九、發明說明： 【發明所屬之技術領域】 ，尤指一種適用於半導體 本發明係關於一種測試裝置 封裝元件之測試裝置。 【先前技術】 半導體封裝元件需經由— 產品的功能，並針對測試後的 同等級評價。 測試設備以測試、驗證封裝 π件篩選，依其良窳給予不 參考圖卜其繪示習知之半導體封裝元件測試裝置。此 種習知之測試裝置係於-平台上設有多個（圖中為四组）同 時運送已測元件與待測元件之梭W、—三維機械手臂2、 及對應於梭台1之多組測試#元5。三維機械手臂2具有吸取 頭4用以吸放半導體元件β每一測試單元5具有一壓持器6。 每一梭台1滑行移動於一初始位置與對應之壓持器6之間， 且梭台1上包括有二置放槽3，其一用以放置待測元件，另 一用以放置已測元件，此處分別稱其為待測物置放槽及已 測物置放槽。 上述測試裝置之運作方式係為，首先梭台丨停止於一初 始位置，三維機械手臂2之吸取頭4移動至對應於供料盤7上 待測元件8之位置，並降下適當距離以吸取待測元件8。吸 取頭4接著再移動至對應於梭台丨之待測物置放槽上方之位 置’降下並將待測元件8放置於待測物置放槽。 載有待測元件8之梭台1接著再移動至使已測物置放槽 1336403 對應於測試單元5之壓持器6之位置，此時壓持器6會將吸附 於其上之已測元件（圖未示）放入已測物置放槽。然後梭台i 再偏移使待測物置放槽對準於壓持器6，讓壓持器6吸取待 測元件8。之後梭台1再移動回上述之初始位置，等待三維 5 機械手臂2將已測元件取走並放入一集料匣9、並再次將新 的待測元件置入待測物置放槽，三維機械手臂2對四組梭台 1重複上述之動作。 上述I知之測g式機台應用在測試時間較短的封裝元件 時，會因僅有一組機械手臂同時負責自供料盤上吸取待測 10元件並移放至四組梭台上、以及自四組梭台上吸取已測元 件並移放至集料g，造成已回到初始位置之梭台需長時等 待機械手臂將已測元件取走、及放入新的待測元件，浪費 相當多的等待時間，致使製程效率不佳。 15 【發明内容】 本發明包括有至少二測試單元、至少二轉運梭台、一 ::單元、-㈣單元、一二維機械手臂、及一三維機械 測試谭Μ母—賴單元係料橫向排列設置且包括有一 上述轉運梭台分別對應至丨 mm ^ ^ is ^ I式皁兀，每一轉運梭台可 =式地趨錢遠離其所對應之_單元，每 上包含有一待測物置放燐u 搏役σ 及—已測物置放槽。每一轉運 ，，直線移仃於-遠離其對應之測試單元 趙近其對應之測試單元且 且已測物置放槽對應至測試埠之 20 1336403 第二位置、及一趨近其對應之 應至測試埠之第三位置之間。 測試單元且待測物置放槽對IX. Description of the invention: [Technical field to which the invention pertains], particularly one suitable for semiconductors The present invention relates to a test apparatus for a test device package component. [Prior Art] Semiconductor package components are required to pass the function of the product and are evaluated for the same level after the test. The test equipment is tested and verified by the package π-piece, and the semiconductor package component test device of the conventional device is not referred to. The conventional test device is provided with a plurality of (four groups in the figure) on the platform to transport the measured component and the component to be tested, the shuttle W, the three-dimensional robot arm 2, and the plurality of groups corresponding to the shuttle 1 Test #元5. The three-dimensional robot arm 2 has a suction head 4 for sucking and dropping semiconductor elements β. Each test unit 5 has a holder 6. Each of the shuttles 1 is slidably moved between an initial position and a corresponding crimper 6, and the shuttle 1 includes two slots 3 for placing the components to be tested and the other for placing the measured The components, which are referred to herein as the object placement slots and the measured object placement slots, respectively. The above test device operates in such a manner that first, the shuttle sill stops at an initial position, and the suction head 4 of the three-dimensional robot arm 2 moves to a position corresponding to the component 8 to be tested on the supply tray 7, and is lowered by an appropriate distance to be sucked. Measuring element 8. The suction head 4 is then moved to a position corresponding to the position of the object to be tested corresponding to the shuttle ’ drop, and the element to be tested 8 is placed in the object-receiving groove. The shuttle table 1 carrying the component to be tested 8 is then moved to a position where the measured object placement groove 1364403 corresponds to the pressure holder 6 of the test unit 5, at which time the pressure holder 6 will adsorb the measured component thereon. (not shown) placed in the measured object placement slot. Then, the shuttle table i is re-shifted so that the object to be tested is aligned with the holder 6, and the holder 6 sucks the member 8 to be tested. Then the shuttle 1 moves back to the above initial position, waits for the 3D 5 robot 2 to take the measured component and put it into a stack 匣9, and again puts the new component to be tested into the test object placement slot, three-dimensional The robot arm 2 repeats the above actions for the four sets of shuttles 1. The above-mentioned I-measured g-type machine is applied to a package component with a short test time, because only one set of mechanical arms is responsible for taking the 10 components to be tested from the supply tray and transferring it to the four sets of shuttles, and from four The measured component is sucked on the group shuttle and moved to the aggregate g, so that the shuttle station that has returned to the initial position needs to wait for the robot arm to take the measured component and put it into the new component to be tested, which wastes a lot. Waiting time, resulting in poor process efficiency. 