JP2007214477A - Electronic component transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component transfer apparatus which proactively prevents a malfunction such as breakages of a jig and a pickup mechanism, caused by the mistake of the jig from occurring. <P>SOLUTION: In the electronic component transfer apparatus, with which a pickup operation control, corresponding to a form of a jig 1 stored in a magazine 2, is performed, the form of the jig 1 mounted on a parts supply stage 3 is discriminated by jig discriminating means at a pre-stage carrying out a pickup operation. When the form of the jig 1, mounted on the parts supply stage 3, is different from that of the jig 1 stored in a memory 8, an error processing, such as stoppage of the pickup operation, is performed to proactively prevent the jig 1, a transfer head 6 and an ejector 11 from breaking. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component transfer apparatus that picks up an electronic component housed in a jig and transfers it to a substrate.

  Conventionally, in the field of electronic component transfer, electronic components are supplied using a jig that stores a plurality of electronic components, and a jig in which electronic components are regularly arranged and stored in a plate-shaped holder is provided. Widely used. There are roughly two types of jigs. One is called a waffle tray in which electronic components are regularly arranged and placed on a tray-shaped holder, and one is a wafer sheet whose periphery is held by the holder. The electronic parts are regularly arranged and attached, and are called a pallet in which tension is applied to the wafer sheet in advance and a flat ring in which tension is applied during pickup. In addition, there are a plurality of types corresponding to the types of electronic components stored in each form.

The pickup mechanism for picking up electronic components from these jigs varies depending on the type of jig. For example, when picking up an electronic component placed on a tray-shaped jig, the electronic component is picked up by picking up the electronic component with a suction nozzle provided above the tray, and the electronic component attached to the wafer sheet is picked up. In the case of picking up, in addition to a mechanism for sucking from the upper side by the suction nozzle, an ejector mechanism for pushing the electronic component from the lower side toward the suction nozzle side promotes peeling of the electronic component from the wafer sheet (see Patent Document 1). ).
JP 2003-174291 A

  By the way, if a jig misplacement occurs when transferring electronic parts while exchanging multiple types of jigs in a single transfer device, the pick-up mechanism that performs operations corresponding to different types of jigs will be mistaken. There is a risk that the jig, the ejector mechanism, etc. may be damaged due to interference with the jig.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component transfer device that prevents the occurrence of problems such as breakage of a jig or a pickup mechanism due to a wrong jig.

  The invention described in claim 1 is a magazine for storing a plurality of electronic component storage jigs, an electronic component supply stage for mounting a jig mounting tool for mounting the jigs in a replaceable manner, the magazine, and the electronic Move the jig to and from the component supply stage to mount the jig on the electronic component supply stage and replace the jig mounted on the electronic component supply stage with another jig Means for picking up an electronic component from the jig mounted on the electronic component supply stage and transferring it to the substrate, and a process for identifying the type of the jig mounted on the electronic component supply stage. Tool identification means, storage means for storing the kind of the jig stored in the magazine, and kind of the jig in which the kind of the jig identified by the jig identification means is stored in the storage means And different And a error processing means for performing error processing when that.

  According to a second aspect of the present invention, in the first aspect of the present invention, the type of the jig according to the first aspect of the invention is realized by recognizing a recognized portion provided on the jig side by a recognition portion provided on the electronic component supply stage side. Identify

  According to a third aspect of the present invention, in the second aspect of the present invention, the recognition unit includes a plurality of sensors, and the recognized unit is formed in a different form for each type of the jig. The type of the jig is identified by the combination of the sensors that have detected the form.

  The invention according to claim 4 is capable of exchanging a jig for attaching and holding electronic components on the upper surface of the wafer sheet, a magazine for storing a plurality of jigs, and a jig mounting tool for mounting the jigs. The electronic component supply stage to be mounted, the jig is moved between the magazine and the electronic component supply stage, the jig is mounted on the electronic component supply stage, and the electronic component supply stage is mounted on the electronic component supply stage A jig moving means for exchanging a jig with another jig, a transfer means for picking up an electronic component from the jig mounted on the electronic component supply stage, and transferring it to a substrate; and the transfer means. A peeling accelerating means for accelerating the peeling of the electronic component from the wafer sheet from below the picked-up electronic component, and the jig or the jig mounting tool mounted on the electronic component supply stage. Separate jig identifying means, storage means for storing the jig stored in the magazine and the type of the jig mounting tool, and the jig or jig mounting tool identified by the jig identifying means Error processing means for performing error processing when the product type differs from the product of the jig or the jig mounting tool stored in the storage means.

  According to a fifth aspect of the present invention, in the invention according to the fourth aspect, the jig is recognized by recognizing a recognized portion provided on the jig mounting tool side by a recognition portion provided on the electronic component supply stage side. Identify the type of equipment.

