shaped lead frame 3 is supplied from the work loader 83 to the work support rails 85 and 85 and is held by the work tray 92 (S1). The recognition camera 133 of the elevating unit 123 is moved on the frame 3 to acquire an image of the lead frame 3, and the bonding points 111 at various places are recognized (S2). The work tray 92 is moved so that the recognized bonding point 111 is separated from the pickup point 104 of the chip 2 by a predetermined offset amount (S3).
[0038]
At this time, the work tray 92 that holds the lead frame 3 mounted thereon is disposed at a higher position than the stage 24 that supports the wafer ring 21. For this reason, it is possible to reliably prevent interference between the work tray 92 and the stage 24 when the work tray 92 is moved onto the stage 24.
[0039]
Thereby, since the horizontal arrangement space can be reduced, space saving can be realized by downsizing as compared with the conventional die bonding apparatus. Further, since the bonding point 111 and the pickup point 104 can be brought close to each other, the speed can be increased.
[0040]
The work tray 92 is moved by a tray moving mechanism 81 in accordance with the positional relationship between the bonding point 111 of the placed lead frame 3 and the pickup point 104 of the chip 2. Therefore, the bonding between the bonding point 111 and the pickup point 104 is prevented, and the lead frame 3 is placed on the wafer ring 21 supported by the stage 24 while maintaining the distance between the points 104 and 111 at a predetermined distance. Can be arranged.
[0041]
Then, the push-up pin of the push-up mechanism 103 driven by the push-up portion moving mechanism 102 is moved to the pickup point 104 (S4). At this time, since the distance in the Y direction 11 of the pickup point 104 with respect to the bonding point 111 is determined, only the X direction 84 is moved.
[0042]
Next, the dispenser 162 of the elevating unit 123 is moved onto the lead frame 3 to apply an epoxy agent to each bonding point 111,... (S5).
[0043]
Specifically, the lifting / lowering unit 123 is moved to the bonding point 111 by the unit driving mechanism 121, and the dispenser 162 provided in the lifting / lowering unit 123 is disposed on the bonding point 111. In this state, the movable base 151 is raised by the unit lifting mechanism 153 of the lifting unit 123, the cam mechanism 176 is operated by the movable base 151, and the second base 161 is moved downward. As a result, the dispenser 162 provided on the second base 161 can be lowered and the bonding agent can be applied to the bonding point 111 by the dispenser 162.
[0044]
Thereafter, the recognition camera 133 of the elevating unit 123 is moved onto the wafer fixed by the stage 24 to recognize the position of the chip 2 to be picked up (S6), and the bonding head 124 is moved to the pickup point 104 and the bonding head is moved. The chip 2 is picked up at 124 (S7).
[0045]
Specifically, the lifting / lowering unit 123 is moved by the unit driving mechanism 121, and the bonding head 124 provided in the lifting / lowering unit 123 is disposed on the pickup point 104. In this state, the movable base 151 is lowered by the unit lift mechanism 153 of the lift unit 123, and the first base 142 is pressed by the movable base 151 to move downward. As a result, the bonding head 124 provided on the first base 142 is lowered, and the chip 2 at the pickup point 104 can be picked up by the bonding head 124.
[0046]
Then, the bonding head 124 is moved to the bonding point 111 to place and fix the chip 2 on the epoxy agent applied to the bonding point 111 (S8).
[0047]
Also in this case, the lifting / lowering unit 123 is moved by the unit driving mechanism 121, and the bonding head 124 provided in the lifting / lowering unit 123 is disposed on the bonding point 111. In this state, the movable base 151 is lowered by the unit lift mechanism 153 of the lift unit 123, and the first base 142 is pressed by the movable base 151 to move downward. Thereby, the bonding head 124 provided on the first base 142 can be lowered, and the chip 2 held by the bonding head 124 can be placed on the bonding point 111.
[0048]
As described above, the unit elevating mechanism 153 provided in the elevating unit 123 raises or lowers the movable base 151, whereby the bonding head 124 provided in the first base 142 and the dispenser provided in the second base 161. 162 can be selectively lowered.
