CN109712924B - Automatic test equipment for infrared focal plane array chip - Google Patents
Automatic test equipment for infrared focal plane array chip Download PDFInfo
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- CN109712924B CN109712924B CN201811641556.3A CN201811641556A CN109712924B CN 109712924 B CN109712924 B CN 109712924B CN 201811641556 A CN201811641556 A CN 201811641556A CN 109712924 B CN109712924 B CN 109712924B
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Abstract
The invention relates to an automatic test device for an infrared focal plane array chip, which comprises: a host machine body; the test station system is used for testing the chip to be detected; the automatic charging device of the charging tray is used for containing the chips to be detected through the charging tray and moving the charging tray from the charging area a to the area b to be detected; the chip manipulator feeding and picking device is used for grabbing the chip to be detected from the tray automatic feeding device and placing the chip to be detected on the test station system; the automatic feeding device of the material tray is used for containing the detected chips and moving the material tray from the sorting area c to the feeding area d; the chip manipulator sorting and picking device is used for grabbing the detected chip from the test station system and placing the detected chip into a material tray in the sorting area c; the empty tray conveying device is used for moving the empty tray to the automatic tray discharging device; and (5) controlling the system. The invention replaces manual work by automatic test, not only has accurate positioning, but also can greatly improve the test efficiency.
Description
Technical Field
The invention relates to the field of semiconductor photoelectron and automatic production equipment, in particular to automatic test equipment for an infrared focal plane array chip.
Background
Infrared imaging technology is increasingly widely used in the fields of industrial sensing, image monitoring, the automotive industry, fire fighting, search and rescue, even military navigation and night vision, etc. The infrared focal plane array chip is used as a key component of an infrared system and a thermal imaging device, and needs to go through a performance test link from design, processing and manufacturing to package marketing, and the performance parameters of element response voltage, element voltage response rate, element noise voltage and the like are tested to ensure that the performance parameters of the chip meet the standard.
At present, the infrared focal plane array chip is mainly tested by manually placing a single chip into a testing system, the model number of the testing chip is observed by human eyes and the testing result is correspondingly recorded, and the testing chip is manually classified, placed on a tray and the like after the testing is finished, so that the production efficiency is low, and the requirement of large-scale high-efficiency production cannot be met.
Accordingly, a technical solution is desired to overcome or at least alleviate at least one of the above-mentioned drawbacks of the prior art.
Disclosure of Invention
In order to solve the technical problem, the application provides an automatic testing device for an infrared focal plane array chip.
The application discloses automatic test equipment of infrared focal plane array chip includes:
a host machine body;
the test station system is used for testing a preset number of chips to be detected;
the automatic charging device for the charging tray is arranged on the main machine body and used for containing the chips to be detected through the charging tray and moving the charging tray filled with the chips to be detected from the charging area a to the area b to be detected;
the chip manipulator feeding and picking device is used for grabbing a preset number of chips to be detected from a material tray positioned in the area b to be detected in the material tray automatic feeding device and placing the chips to be detected on the test station system for testing;
the automatic charging tray discharging device is arranged on the main machine body and used for containing detected chips through a charging tray positioned in the sorting area c and moving the charging tray full of the detected chips from the sorting area c to a discharging area d;
the chip manipulator sorting and picking device is used for grabbing the detected chip from the test station system and placing the detected chip into the material tray at the sorting area c;
the empty tray conveying device is used for moving the empty trays in the to-be-detected area b of the automatic tray feeding device to the sorting area c of the automatic tray discharging device and containing the detected chips;
and the control system is configured to control the test station system, the automatic charging device of the material tray, the chip manipulator charging and picking device, the automatic discharging device of the material tray and the empty material tray conveying device.
Wherein, the host computer organism includes:
the fixed bedplate is positioned on the upper surface of the main machine body;
the protective cover is arranged on the fixed platen and covers the test station system, the area b to be tested of the automatic charging device of the charging tray, the chip manipulator charging and picking device, the discharging area d of the automatic discharging device of the charging tray and the empty charging tray conveying device.