15 SUMMARY OF THE INVENTION The present invention includes at least two test units, at least two transfer drapes, a:: unit, a - (four) unit, a two-dimensional robotic arm, and a three-dimensional mechanical test Tan Yimu-Lai unit material horizontally aligned The above-mentioned transfer sills are respectively arranged to correspond to 丨mm ^ ^ ^ I type saponins, and each transfer sill can be steadily moved away from its corresponding _ unit, each of which contains a test object to be placed 燐u Battle σ and — The measured object is placed in the slot. For each transfer, the straight line moves away from the corresponding test unit Zhao Jin's corresponding test unit and the measured object placement slot corresponds to the test position 20 1336403 second position, and one approaches its corresponding response Test between the third position. Test unit and the object to be tested is placed in a slot pair
供料單元包括有一供料盤 容裝有複數個待測半導體封裴 料盤並將之移動至一供料位置 、及一载入裝置。供料盤上 元件，而載入裝置是承載供 集料單元包括有至少二集料盤 之已測半導體封裝元件。 10 上述二維機械手臂包括有一橫向滑軌、及一入料取放 器。橫向滑軌係平行於上述之測試單元設置，入料取放器 係滑㈣橫向㈣上’並直線滑移於供料單元之供料位 置、與轉運梭台分別位於其第一位置時之待測物置放槽之 間’入料取放器並可升降以取放待測半導體封裝元件。 15 分別容裝有不同等級 三維機械手臂包括有另一橫向滑軌、一懸臂、及一出 料取放$ H是滑設於另—橫向滑軌上，出料取放器是 滑設於懸臂上’並滑移於轉運梭台分齡於其第—位置時 之已測物置放槽、與集料單元之集料盤之間，出料取放器 且可升降以取放已測半導體封裝元件。 藉由上述之結構配置，執行測試製程時縮短了轉運梭 台等待機械手臂之時間，使製程速率提升。尤其可適用於 測試時間短的半導體封裝元件場合，例如賴時間短於Μ 秒的產品。 半導體封裝元件測試裝置之入料取放器、及出料取放 器至少其-可為真空吸頭式取放器更可進行崎旋轉， 以轉換半導體封裝it件之極性轉向，增加對不同產品之適 20 應性。 上述集料單元之集料盤可依預先定義之分類順序而橫 向排列。上述載人裝置可包括有—步進驅動器、及一移載 板步進驅動器連結於移載板，以步進方式移動移載板。 步進驅動器例如是一馬達、及一皮帶之組合。 半導體封裝元件測試裝置之配置可為：當轉運梭台分 別位於其第—位置時，每—轉運梭台之待測物置放槽位於 已測物置放槽及其對應之測試單元之間。 半導體封裝元件測試裝置可更包含有一堆疊升降機 構、一組分離夾爪、一空盤移送板、及一移送夾爪。上述 分離夾爪位於堆疊升降機構之上且為可伸縮，移載板及空 盤移送板則可移動進人堆疊升降機構之内部區域，移送夹 爪橫向滑衫-工作平台上，且可移行於空盤移送板與集 料單元之間。 【實施方式】 參考圖2至圖4，其分別矣會示本發明—較佳實施例之半 導體封裝元件測試裝置之立體圖、俯視圖、及省略二機械 手臂之立體圖。於本實施例中’半導體封裝元件測試裝置 係使用於封裝後半導體元件之測試製程，測試裝置包括一 工作平台90、六組測試單元5〇、六組轉運梭台4〇、一供料 單元6〇、-集料單元7G、二维機械手臂Μ、及三維機械手 臂30»本發明㈣橫向方向為圖2中所示標號χ之座標轴方 向、直向方向為標號Y之座標轴方向、高度方向為標號2之 座標I*方向。 =測試單元50設於工作平台9〇上且橫向直線地排列設 母測減單MO包括有一測試蜂“及一測試吸放器 . 2。六轉運梭台40恰分別對應至六測試單元5〇,每一轉運 • 5 =4G可選擇式地趨近或遠離其所對應之測試單㈣。每 :運梭台40上包含有—待測物置放槽41、及 敦槽42。 • ㈣吸以52與測料51大致位於同-條高度方向軸 #。因此僅執仃尚度方向升降之測試吸放器52恰可將所 10 =附^半導體％件置放於測料51 '或者自測試槔將已 測之半導體元件取走。 i述每—轉運梭台4G能在卫作平台9G_L直線移行於一 15 20 2置'一第二位置、以及一第三位置之間。第-位置 係和轉運梭台40遠離其對應之測試單元50之-特定位置； 第二位置係指轉運梭台4〇趨近其對應之測試單元^、且轉 運梭台40之已測物置放槽42恰對應至測試蜂51之一特定位 置，第三位置係指轉運梭台4〇趨近其對應之測試單元％、 且待測物置放槽41恰對應至測試埠51之一特定位置。另由 圖t可看出，备一轉運梭台4〇於第一位置時待測物置放 槽4!較已測物置放槽42靠近對應之測試單元5〇，也就是位 於其間之位置。 上述轉運梭台是由馬達帶動皮帶於線性滑軌上作位置 控制。而為了在相同移動距離有最小的機構尺寸，梭台上 有二滑軌與二時規皮帶輪，可使馬達帶動一時規皮帶輪時 9 1336403 便可以使梭台移動兩倍距離。 供料單元60位於工作平台90上且鄰近於二維機械手臂 20。供料單元60包括有複數個堆疊之供料盤81、及一載入 裝置61。每一供料盤81上皆容裝有複數個待測半導體封裝 5元件82，載入裝置61承載供料盤81並可將之移動至一供料 位置PS。 ” 於本實施例中，載入裝置61為包括有由一馬達及一皮 帶組成之馬達皮帶組合64所構成之步進驅動器62、及一移 載板63,其中移載板63上承載供料盤81，步進驅動器62連 10結於移載板63，以步進方式移動移載板63及其上之供料盤 81。 配合二維機械手臂20以及上述供料單元6〇所發揮之步 進驅動，可達到逐列取走供料盤81上待測半導體封裝元件 82。 當然，此處亦可以馬達驅動螺桿之方式達到步進控制 之目的。 15 集料單元包括有六組集料盤71，用以容裝不同等級 之已測半導體封裝元件82卜集料單元70之集料盤71依預先 定義之分類順序而橫向排列設置，且鄰近於上述之三維機 械手臂30。 二維機械手臂20包括有一橫向滑軌21、及一入料取放 20 器22 ’其中橫向滑軌21係平行於上述之測試單元5〇設置， 而入料取放器22則滑設於橫向滑軌21上，並直線滑移於供 料位置PS、與轉運梭台40分別位於其第一位置時之上述待 測物置放槽41之間。入料取放器22並可升降以取放待測半 導體封裝元件82。 10 二維機械手臂30包括有另一橫向滑軌31、一懸臂32、 及一出料取放器33。另一橫向滑軌31係平行於二維機械手 臂20之橫向滑軌21設置，懸臂32滑設於另一橫向滑軌31 上出料取放器33則是滑設於懸臂32上，並滑移於轉運梭 台40分別位於其第一位置時之已測物置放槽42、與集料單 兀70之集料盤71之間。出料取放器33且可升降以取放已測 半導體封裝元件821。 上述之機械手臂皆以馬達帶動滾珠螺桿方式進行移 動。上述之入料取放器22、及出料取放器33皆使用真空吸 附原理之真空吸頭式取放器。在取放器吸取半導體封裝元 件後’其更能以Z轴進行90度旋轉。 配合圖3參考圖5至圖8，其中第5圖顯示轉運梭台4〇位 於第一位置；第6圖顯示轉運梭台40位於第二位置；第7圖 顯示轉運梭台40位於第三位置；第8圖顯示轉運梭台4〇回到 第位置。以下以一例說明本發明測試裝置之運作。