  The invention according to claim 6 is the invention according to claim 5, wherein the recognizing portion is formed of a plurality of sensors, and the recognized portion is formed in a different form for each type of the jig. The type of the jig mounting tool is identified by the combination of the sensors that have detected the form.

  According to the present invention, since error processing is performed when a mistake in the types of jigs occurs, it is possible to prevent occurrence of problems such as breakage of jigs and pickup mechanisms.

  An embodiment of the present invention will be described with reference to the drawings. 1 is an overall configuration diagram of an electronic component transfer apparatus according to an embodiment of the present invention, FIG. 2 is a side view showing a jig mounting tool according to an embodiment of the present invention, and FIGS. Fig. 4 is a side view showing a jig mounting tool according to an embodiment of the present invention, Fig. 4 is a perspective view showing a recognition unit and a recognized portion of the embodiment of the present invention, and Fig. 5 is an embodiment of the present invention. It is explanatory drawing which shows the sensor logic regarding the kind identification of the jig | tool in the electronic component transfer apparatus of FIG.

In FIG. 1, an electronic component transfer apparatus according to an embodiment of the present invention supplies an electronic component to which a magazine 2 for storing a jig 1 and a jig mounting tool 20 for mounting the jig 1 are mounted in a replaceable manner. The jig 1 is moved between the stage 3, the magazine 2, and the electronic component supply stage 3 to mount the jig 1 on the electronic component supply stage 3 and the jig mounting tool 20 mounted on the electronic component supply stage 3. A jig moving means 4 for exchanging the jig 1 mounted on the magazine 2 with another jig 1 stored in the magazine 2, and picking up an electronic component from the jig 1 mounted on the electronic component supply stage 3. Mounted on the electronic component supply stage 3, the transfer head 6 that is transferred to the electronic component, the ejector 11 that moves below the electronic component picked up by the transfer head 6 and promotes the peeling of the electronic component from the jig. Identify the type of jig 1 Jig identifying means 7, a storage unit 8 as a storage means for storing various data such as the type of jig 1 stored in the magazine 2 and the movement range of the ejector 11 corresponding to this type, and a control program; The error processing means for performing error processing when the type of the jig 1 identified by the tool identification means 7 is different from the type of the jig 1 stored in the storage unit 8, and an electronic program according to the control program stored in the storage unit 8. A control unit 10 that controls the operation of the entire component transfer apparatus is provided.

  The jig 1 is a holder for storing a plurality of electronic components in a regular arrangement, and three types of holders are used in the electronic component transfer apparatus of the present embodiment. The jig of the first form is a jig called a waffle tray in which electronic components are regularly arranged and placed on a tray-like holder, and the electronic component is picked up from above by the transfer head 6. . The jig of the second form is a jig called a pallet in which electronic components are regularly arranged and stuck on the upper surface of a wafer sheet held around by a holder frame, and a tension is applied to the wafer sheet in advance. It is. The jig of the third form is the one in which electronic parts are regularly arranged and stuck on the upper surface of the wafer sheet held around by the holder frame in the same manner as the jig of the second form. It is a jig called a flat ring that applies tension to a wafer sheet for the first time when it is mounted on the stage 3. In the pallet and the flat ring, when the electronic component is picked up from above by the transfer head 6, the electronic component is pushed up from below by the needle (not shown) of the ejector 11 to assist the pickup.

  The jigs of the above-described forms differ in the size of the electronic component storage area depending on the type and quantity of electronic components to be stored. In the waffle tray, the electronic component storage area is square, and the length of each side varies depending on the type. In the pallet and the flat ring, the electronic component storage area is circular, and the diameter varies depending on the type. As described above, there are various types of jigs 1, which are appropriately selected and stored in the magazine 2 by being stacked up and down. The type of jig 1 stored in each stage is stored in the storage unit 8.

  The magazine 2 is mounted on the magazine mounting unit 13 and can be moved up and down relatively with respect to the electronic component supply stage 3 by the magazine lifting and lowering driving unit 14. As a result, level alignment between the electronic component supply stage 3 and the arbitrary jig 1 in the magazine 2 is performed.

  The jig moving means 4 can be moved horizontally between the magazine 2 and the electronic component supply stage 3 by a jig moving means driving unit 15. The jig moving means 4 is provided with a pair of jig holding portions 4a that can be contacted and separated, and holds the jig 1 in a state of being close to each other, and releases the holding in a state of being separated. The jig moving means 4 moves the jig 1 between the level-adjusted magazine 2 and the jig mounting tool 20 mounted on the electronic component supply stage 3 to mount the jig 1 on the electronic component supply stage 3. At the same time, the jig 1 mounted on the electronic component supply stage 3 is replaced with another jig 1 stored in the magazine 2.