Wherein, charging tray automatic feeding device includes:
the first guide plates are fixedly arranged on the fixed platen to form an accommodating cavity, are used for accommodating a plurality of trays which are stacked from top to bottom and are filled with the chips to be detected, and can form guide along the stacking direction of the trays when the trays are placed;
the first guide rail is arranged at the bottom of the fixed bedplate;
the first moving plate is positioned at the bottom of the fixed bedplate, is arranged on the first guide rail in a sliding manner along the horizontal direction, and is used for driving one material tray at the bottommost part of the accommodating cavity to move from the feeding area a to the area b to be measured;
the transmission device is used for driving the first moving plate to slide;
the jacking device is arranged at the bottom of the first moving plate and used for driving the first moving plate to move along the vertical direction;
and the separating devices are arranged on two sides of the accommodating cavity, and can separate the charging tray at the bottommost part of the accommodating cavity from the other charging trays at the top of the accommodating cavity every time.
Wherein, chip manipulator material loading pick device includes:
the gripper is used for gripping a preset number of chips to be detected;
and the walking device comprises two lead screw sliding tables which are perpendicular to each other and used for driving the hand grip to move along the X-axis direction and the Y-axis direction in the horizontal plane.
Wherein, chip manipulator letter sorting pickup apparatus includes:
the gripper mechanism is used for gripping the detected chip;
and the travelling mechanism comprises two lead screw sliding tables which are perpendicular to each other and used for driving the gripper mechanism to move along the X-axis direction and the Y-axis direction in the horizontal plane.
Wherein, automatic unloader of charging tray includes:
the second guide plates are fixedly arranged on the fixed bedplate to form an accommodating cavity, are used for accommodating a plurality of material trays which are stacked from top to bottom and are filled with the detected chips, and can form guide along the stacking direction of the material trays when the material trays are placed;
the second guide rail is arranged at the bottom of the fixed bedplate;
the second moving plate is positioned at the bottom of the fixed bedplate, is arranged on a second guide rail in a sliding manner along the horizontal direction and is used for driving one material tray to move from the sorting area c to the bottommost part of the accommodating cavity at the blanking area d;
the transmission mechanism is used for driving the second moving plate to slide;
the jacking mechanism is arranged at the bottom of the second moving plate and used for driving the second moving plate to move along the vertical direction;
and the separating mechanisms are arranged on two sides of the accommodating cavity, and each time, one material tray can enter the accommodating cavity from the bottommost part of the accommodating cavity and is fixed.
Wherein, empty charging tray conveyor includes:
the clamping component supports an empty material tray at the to-be-detected area b of the automatic material tray feeding device;
the conveying assembly is used for driving the clamping assembly to move.
Wherein, empty charging tray conveyor still includes:
and the empty tray transfer area e is used for temporarily storing the empty material tray.
Wherein the test station system comprises:
the chip testing connection port is used for being in communication connection with the interior of the chips to be detected in a preset quantity and realizing data exchange;
the photographing system is used for photographing the serial number on the chip to be detected, which is captured by the chip manipulator feeding and picking device;
an environment source for providing a required environment for chip testing.
Wherein, the host computer organism still includes:
an electrical system mounting cabinet for housing the control system; and
the display screen, the input device and the indicator light are connected with the control system.
The application has at least the following beneficial technical effects:
the automatic test equipment of infrared focal plane array chip of this application has replaced artifical work through automatic test, not only fixes a position accurately to can improve efficiency of software testing greatly.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the infrared focal plane array chip automatic testing device of the present invention;
FIG. 2 is a schematic structural diagram of an automatic feeding device of a tray in the automatic testing equipment for an infrared focal plane array chip according to the present invention;
FIG. 3 is a schematic structural diagram of a chip manipulator feeding and picking device in the infrared focal plane array chip automatic testing apparatus according to the present invention;
FIG. 4 is a schematic structural diagram of a hollow tray conveying device of the infrared focal plane array chip automatic testing equipment of the present invention;
FIG. 5 is a schematic structural diagram of a chip manipulator sorting and picking device in the infrared focal plane array chip automatic testing equipment according to the present invention;
FIG. 6 is a schematic structural diagram of a test station system in the infrared focal plane array chip automatic test equipment of the present invention;
FIG. 7 is a schematic structural view of an automatic blanking device for a tray in the automatic testing equipment for an infrared focal plane array chip according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present application and for simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the scope of the present application.
The following describes the infrared focal plane array chip automatic test equipment in detail with reference to fig. 1 to 7.
The automatic test equipment of this application infrared focal plane array chip can include host computer organism 100, charging tray automatic feeding device 200, chip manipulator material loading pick-up device 300, empty charging tray conveyor 400, chip manipulator letter sorting pick-up device 500, test station system 600, the automatic unloader 700 of charging tray and control system etc..