[0049]
Therefore, the configuration can be simplified as compared with the conventional case in which the dispenser lifting mechanism for lifting the dispenser 162 and the head lifting mechanism for lifting the bonding head 124 are individually provided. Further, since the unit lifting mechanism 153 can be shared, the number of drive shafts can be reduced, and a cost merit can be obtained. Furthermore, the overall apparatus can be reduced in weight.
[0050]
In addition, the dispenser 162 and the bonding head 124 can be moved by the unit driving mechanism 121 that moves the lifting unit 123. Thereby, simplification of the further structure can be achieved.
[0051]
Further, when the chip 2 of the wafer ring 21 on the stage 24 is picked up, the bonding head 124 is moved in accordance with the chip 2 to be bonded, and the pickup point 104 by the bonding head 124 is moved with respect to the stage 24. Variable. Therefore, the chips 2 on the wafer ring 24 can be sequentially picked up by the bonding head 124 and transferred to the lead frame 3 without moving the stage 24 that supports the wafer ring 24.
[0052]
Therefore, the stage diameter can be changed compared to the conventional die bonding equipment that has to secure the movable range of the stage because the stage is moved at the time of pickup and the chip to be bonded is positioned at the pickup point. The accompanying apparatus can be prevented from increasing in size. Thereby, space saving of the installation place required can be achieved.
[0053]
At this time, the push-up mechanism 103 that pushes up the chip to be bonded from below is moved to the pickup point 104 by the push-up portion moving mechanism 102 and the second Y table 72. For this reason, since the chip 2 at the bonding point 111 can be pushed up by the push-up mechanism 102, the pickup of the chip 2 by the bonding head 124 can be facilitated.
[0054]
Then, it is determined whether or not the bonding to the lead frame 3 held on the work tray 92 is completed (S9), and the steps S3 to S8 are repeated until the bonding is completed. The lead frame 3 is pushed out to the right side of the apparatus by the push-out pawl 132 (S10), and then the process returns to the main routine and waits until the next bonding process starts.
[0055]
FIG. 10 is a flowchart showing a wafer exchange process executed when the wafer ring 21 is exchanged. When the bonding of the chip 3 of the wafer ring 21 held on the stage 24 is completed (SB1), the first and second Y The tables 71 and 72 are moved to the back side along the slide rails 12 and 12 to release the upper space of the wafer changer 14 (SB2), and the cassette lifter 42 moves the empty wafer storage portion 52 of the wafer cassette 46 to the wafer support rail. 13 and 13 (SB3), the stage 24 is lowered to release the holding state of the wafer ring 21 (SB4), and the wafer gripper 65 is closed by the closed gripper 65. 52 (SB5).
[0056]
Then, the wafer cassette 46 is moved up and down by the cassette lifter 42 so that the wafer accommodating portion 52 in which the unused wafer ring 21 is accommodated is aligned with the height position of the wafer support rails 13 and 13 (SB6). Is gripped by the gripper 65 and pulled out from the wafer accommodating portion 52, moved to the holding position 22 along the wafer support rails 13 and 13 (SB7), and the stage 24 is raised to fix the wafer ring 21. After that (SB8), the first and second Y tables 71 and 72 are returned to their home positions, and the wafer cassette 46 is lowered by the cassette lifter 42 to a position lower than the height position of the push-up mechanism 103 (SB9). Return to the main routine.
[0057]
Thus, the wafer cassette 46 disposed at the height position of the wafer support rails 13 and 13 at the time of wafer ring replacement can be moved to a lower position than the push-up mechanism 103 by the cassette lifter 42 after the replacement is completed. For this reason, since the upper space of the wafer changer 14 in which the wafer cassette 46 is set can be used at the time of starting bonding, the wafer having the wafer cassette 46 to the apparatus 1 is not affected without affecting the bonding operation. The changer 14 can be built in.
[0058]
Therefore, it is possible to reduce the installation space of the entire system as compared with the conventional case where the wafer ring exchange device and the wafer magazine have to be installed outside.
[0059]
【The invention's effect】
As described above, in the die bonding apparatus of the present invention, the wafer ring chips can be sequentially picked up by the bonding head and transferred onto the lead frame without moving the stage on which the wafer ring is supported. .