需特 別注意的是，為更容易清楚瞭解，僅針對其中一組轉運梭 台40之運作進行說明，其餘轉運梭台4〇之運作原理皆同前 者。 複數個供料盤81預先堆疊於供料單元6〇之移載板63 上，供料盤81放置有複數個待測半導體封裝元件82。欲進 行二維機械手臂20之取料時，步進驅動器62以步進方式帶 動移載板63，移載板63連帶與供料盤81步進地移動至供料 位置PS。 接著二維機械手臂20之入料取放器22滑移至供料位置 1336403 PS，並下降而吸取供料盤8丨上之待測半導體封裝元件82。 入料取放器22再攜帶著待測半導體封裝元件82滑移至靜止 於第一位置之轉運梭台4〇，且入料取放器22對準於轉運梭 台40之待測物置放槽41。於是入料取放器22直接下降並將 5待測半導體封裝元件82放置於待測物置放槽41，轉運梭台 - 40準備往第二位置移動（如箭頭所示），此時僅轉運梭台4〇 之待測物置放槽41容置有半導體封裝元件，狀態如圖5所 示。 • 轉運梭台40接收到待測半導體封裝元件82後便朝測試 10單元50直向移動至第二位置而停止，轉運梭台40之已測物 • 置放槽42恰對準於測試單元50之測試埠51(見於圖4)之位 置。於是測試單元50之測試吸放器52便下降先將已測半導 體封裝元件821放入已測物置放槽42，轉運梭台4〇並準備反 向移動至第三位置（如箭頭所示），此時轉運梭台4〇之二槽皆 15容置有半導體封裝元件，其狀態如圖6所示。 當轉運梭台40移動至第三位置，待測物置放槽41恰對 • 應於測試埠51(見於圖4)，測試單元5G之測試吸放器52便下 降將待測物置放槽4丨上之待測半導體封裝元件8 2吸出以進 行測》式轉運梭台4〇準備移動回第一位置（如箭頭所示）， 20此時僅轉運梭台4〇之已測物置放槽42容置有半導體封裝元 .件，狀態如圖7所示。 …當轉運梭台4G回到第—位置，二維機械手臂20便重新 進行自供料區PS取料、將料置於待測物置放槽41之動作， 而三維機械手臂30亦可同時動作將已測物置放槽42之已測 12 1336403 半導體封裝元件821取出、並放置於對應之集料盤71。此時 轉運梭台40之狀態同於圖5，僅待測物置放槽4丨容置有半導 體封裝元件’且轉運梭台40準備往第二位置移動，狀態如 圖8所示。圖8亦顯示出，當取完單一列之待測半導體封裝 5 元件82後，供料盤81受驅動而位移之情形，其令虛線表示 • 位移前狀態，藉此使供料盤81進入二維機械手臂20可取料 之範圍。 上述當一轉運梭台40已載運待測半導體封裝元件82至 測試埠51時，二維機械手臂2〇此時便可針對其他已回到第 10 一位置之轉運梭台40進行供料動作，而三維機械手臂30亦 同理運作，如此交錯運行，達到節省時間之目的。 另外，在上述之當轉運梭台40已移至第二位置、且測 試單元50正在置放已測半導體封裝元件821時，可藉由另外 預先架設之一 CCD感測器（圖未示）針對待測物置放槽41上 15之待測半導體封裝元件82進行影像辨別，以確保半導體封 裝元件之定位正確，當判定無誤時轉運梭台40才移至第三 位置接續如同上述之運作流程。 為更清楚瞭解本發明中供料單元之特點，以下將參考 圖9至圖16以《程例更詳細說明供料動作與集料動作。圖 20 9係繪示圖2之部分分解圖，其中更清楚顯示出用以供料、 出料之詳細元件。 本發月之測5式裝置除了如上述之供料單元、集料單元 之外、，更包括有一堆疊升降機構91、四分離夾爪92、一空 移送板72 &-移送夾爪73。四分離爽爪％位於堆疊升 (S ) 13 降機構91之上，可進行伸縮移動以接觸或離開供料盤81 , 且對應供料盤81而設置於四角落。堆疊升降機構91是以汽 缸與導桿組成之一般升降機構，當然亦可以馬達來控制。 移載板63及空盤移送板72之配置係滿足可移動進入堆 疊升降機構91之内部區域I。空盤移送板72係可移行於一空 盤暫存區T與堆疊升降機構91之内部區域I之間，其係以氣 缸與滑軌來達成線性滑移，亦可以馬達皮帶組合來達到線 性滑移。移送夾爪73是橫向滑設在工作平台9〇上，並可移 行於空盤移送板72與集料單元70之間。 參考圖10至圖16，其分別繪示元件供料與出料流程示 意圖。首先’工作人員將多個承載有待測半導體封裝元件 之供料盤81堆放至堆疊升降機構91 (如圖1〇所示）上方區 域，且由分離夾爪92所支撐。 接著移載板63移動到對應堆疊升降機構91内部區域 I ’而堆疊升降機構91上升使多個供料盤81被頂升，（如圖11 所示）。然後分離夾爪92縮回，且堆疊升降機構91回降以使 最下之供料盤8 la與其上之供料盤之中間位置約略對準於 分離夾爪92 ’進而再將分離夾爪92伸出以承載住除了最下 之供料盤8la以外之其它供料盤（如圖12所示），此時最下之 供料盤81a是由堆疊升降機構91所支持。此處需注意的是， 為使分離夾爪92方便執行分離動作，供料盤81設計成當相 互堆疊時形成有分離凹陷93，以本實施例而言，有四分離 凹陷93以對應四分離夾爪92。 之後’分離出的供料盤81a隨堆疊升降機構91更行下降 1336403 直至碰觸而承載於移載板63上（如圖13所示），再藉由移載板 63移動到供料位置PS(繪於圖9)，以供機械手臂取放其上之 待測半導體封裝元件。 而當供料盤81a上的所有待測半導體封裝元件被取空 5之後，移載板63便連同供料盤81a再次移回至堆疊升降機構 91内部區域I，且藉由堆疊升降機構91之上升以將空的供料 盤81a頂升並支撐（如圖14所示），移載板63則移離堆疊升降 機構91内部區域I。 然後，空盤移送板72移動到堆疊升降機構91内部區域 10丨，同時堆疊升降機構91下降以使空的供料盤81a接觸而承置 於空盤移送板72上（如圖15所示）。最後，空盤移送板72移回 到空盤暫存區τ，等待移送夾爪73將空盤移送板72上空的供 料盤81a取走並放到集料單元70(如圖16所示）。 因此本發明藉由各元件間特殊之相對位置設計，達到 15節省製程時間之功效，尤其可應用在習知技術難以適用之 短測s式時間產品之測試，例如測試時間少於十五秒之產〇。 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 20 【圖式簡單說明】 圖1係習知之半導體封裝元件測試裝置。 圖2係本發明一較佳實施例之半導體封裝元件測試裝置之 立體圖。 15 1336403 圓3係圖2之俯視圖。 圓4係圖2中省略部分元件之立體圖。 圓5至圖8係轉運梭台在不 4 不同知作階段之狀態示意圖 圖9係續不圖2之部分分解圖。 圖1〇至圖16係繪示元件供料與出料流程示意圖。 【主要元件符號說明】 梭台1 置放槽3 測試單元5 供料盤7 集料匣9 二維機械手臂2〇 入料取放器22 另一橫向滑軌3 1 出料取放器33 待測物置放槽41 測試單元5〇 測試吸放器52 载入裝置61 移載板63 集料單元70 空盤移送板72 供料盤81，81a 二維機械手臂2 吸取頭4 壓持器6 待測元件8 橫向滑軌21 二維機械手臂3 〇 懸臂32 轉運梭台40 已測物置放槽42 測試埠51 供料單元60 步進驅動器62 馬達皮帶組合64 集料盤71 移送夾爪73 待測半導體封裝元件82 1336403The feeding unit comprises a feeding tray for holding a plurality of semiconductor sealing trays to be tested and moving them to a feeding position, and a loading device. The components on the supply tray, and the loading device is a tested semiconductor package component that carries the aggregate unit including at least two manifolds. 10 The two-dimensional robotic arm includes a lateral rail and a feed picker. The transverse slide rail is arranged parallel to the above-mentioned test unit, and the feed pick-and-placer is slid (4) laterally (four) and is linearly slid to the feeding position of the feeding unit, and the transfer sill is located at its first position respectively. The sample placement device is placed between the measuring device and can be lifted and lowered to pick up the semiconductor package component to be tested. 