Further, the main body 100 includes a fixed platen 101, a protective cover 102, an electrical system installation cabinet 103, a display screen 104, an input device 105, an indicator lamp 106, and the like. The protective cover 102 is fixedly arranged above the fixed bedplate 101, and covers the motion part and the test part of the internal equipment therein, so as to play roles of dust prevention and man-machine separation; in addition, a transparent sliding door 1021 is arranged on the protective cover 102, so that the working condition of the equipment can be observed conveniently, and the equipment can be inspected and maintained conveniently.
The fixed platen 101 is used to mount and fix the automatic tray feeding device 200, the chip manipulator feeding and picking device 300, the empty tray conveying device 400, the chip manipulator sorting and picking device 500, the test station system 600, the automatic tray discharging device 700, and the like.
An indicator light 106 is mounted on the protective cover 102 to indicate the operating status of the apparatus. The pilot lamp comprises red yellow green trichrome, and the red light scintillation indicates system trouble, and green light scintillation indicates that the system is just operating, and the yellow light scintillation indicates standby or is for unloading etc to each lamp can be according to different frequency scintillation, represents different content.
An electrical system installation cabinet 103 is located below the stationary platen 101, and is used to install and place industrial control computers (i.e., control systems) and the like. The display screen 104 is used to display detailed device working process, chip detection result, fault prompt, and the like. The input device 105 may be used to control the operation of the apparatus, and the modification of the operating parameters of the associated apparatus, etc.
Further, the tray automatic feeding device 200 is fixed on the fixed platen 101, and mainly comprises a plurality of first guide plates 201, a first moving plate 202, a jacking device 203, a separating device 204 and a transmission device 205, so that trays which are manually placed at an appointed position of the equipment and are piled with chips can be moved to a chip area to be measured b from a feeding area a one by one, and a chip manipulator feeding and picking device 300 picks up a preset number (for example, 4, 6, 8 and the like) of chips on the tray in the chip area to be measured b. And after the last material tray in the material loading area a is moved, the system sends out a prompt sound to prompt an operator to continuously place the material tray.
A plurality of first deflector 201 is fixed to be set up on fixed platen 101, forms and holds the chamber for hold a plurality of from top to bottom stack up place and fill with wait to detect the charging tray of chip, and can form the direction along its range upon range of direction when the charging tray is placed. The first guide plate 201 mainly plays a role in guiding when a person places a tray, and can be made of sheet metal parts or machined parts, but is not limited to the above, and the structural form is not limited to the structure shown in the figure.
The first moving plate 202 is located below the first guide plate 201 (the fixed platen 101 is provided with a through hole to enable a tray at the bottommost of the accommodating cavity to be placed on the first moving plate 202), and can be driven by the transmission device 205 and move along the first guide rail 205 a. The top of the first moving plate 202 is provided with a positioning structure matched with the bottom of the material tray, so that the position of the material tray can be positioned, and the material tray is prevented from sliding in the moving process. The transmission device 205 is not limited to the motor synchronous belt transmission mode in the figure, and any structure capable of providing transmission conditions, such as lead screw transmission, cylinder transmission and the like, is within the protection range.
The jacking device 203 is composed of an air cylinder and a linear bearing structure, and can enable the first moving plate 202 to vertically drive the material tray thereon to move up and down so as to adapt to the self movement of the first moving plate 202 and the clamping of the empty material tray conveying device 400 on the material tray. The jacking device 203 is not limited to the cylinder and linear bearing structure, and any structure capable of providing lifting conditions, such as electric cylinder lifting, is within the protection scope.
The separating device 204 is installed on two sides of the material tray of the containing cavity in the material loading area a, and the material tray to be loaded can be separated from the next material tray by a certain distance through the action of the combined cylinder, so that the material tray at the bottommost part of the containing cavity can be separated from other material trays at the top of the containing cavity every time, and the material tray to be loaded can be smoothly moved out along with the moving plate 202.
Further, the chip manipulator feeding and picking device 300 is fixed on the fixed platen 101 and comprises a traveling device 301 and a gripper 302, wherein the traveling device 301 is formed by vertically installing two lead screw sliding tables in a cross manner, so that the gripper 302 can be driven by the traveling device 301 to move along the X axis and the Y axis and travel above the feeding device region b to be tested and the testing station region. The chips in the material tray on the region b to be tested can be picked up and placed to the test station test connection port 601 through the walking device 301.