  A lifting mechanism 3a is disposed on the electronic component supply stage 3, and a jig mounting tool 20 is mounted on the top of the lifting mechanism 3a. The elevating mechanism 3 a is configured to be movable up and down by the elevating mechanism driving unit 16, and the jig mounting tool 20 is moved up and down with respect to the electronic component supply stage 3. The jig mounting tool 20 is mounted by exchanging with a dedicated tool corresponding to the type of the jig 1 to be mounted. FIG. 1 shows a jig mounting tool 20 when the jig 1 is a waffle tray.

FIG. 2 shows the configuration of the jig mounting tool 30 when the jig is a pallet. The pallet 31 is formed in a state in which a tension is applied to a wafer sheet 31d held around the holder ring 31c by a hollow expanding ring 31b provided on the pallet base 31a. On the upper surface of the wafer sheet 31d, inside the expand ring 31b, a plurality of electronic components P are stuck in a regular array. The jig mounting tool 30 includes a pallet holding unit 32 and a base 33 that hold the pallet 31 horizontally, and is mounted on the electronic component supply stage 3. The pallet holding part 32 is configured to be movable up and down by an elevating mechanism 3 a, and the jig 1 held by the pallet holding part 32 is raised and lowered with respect to the electronic component supply stage 3. On the base 33, a mounting portion 34 for determining the support height of the pallet 31 is provided, and on the upper portion of the mounting portion 34, a convex portion 35 for positioning the pallet 31 is formed. A concave portion 36 is formed on the lower surface of the pallet base portion 31a so as to face the convex portion 35. When the pallet 31 descends with respect to the base 33, the pallet 31 is engaged with the convex portion 35 to increase the height of the pallet 31. Including positioning is performed. An opening 37 is formed at a position below the pallet 31 of the base 33 so that the ejector 11 can move below the wafer sheet 31d and push up an arbitrary electronic component P with a needle. .

  FIG. 3A shows the configuration of the jig mounting tool 40 when the jig is a flat ring. The flat ring 41 is formed by holding the periphery of the wafer sheet 41a with a holder ring 41b. The jig mounting tool 40 includes a flat ring holding portion 42 that holds the flat ring 41 horizontally and a base 43, and is mounted on the electronic component supply stage 3. The flat ring holding part 42 is configured to be movable up and down by an elevating mechanism 3 a, and the jig 1 held by the flat ring holding part 42 can be raised and lowered with respect to the electronic component supply stage 3. A hollow portion 42a is formed at a position above the wafer sheet 41a of the flat ring holding portion 42, and a hollow expanding ring 45 provided at a position below the wafer sheet 41a on the base 43 is provided. It can be inserted. The hollow portion 42a and the expand ring 45 of the flat ring holding portion 42 are prepared in advance in a size corresponding to the ring size (diameter) of the flat ring 41, and correspond to the type of flat ring 41 to be mounted. The jig mounting tool 40 of the selected type is appropriately replaced and mounted on the electronic component supply stage 3. The type of the jig mounting tool 40 corresponding to the type of the flat ring 41 is stored in the storage unit 8 in advance.

  3B, when the flat ring 41 is lowered with respect to the base 43, the upper end of the expanding ring 45 is inserted into the hollow portion 42a of the flat ring holding portion 42, and the wafer sheet 41a is pushed upward by the expanding ring 45. In this state, tension is applied to the wafer sheet 41a. The distance between the plurality of electronic components P adhered to the upper surface of the wafer sheet 41a is adjusted by adjusting the amount of descent of the flat ring 41 and adjusting the tension applied to the wafer sheet 41a, and is regularly arranged in a predetermined arrangement. It has become so. An opening 46 is formed at a position inside the expanding ring 45 of the base 43 so that the ejector 11 can move below the wafer sheet 41a and push up an arbitrary electronic component P by the needle. Yes.

  In FIG. 1, an ejector 11 can be moved up and down and horizontally moved with respect to an electronic component supply stage 3 by an ejector driving unit 12. When the jig 1 is the pallet 31 or the flat ring 41, the ejector 11 is moved to the lower side of the electronic component and picks up by promoting the peeling from the wafer sheets 31d and 41a by pushing up the electronic component from below with a needle. It functions as a peeling accelerating means that facilitates the process. The range of movement in the horizontal direction when the ejector 11 is raised is regulated according to the diameter of the wafer sheets 31d and 41a so as not to interfere with the expanding rings 31b and 45. The movement range set for each is stored in the storage unit 8. Thereby, the ejector 11 at the time of ascent is controlled so as to move only within the movement range set for each kind of the pallet 31 and the flat ring 41 to perform the peeling promotion operation, and interferes with the expanding rings 31b and 45. Accidents such as damage to this or damage to itself are prevented beforehand.