15 respectively, different levels of 3D robotic arm are included, including another horizontal slide rail, a cantilever, and a discharge pick and place. The H is slided on the other-horizontal slide rail, and the discharge picker is slidably mounted on the cantilever. Upper and slipping between the measured object placement slot at the first position of the transfer sill, and the collecting tray of the collecting unit, the discharge picker is movable and can be lifted and lowered to take the tested semiconductor package element. With the above configuration, the execution of the test process shortens the time required for the transfer hopper to wait for the robot arm, and the process speed is increased. It is especially suitable for semiconductor package components with short test times, such as products with a shorter time than Μ seconds. The material pick-and-place device of the semiconductor package component testing device, and the discharge pick-and-place device at least - can be rotated by the vacuum nozzle type pick-and-place device to convert the polarity of the semiconductor package and turn to increase the product The appropriateness of 20. The collecting trays of the above-mentioned collecting unit can be arranged horizontally in a pre-defined sorting order. The manned device may include a stepping driver and a shifting plate stepper driver coupled to the transfer plate to move the transfer plate in a stepwise manner. The stepper drive is, for example, a combination of a motor and a belt. The semiconductor package component testing device can be configured such that when the transfer susceptor is located at its first position, the object to be tested of each transfer turret is located between the sample receiving slot and its corresponding test unit. The semiconductor package component testing apparatus can further include a stack elevator, a set of split jaws, an empty tray transfer plate, and a transfer jaw. The separation jaw is located above the stack lifting mechanism and is retractable, and the transfer board and the empty tray transfer board can be moved into the inner area of the stack lifting mechanism, and the transfer jaw is laterally slidable on the working platform, and can be moved on Between the empty tray transfer plate and the aggregate unit. [Embodiment] Referring to Figs. 2 to 4, respectively, a perspective view, a plan view, and a perspective view of a second mechanical arm of the semiconductor package component testing apparatus of the present invention are shown. In the present embodiment, the 'semiconductor package component test device is used in the test process of the packaged semiconductor component. The test device includes a working platform 90, six sets of test cells 5 〇, six sets of transfer sheds 4 〇, and a feed unit 6 〇, - aggregate unit 7G, two-dimensional robot arm Μ, and three-dimensional robot arm 30» The fourth direction of the present invention (4) is the coordinate axis direction of the label χ shown in Fig. 2, and the straight direction is the coordinate axis direction and height of the label Y The direction is the coordinate I* direction of the label 2. The test unit 50 is disposed on the working platform 9〇 and arranged in a horizontally straight line. The female test reduction MO includes a test bee and a test aspirator. 2. The six transfer shuttles 40 correspond to the six test units respectively. Each transporter • 5 = 4G can be selectively approached or away from its corresponding test sheet (4). Each: the shuttle station 40 contains - the object to be tested slot 41, and the trough 42. 