The traveling device 301 is not limited to the structure of the sliding table of the screw rod in the figure, and the structure of the linear motor, the belt sliding table, the pneumatic sliding table and the like which can provide the traveling condition is all within the protection scope of the present patent.
The gripper 302 is formed by an array type vacuum chuck or a pneumatic clamp, and can grip a plurality of chucks at a time, and the specific number can be determined according to the station of the test system. The gripper can move along the vertical direction to lift and drop the gripped chip to a proper height position.
Further, the empty tray conveying device 400 is fixed on the fixed platen 101, and includes a clamping component 401, a conveying component 402, and the like, so as to move the empty tray after the chips are captured in the tray in the area b to be tested of the feeding device, so as to facilitate the movement of the full tray in the feeding area a. And the empty material tray on the moving plate 202 of the material loading device waiting area b can be conveyed to the sorting area c of the material tray automatic blanking device.
The empty tray conveying device 400 comprises a to-be-detected area b conveying position and a sorting area c conveying position, and further comprises an empty tray transfer area e, a tray placing plate in the empty tray transfer area e can lift up and down, a temporary storage function of a through tray can be achieved, the number of the storage trays which can be stored is not less than the number of stations of the sorting area c tray, the phenomenon that the sorting area c tray is not full at the end is avoided, and the to-be-detected area b tray is required to be removed when being grabbed empty and is used for temporary storage of the tray. The conveying component 402 is not limited to the structural form of the motor screw in the figure, and all structures capable of providing the function to be performed, such as belt transmission, chain transmission, cylinder transmission, etc., are within the protection scope of the present application. Through the empty tray conveying device 400, after the tray in the area to be detected of the feeding device is emptied, the empty tray does not need to be directly discharged, and the empty tray conveying device conveys the empty tray to each sorting station of the discharging device in the sorting area.
The sorting area c can classify the chips according to the test result and the station of each sorting area is the automatic blanking device 700 of a next tray.
Further, the test station system 600 may include a chip test connection port 601, a camera system 602, an environment source 603, and the like. The chip test connection port 601 is fixedly installed at a designated position of the fixed platen 101.
The environmental source 603 may provide a desired environment for chip testing, such as infrared radiation. It can be driven to the designated position of the test station by the air cylinder according to requirements. The transmission of the environmental source 603 can be realized by a cylinder, but the structure is not limited to the cylinder, and any structure can play a transmission role.
The photographing system 602 can photograph the serial numbers on the chips captured by the manipulator loading and picking device 300, so as to correspond the test results with the serial numbers thereof for easy archiving, further reduce the workload of workers, and avoid manual operation errors. The test connection port 601 is used for being in communication connection with the inside of the chip and realizing data exchange, and the test of the performance parameters of the chip is completed through the processing of the tester.
Further, the automatic tray blanking device 700 is fixed on the fixed platen 101, and mainly comprises a plurality of second guide plates 701, a second moving plate 702, a jacking mechanism 703, a separating mechanism 704 and a transmission mechanism 705, so that trays full of chips in the sorting area c can be moved from the sorting area c to the blanking area d one by one and automatically stacked in a stack, and the system gives out a prompt sound after the full stack and is taken away by an operator.
The second guide plates 701 are fixedly arranged on the fixed platen 101 to form accommodating cavities for accommodating a plurality of trays which are stacked from top to bottom and filled with chips to be detected, and can form guide along the stacking direction of the trays when the trays are placed; the second guide plate 701 mainly plays a role in guiding when the tray full of chips is lifted, and can be made of sheet metal parts or machined parts, but is not limited to the above, and the structural form is not limited to the structure shown in the figure.
The second moving plate 702 is located below the second guide plate 701 (similarly, a through hole is opened in the fixed platen 101 to allow the tray on the second moving plate 702 to enter the accommodating cavity from the bottom), and can be driven by the transmission mechanism 705 and move along the second guide rail 705 a. The top of the second moving plate 702 is provided with a positioning structure matched with the bottom of the material tray, so that the position of the material tray can be positioned, and the material tray is prevented from sliding in the moving process. The transmission mechanism 705 is not limited to the motor synchronous belt transmission mode in the figure, and any structure capable of providing transmission conditions, such as lead screw transmission, cylinder transmission, etc., is within the protection range.