[0060]
Therefore, the structure of positioning the chip to be bonded at the pick-up point by moving the stage at the time of pick-up, compared to the conventional case where the movable range of the stage had to be secured, the size of the device accompanying the change of the stage diameter Can be prevented. Thereby, space saving of the installation place required can be achieved.
[0061]
Further, since the work tray on which the lead frame is placed is disposed at a higher position than the stage that supports the wafer ring, the horizontal arrangement space can be reduced while preventing interference between the work tray and the stage.
[0062]
As a result, space saving can be realized by downsizing as compared with the conventional die bonding apparatus. Furthermore, since the bonding point and the pickup point can be brought close to each other, the speed can be increased.
[0063]
And the dispenser and bonding head provided in the raising / lowering unit can be selectively raised / lowered by the unit raising / lowering mechanism. For this reason, compared with the conventional die bonding apparatus with which the dispenser raising / lowering mechanism which raises / lowers a dispenser and the head raising / lowering mechanism which raises / lowers a bonding head were provided separately, the structure can be simplified. Further, since the unit lifting mechanism can be shared, the number of drive shafts can be reduced, and cost merit can be obtained. Furthermore, the overall apparatus can be reduced in weight.
[0064]
In addition, the wafer changer that has been raised to the height position of the wafer support rail at the time of exchanging the wafer ring can be lowered to a lower position than the push-up mechanism after completion of the exchange. For this reason, since the upper space of the wafer changer can be used at the start of bonding, the wafer changer can be built into the die bonding apparatus without affecting the bonding operation.
[0065]
Therefore, it is possible to reduce the installation space of the entire system as compared with the conventional case where the wafer ring exchange device and the wafer magazine have to be installed outside.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing an embodiment of the present invention.
FIG. 2 is a plan view corresponding to FIG.
FIG. 3 is a front view of the main part showing the wafer changer of the same embodiment;
FIG. 4 is a plan view of the main part showing the wafer changer of the same embodiment;
FIG. 5 is an explanatory diagram showing a relationship between a pickup point and a bonding point according to the embodiment.
FIG. 6 is a front view of the main part showing the lifting unit of the embodiment.
7 is a side view of FIG. 6. FIG.
FIG. 8 is a flowchart showing a bonding process according to the embodiment;
FIG. 9 is a flowchart following FIG. 8;
FIG. 10 is a flowchart showing wafer exchange processing according to the embodiment;
[Explanation of symbols]
1 Die bonding equipment
2 chips
3 Lead frame
12 Slide rail
14 Wafer changer
13 Wafer support rail
21 Wafer ring
23 sheets
24 stages
42 Cassette lifter
46 Wafer cassette
52 Wafer container
61 Wafer ring moving mechanism
71 1st Y table
72 2nd Y table
82 Work tray
85 Work support rail
91 Drive arm
104 pickup points
111 Bonding points
121 Lifting unit
162 Dispenser
124 Bonding head
153 Unit lifting mechanism

Claims (1)

A die comprising a dispenser for applying a bonding agent to a bonding point of a strip-shaped lead frame, and a bonding head for picking up a wafer ring chip held at a holding position and transferring it to the bonding point to which the bonding agent has been applied. In bonding equipment,
A pair of slide rails spaced apart and extending in the Y direction;
A pair of wafer support rails extending between both slide rails and slidably supporting the wafer ring;
A vertically movable stage for holding the wafer ring supported by the wafer support rail at the holding position from below;
A wafer changer which is provided at a position lower than a height position of the wafer support rail on the front end side of the wafer support rail, and which selectively moves up and down a plurality of provided wafer storage portions according to the height position of the wafer support rail. When,
A wafer ring moving mechanism for moving the wafer ring between the wafer accommodating portion and the holding position;
A first Y table movably supported on the slide rail;
An elevating unit provided on the first Y table and movable in the X direction intersecting the Y direction;
A unit elevating mechanism for selectively elevating the dispenser and the bonding head provided in the elevating unit;
A second Y table supported movably on the slide rail;
A workpiece support rail provided in the second Y table and extending in the X direction for slidably supporting the lead frame at a higher position than the stage;
A work tray for holding the lead frame supported by the work support rail;
A drive arm for driving the work tray in the X direction and the vertical direction;
A die bonding apparatus comprising:

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