52 and the measuring material 51 are located substantially in the same-strip height direction axis #. Therefore, only the test absorbing device 52 that is swaying in the direction of the slanting direction can place the 10=semiconductor% component in the measuring material 51' or self-test取Remove the measured semiconductor components. i. Each transfer turret 4G can travel linearly on the Guard Platform 9G_L at a distance between a second position and a third position. And the transfer shuttle 40 is away from the specific position of the corresponding test unit 50; the second position means that the transfer shuttle 4 is approaching its corresponding test unit ^, and the measured object placement slot 42 of the transfer shuttle 40 corresponds to To a specific position of the test bee 51, the third position means that the transfer shuttle 4〇 approaches its corresponding test unit% And the object to be tested placement slot 41 corresponds to a specific position of the test magazine 51. It can be seen from the figure t that the object to be tested is placed in the slot 4 when the transfer tray 4 is in the first position! The slot 42 is adjacent to the corresponding test unit 5〇, that is, the position therebetween. The above-mentioned transfer shuttle is driven by the motor to control the position of the belt on the linear slide, and in order to have the smallest mechanism size at the same moving distance, on the shuttle table There are two slide rails and two timing pulleys, which can move the shuttle table twice when the motor drives a one-time pulley. The feeding unit 60 is located on the working platform 90 and adjacent to the two-dimensional robot arm 20. Feeding The unit 60 includes a plurality of stacked supply trays 81 and a loading device 61. Each of the supply trays 81 houses a plurality of semiconductor package 5 components 82 to be tested, and the loading device 61 carries the supply tray 81. And can be moved to a feeding position PS. In the present embodiment, the loading device 61 is a stepping driver 62 comprising a motor belt assembly 64 consisting of a motor and a belt, and a loading a plate 63 in which the transfer plate 63 carries The feed tray 81, the stepper driver 62 is connected to the transfer plate 63, and moves the transfer plate 63 and the supply tray 81 thereon in a stepwise manner. In conjunction with the stepwise driving of the two-dimensional robot arm 20 and the feeding unit 6〇, the semiconductor package component 82 to be tested on the supply tray 81 can be removed column by column. Of course, it is also possible to achieve the purpose of step control by means of a motor driven screw. 15 The collecting unit comprises six sets of collecting trays 71 for accommodating different grades of the tested semiconductor package components 82. The collecting trays 71 of the collecting unit 70 are arranged horizontally in a pre-defined sorting order, and adjacent to The three-dimensional robot arm 30 described above. The two-dimensional robot arm 20 includes a lateral slide rail 21 and a feed pick-and-place 20 22', wherein the transverse slide rail 21 is disposed parallel to the test unit 5〇 described above, and the feed picker 22 is slidably disposed in the lateral direction. The slide rail 21 is linearly slid between the feeding position PS and the object to be tested placing groove 41 when the transfer bobbin 40 is at its first position. The feeder picker 22 can be raised and lowered to pick up the semiconductor package component 82 to be tested. The two-dimensional robot arm 30 includes another lateral rail 31, a cantilever 32, and a discharge picker 33. The other lateral slide rail 31 is disposed parallel to the lateral slide rail 21 of the two-dimensional robot arm 20, and the cantilever arm 32 is slidably disposed on the other lateral slide rail 31. The discharge picker 33 is slidably disposed on the cantilever 32 and slides. The object is placed between the measured object placement groove 42 and the collecting tray 71 of the collecting unit 70 when the transfer boring table 40 is located at the first position. The discharge picker 33 is lifted and lowered to pick up and drop the tested semiconductor package component 821. The above-mentioned robotic arms are all moved by the motor-driven ball screw. The above-mentioned feed