The jacking mechanism 703 is composed of an air cylinder and a linear bearing structure, and can make the second moving plate 702 move vertically and drive the material tray thereon to move up and down, so as to adapt to the movement of the second moving plate 702 and the placement of the material tray clamped by the empty material tray conveying device 400.
The jacking mechanism 703 is not limited to the cylinder and linear bearing structure shown in the figure, and any structure capable of providing lifting conditions, such as electric cylinder lifting, is within the protection range.
The separating mechanism 704 is installed on two sides of the tray in the blanking area d, so that the tray filled with chips and moved by the second moving plate 702 is jacked up by the jacking mechanism 703 and then clamped on the separating mechanism 704, and each time, a tray entering the accommodating cavity from the bottommost part of the accommodating cavity can be fixed and gradually stacked into a stack.
Further, the chip manipulator sorting and picking device 500 is fixed on the fixed platen 101 and is composed of a traveling mechanism 501 and a gripper mechanism 502, the traveling mechanism 501 is composed of two lead screw sliding tables which are vertically installed in a cross manner, so that the gripper 502 can be driven by the traveling mechanism 501 to move along the X axis and the Y axis and travel above the testing station area and the sorting area c of the blanking device. The chips on the test connection ports 601 of the test station area can be picked up, and the chips are placed on the guide plates 701 of the corresponding sorting areas c of the blanking device according to the test results. The traveling mechanism 501 is not limited to the structural form of the sliding table of the screw rod in the figure, and structural forms such as a linear motor, a belt sliding table, a pneumatic sliding table and the like which can provide traveling conditions are all within the protection scope of the present patent.
The gripper 502 is formed by an array of vacuum suction cups or pneumatic clamps corresponding to the test stations, and can grip a plurality of suction cups at a time, and the specific number can be determined according to the test system stations. The gripper can move along the vertical direction to lift and drop the gripped chip to a proper height position.
Further, the control system may employ various suitable controllers known at present, such as a WeChat computer, a PLC controller, an industrial personal computer, and the like.
To sum up, the automatic test equipment of infrared focal plane array chip of this application can replace artifical work, has improved infrared focal plane array chip's efficiency of software testing greatly to directly classify the chip according to test structure, and can directly archive each chip serial number and test result and record or issue the test report. Compared with the prior art, the automatic test equipment for the parameter performance of the infrared focal plane array chip has the advantages of accurate positioning and high production efficiency.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. The utility model provides an automatic test equipment of infrared focal plane array chip which characterized in that: the method comprises the following steps:
a main body (100);
the test station system (600), the test station system (600) is used for testing a predetermined number of chips to be detected;
the automatic charging device (200) for the charging tray is arranged on the main machine body (100) and is used for containing the chips to be detected through the charging tray and moving the charging tray filled with the chips to be detected from the charging area a to the area b to be detected;
the chip manipulator feeding and picking device (300), the chip manipulator feeding and picking device (300) is used for grabbing a preset number of chips to be detected from a material tray positioned in the area b to be detected in the material tray automatic feeding device (200), and placing the chips to be detected on the test station system (600) for testing;
the automatic charging tray discharging device (700) is arranged on the main machine body (100) and is used for containing detected chips through a charging tray positioned in the sorting area c and moving the charging tray full of the detected chips from the sorting area c to the discharging area d;
the chip manipulator sorting and picking device (500), the chip manipulator sorting and picking device (500) is used for grabbing the detected chip from the test station system (600) and placing the detected chip into the tray at the sorting area c;
the empty tray conveying device (400) is used for moving the empty tray in the area b to be detected of the automatic tray feeding device (200) to the sorting area c of the automatic tray discharging device (700) and containing the detected chips;
the control system is configured to control the test station system (600), the automatic charging device (200) of the material tray, the chip manipulator charging and picking device (300), the automatic discharging device (700) of the material tray and the empty material tray conveying device (400);
the host body (100) includes:
a fixed platen (101), wherein the fixed platen (101) is positioned on the upper surface of the main machine body (100);
the protective cover (102) is arranged on the fixed platen (101) and covers the test station system (600), the area b to be tested of the tray automatic feeding device (200), the chip manipulator feeding and picking device (300), the blanking area d of the tray automatic blanking device (700) and the empty tray conveying device (400);
the empty tray conveying device (400) comprises:
the clamping assembly (401) supports the empty charging tray at the position b of the area to be measured of the automatic charging device (200) for charging trays;
a conveying assembly (402), wherein the conveying assembly (402) is used for driving the clamping assembly (401) to move;
the empty tray conveying device (400) further comprises:
and the empty tray transfer area e is used for temporarily storing the empty material tray.