pick-and-place device 22 and the discharge pick-and-placer 33 all use a vacuum suction type pick and place device of the vacuum suction principle. After the pick and place device draws the semiconductor package component, it is more capable of 90 degree rotation on the Z axis. Referring to FIG. 5 to FIG. 8 in conjunction with FIG. 3, wherein FIG. 5 shows that the transfer bobbin 4 is in the first position; FIG. 6 shows the transfer bobbin 40 in the second position; and FIG. 7 shows the transfer bobbin 40 in the third position; Figure 8 shows the transfer shuttle 4 〇 back to the first position. The operation of the test apparatus of the present invention will be described below by way of an example. It is important to note that for easier understanding, only the operation of one of the transfer turrets 40 is described, and the rest of the transfer turrets operate on the same principle. A plurality of supply trays 81 are pre-stacked on the transfer plate 63 of the supply unit 6A, and the supply tray 81 is placed with a plurality of semiconductor package components 82 to be tested. When the two-dimensional robot arm 20 is to be taken, the stepping driver 62 drives the transfer plate 63 in a stepwise manner, and the transfer plate 63 is sequentially moved to the supply position 81 with the supply tray 81. The feed picker 22 of the two-dimensional robot arm 20 is then slid to the feed position 1336403 PS and lowered to draw the semiconductor package component 82 to be tested on the feed tray 8 . The material pick-and-place device 22 further carries the semiconductor package component 82 to be tested to slide to the transfer tray 4〇 at a first position, and the feed pick-and-placer 22 is aligned with the object to be tested of the transfer susceptor 40. 41. Then, the material pick-up device 22 is directly lowered and the semiconductor package component to be tested is placed in the object-receiving groove 41, and the transfer-spin 40 is ready to move to the second position (as indicated by the arrow). The test object placement slot 41 of the stage 4 accommodates a semiconductor package component, and the state is as shown in FIG. • After receiving the semiconductor package component 82 to be tested, the transfer susceptor 40 is moved to the second position by the test 10 unit 50 to stop, and the measured object of the transfer susceptor 40 is placed on the test unit 50. Test 埠 51 (see Figure 4). Then, the test applicator 52 of the test unit 50 is lowered to first place the tested semiconductor package component 821 into the measured object placement slot 42, the transfer table 4〇 and ready to move to the third position (as indicated by the arrow). At this time, the two slots 15 of the transfer susceptor are accommodated with semiconductor package components, and the state thereof is as shown in FIG. 6. When the transfer susceptor 40 is moved to the third position, the test object placement slot 41 is exactly opposite to the test 埠 51 (see Fig. 4), and the test ejector 52 of the test unit 5G is lowered to place the test object in the slot 4 The semiconductor package component 8 2 to be tested is sucked out to perform the measurement of the transfer shuttle 4 〇 ready to move back to the first position (as indicated by the arrow), and at this time, only the measured object placement slot 42 of the shuttle 4 转运 is transferred. A semiconductor package element is placed, and the state is as shown in FIG. When the transfer boring table 4G returns to the first position, the two-dimensional robot arm 20 re-takes the material from the feeding area PS and places the material in the object-receiving groove 41, and the three-dimensional robot arm 30 can simultaneously operate. The measured 12 1336403 semiconductor package component 821 of the sample receiving slot 42 is taken out and placed in the corresponding collecting tray 71. At this time, the state of the transfer bobbin 40 is the same as that of Fig. 5, and only the test object placement slot 4 accommodates the semiconductor package component ' and the transfer bobbin 40 is ready to move to the second position, as shown in Fig. 8. Figure 8 also shows the case where the supply tray 81 is driven to be displaced after a single column of the semiconductor package 5 component 82 to be tested is taken, and the dotted line indicates the pre-displacement state, thereby causing the supply tray 81 to enter the second The range of the robot arm 20 is retractable. When the transfer tray 40 has carried the semiconductor package component 82 to be tested 51 to the test cassette 51, the two-dimensional robot arm 2 can now perform feeding operations for the other transfer trays 40 that have returned to the 10th position. The three-dimensional robot arm 30 also operates in the same way, so that it is staggered to achieve the purpose of saving time. In addition, when the transfer susceptor 40 has been moved to the second position and the test unit 50 is placing the tested semiconductor package component 821, a CCD sensor (not shown) may be additionally disposed in advance. The semiconductor package component 82 to be tested on the object-receiving slot 41 is subjected to image discrimination to ensure correct positioning of the semiconductor package component. When the determination is correct, the transfer susceptor 40 is moved to the third position to continue as described above. In order to more clearly understand the characteristics of the feeding unit of the present invention, the feeding operation and the collecting operation will be described in more detail with reference to Figs. 9 to 16 in the following. Figure 20 is a partial exploded view of Figure 2, showing the detailed components for feeding and discharging more clearly. In addition to the feeding unit and the collecting unit as described above, the measuring device of the present month includes a stack lifting mechanism 91, four separating jaws 92, and an empty moving plate 72 &-transporting jaw 73. The four separation claws are located above the stacked liter (S) 13 lowering mechanism 91, and are telescopically movable to contact or leave the supply tray 81, and are disposed at four corners corresponding to the supply tray 81. The stack lifting mechanism 91 is a general lifting mechanism composed of a cylinder and a guide rod, and can of course be controlled by a motor. The configuration of the transfer plate 63 and the empty tray transfer plate 72 is such that it can move into the inner region I of the stack elevating mechanism 91. The empty tray transfer plate 72 is movable between an empty tray temporary storage area T and an inner region I of the stack lifting mechanism 91, which is linearly slipped by a cylinder and a slide rail, and can also be linearly slipped by a motor belt combination. . The transfer jaws 73 are laterally slidably disposed on the work platform 9A and are movable between the empty tray transfer plate 72 and the aggregate unit 70. Referring to Figures 10 through 16, there are shown schematic representations of component feeding and discharging processes, respectively. First, the worker stacks a plurality of supply trays 81 carrying the semiconductor package components to be tested to the upper region of the stack elevating mechanism 91 (shown in Fig. 1A), and is supported by the separation jaws 92. Then, the transfer board 63 is moved to the inner area I ′ of the corresponding stack elevating mechanism 91 and the stack elevating mechanism 91 is raised to raise the plurality of supply trays 81 (as shown in Fig. 11). The separation jaws 92 are then retracted, and the stack lifting mechanism 91 is lowered so that the intermediate position of the lowermost supply tray 8 la and the supply tray thereon is approximately aligned with the separation jaw 92' and the separation jaw 92 is again disposed. Extending to carry