2. The automated test equipment of claim 1, wherein: the automatic charging device (200) for the charging tray comprises:
the first guide plates (201) are fixedly arranged on the fixed bedplate (101) to form an accommodating cavity, are used for accommodating a plurality of trays which are stacked from top to bottom and are filled with the chips to be detected, and can form guidance along the stacking direction when the trays are placed;
a first guide rail (205a), the first guide rail (205a) being disposed at a bottom of the stationary platen (101);
the first moving plate (202) is positioned at the bottom of the fixed bedplate (101), is arranged on a first guide rail (205a) in a sliding mode along the horizontal direction, and is used for driving one material tray at the bottommost part of the accommodating cavity to move from the feeding area a to the area b to be measured;
an actuator (205), the actuator (205) being used for driving the first moving plate (202) to slide;
the jacking device (203), the jacking device (203) is arranged at the bottom of the first moving plate (202) and is used for driving the first moving plate (202) to move along the vertical direction;
and the separating devices (204) are arranged on two sides of the accommodating cavity, and each time, one tray at the bottommost part of the accommodating cavity can be separated from the other trays at the top of the accommodating cavity.
3. The automated test equipment of claim 1, wherein: the chip manipulator loading and picking device (300) comprises:
the gripper (302), the said gripper (302) is used for grasping the said chip to be detected of the predetermined quantity;
running gear (301), running gear (301) include two mutually perpendicular installation's lead screw slip tables for drive tongs (302) remove along the X axle in the horizontal plane and the Y axle direction.
4. The automated test equipment of claim 1, wherein: the chip handler sorting and picking apparatus (500) includes:
the gripper mechanism (502), the gripper mechanism (502) is used for gripping the detected chip;
the walking mechanism (501) comprises two lead screw sliding tables which are perpendicular to each other and used for driving the hand grab mechanism (502) to move along the X-axis direction and the Y-axis direction in the horizontal plane.
5. The automated test equipment of claim 1, wherein: automatic unloader (700) of charging tray includes:
the second guide plates (701) are fixedly arranged on the fixed platen (101) to form an accommodating cavity, are used for accommodating a plurality of trays which are stacked from top to bottom and are filled with the chips after detection, and can form guide along the stacking direction when the trays are placed;
a second guide rail (705a), the second guide rail (705a) being disposed at a bottom of the stationary platen (101);
the second moving plate (702) is positioned at the bottom of the fixed bedplate (101), is arranged on a second guide rail (705a) in a sliding manner along the horizontal direction, and is used for driving one material tray to move from the sorting area c to the bottommost part of the accommodating cavity at the blanking area d;
a transmission mechanism (705), wherein the transmission mechanism (705) is used for driving the second moving plate (702) to slide;
the jacking mechanism (703) is arranged at the bottom of the second moving plate (702) and used for driving the second moving plate (702) to move along the vertical direction;
and the separating mechanisms (704) are arranged on two sides of the accommodating cavity, and one tray entering the accommodating cavity from the bottommost part of the accommodating cavity can be fixed each time.
6. The automated test equipment of claim 1, wherein: the test station system (600) comprises:
the chip testing connection port (601) is used for being in communication connection with the interior of a preset number of chips to be detected and realizing data exchange;
the photographing system (602), the photographing system (602) is used for photographing the serial number on the chip to be detected, which is grabbed by the chip manipulator loading and picking device (300);
an environment source (603), the environment source (603) being for providing a required environment for chip testing.
7. The automated test equipment of claim 1, wherein: the host body (100) further includes:
an electrical system mounting cabinet (103), the electrical system mounting cabinet (103) for housing the control system; and
a display screen (104), an input device (105) and an indicator light (106) connected to the control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811641556.3A CN109712924B (en) | 2018-12-29 | 2018-12-29 | Automatic test equipment for infrared focal plane array chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811641556.3A CN109712924B (en) | 2018-12-29 | 2018-12-29 | Automatic test equipment for infrared focal plane array chip |
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| CN109712924A CN109712924A (en) | 2019-05-03 |
| CN109712924B true CN109712924B (en) | 2021-02-26 |
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| CN110743813A (en) * | 2019-10-23 | 2020-02-04 | Tcl王牌电器(惠州)有限公司 | Chip sorting machine |
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