the supply tray other than the lowermost supply tray 8la (as shown in Fig. 12), the lowermost supply tray 81a is supported by the stack lifting mechanism 91. It is to be noted here that, in order to facilitate the separation of the jaws 92, the supply trays 81 are designed to be formed with the separation recesses 93 when stacked on each other, and in the present embodiment, there are four separation recesses 93 to correspond to the four separations. Claw 92. Then, the separated supply tray 81a is lowered by 13364403 with the stack lifting mechanism 91 until it is touched and carried on the transfer board 63 (as shown in FIG. 13), and then moved to the feeding position PS by the transfer board 63. (pictured in Figure 9) for the robot arm to pick up and place the semiconductor package component to be tested. When all the semiconductor package components to be tested on the supply tray 81a are emptied 5, the transfer board 63 is again moved back to the inner region I of the stack lifting mechanism 91 together with the supply tray 81a, and by stacking the lifting mechanism 91 The rise is to raise and support the empty supply tray 81a (as shown in FIG. 14), and the transfer plate 63 is moved away from the inner region I of the stack lifting mechanism 91. Then, the empty tray transfer plate 72 is moved to the inner region 10 of the stack elevating mechanism 91 while the stack elevating mechanism 91 is lowered to bring the empty feed tray 81a into contact with the empty tray transfer plate 72 (as shown in Fig. 15). . Finally, the empty tray transfer plate 72 is moved back to the empty tray temporary storage area τ, waiting for the transfer gripper 73 to take the supply tray 81a over the empty tray transfer plate 72 and place it on the collecting unit 70 (as shown in Fig. 16). . Therefore, the present invention achieves the effect of saving the processing time by the special relative position design between the components, and can be applied to the test of the short-test s-time product which is difficult to be applied by the prior art, for example, the test time is less than fifteen seconds. Calving. The above-described embodiments are merely examples for the convenience of the description, and the scope of the claims is intended to be limited by the scope of the claims. 20 [Simple Description of the Drawings] Fig. 1 is a conventional semiconductor package component testing device. Figure 2 is a perspective view of a semiconductor package component testing apparatus in accordance with a preferred embodiment of the present invention. 15 1336403 Round 3 is a top view of Figure 2. Circle 4 is a perspective view of a part of the components omitted in FIG. Circle 5 to Figure 8 are schematic diagrams of the state of the transfer turret at different stages of knowledge. Figure 9 is a partial exploded view of Figure 2. FIG. 1 to FIG. 16 are schematic diagrams showing the process of feeding and discharging components. [Main component symbol description] Shuttle table 1 Placement slot 3 Test unit 5 Feed tray 7 Collector 匣 9 2D robot arm 2 〇 Feed picker 22 Another horizontal slide 3 1 Discharge picker 33 Wait Sample placement slot 41 Test unit 5 〇 Test aspirator 52 Loading device 61 Transfer plate 63 Aggregation unit 70 Empty tray transfer plate 72 Feed tray 81, 81a Two-dimensional robot arm 2 Suction head 4 Press holder 6 Waiting Measuring element 8 transverse rail 21 2D robot arm 3 〇 cantilever 32 transfer shuttle 40 measured object placement slot 42 test 埠 51 feeding unit 60 stepper drive 62 motor belt combination 64 collecting tray 71 transfer jaw 73 to be tested Semiconductor package component 82 1336403
已測半導體封裝元件821 堆疊升降機構91 供料位置PS 空盤暫存區TMeasured semiconductor package component 821 stack lift mechanism 91 feed position PS empty disk temporary storage area T
工作平台90 分離夾爪92 内部區域IWork platform 90 separation jaw 92 internal area I
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