The transfer head 6 can be moved up and down and horizontally moved by the transfer head drive unit 17, picks up the electronic component P from the jig 1 mounted on the electronic component supply stage 3, and performs predetermined mounting on the substrate 5. The operation of transferring the electronic component P to the position is performed. When the jig 1 mounted on the electronic component supply stage 3 is a pallet or a flat ring, the ejector 11 is located below the electronic component in conjunction with the transfer head 6 that moves above the arbitrary electronic component for pickup. It moves and performs an exfoliation promoting operation such as pushing the electronic component upward with a needle.

  The control unit 10 controls the operation of the entire electronic component transfer device based on a control program and various data stored in the storage unit 8. The input unit 18 includes a driver, a keyboard, and the like, and inputs a control program and various data stored in the storage unit 8. Further, the electronic component transfer device can be operated by inputting a control command to the control unit 10. The output unit 19 includes display means such as a CRT and a liquid crystal panel, data output means such as a driver and a printer, and outputs the operation status of the electronic component transfer device to the outside. Further, the output unit 19 can execute a part of the function of the error processing means, and displays a warning message or warning lamp on the display means or gives a warning by sound, or a place away from the electronic component transfer device. It can also be configured to warn the operator at the station by communication.

  The jig identifying means 7 identifies the type of the jig 1 mounted on the electronic component supply stage 3 and the type of the jig mounting tool 40. Identification of the type of the jig 1 is performed by recognizing the recognized portion provided on the jig 1 side by the recognition unit provided on the electronic component supply stage 3 side. Is performed by recognizing a recognized portion provided on the jig mounting tool 40 side by a recognition portion provided on the electronic component supply stage 3 side.

  FIG. 4 illustrates a sensor as a recognition unit and a dog as a recognized unit. When the jig 1 is a waffle tray or pallet, the dog 22 is provided on the jig 1 side, and when the jig 1 is a flat ring, the dog 22 is provided on the jig mounting tool 40 side. The sensor 21 is provided on the electronic component supply stage 3 side, and when the jig 1, which is a waffle tray or pallet, is mounted on the jig mounting tools 20 and 30 mounted on the electronic component supply stage 3, the jig mounting tool 20. The dog 22 is detected by the sensor 21 when 30 is lowered. Further, when the jig mounting tool 40 is mounted on the electronic component supply stage 3 for mounting the jig 1 which is a flat ring, the dog 22 is detected by the sensor 21.

  The sensor 21 is formed by, for example, arranging four sensors 21 a to 21 d side by side, and each sensor 21 a to 21 d transmits an ON / OFF signal to the jig identifying means 7. Each of the sensors 21 a to 21 d individually transmits an ON signal to the jig identifying means 7 when detecting the dog 22. The dog 22 is formed in a different form for each type of jig 1, and the type of the jig 1 can be identified by a combination of ON / OFF signals transmitted from the sensors 21a to 21d. ing. In FIG. 4, the dog 22 is formed at a position corresponding to the second sensor 21b, and an ON signal is transmitted only from the second sensor 21b, and an OFF signal is transmitted from the other sensors 21a, 21c, and 21d. The As the recognition unit, a transmissive or reflective sensor, a metal detection type sensor, or the like can be used, and as the recognized unit, the dog 22 can be used in different combinations at positions corresponding to the four sensors 21. In addition to forming, the position of the hole through which light passes, the distance from the sensor 21, the brightness of the reflecting surface, etc. may be set in different combinations for each type of jig 1 or jig mounting tool 40. it can.

  FIG. 5 shows a schematic diagram of sensor logic related to jig type identification. The first sensor 21a and the second sensor 21b are sensors for detecting the ring size (diameter) of the wafer sheets 31d and 41a. The ring size is determined by a combination of ON / OFF signals transmitted from the sensors 21a and 21b. Identify 4 types.

The third sensor 21c is a sensor for detecting whether the jig 1 is a pallet or a flat ring, and the fourth sensor 21d detects whether the jig 1 is a waffle tray. It is a sensor for. When the jig 1 is recognized as a waffle tray, that is, when an OFF signal is transmitted from the fourth sensor 21d, the first sensor 21a and the second sensor 21
The sensor logic is converted so as to recognize the size of the waffle tray by the combination of the ON / OFF signals transmitted from the sensor 21b.

  In the electronic component transfer apparatus configured as described above, the electronic components are transferred to the substrate 5 in the order based on the control program. The jig 1 storing the electronic components to be transferred is mounted while being exchanged with the electronic component supply stage 3, and each drive unit is controlled so as to perform an optimum operation for each type of the jig 1. When all parts of the jig 1 stored in the magazine 2 are cut out during the transfer operation, the new magazine 2 storing the new jig 1 containing the electronic parts is replaced with a new magazine. Placed on the unit 13.

  The replacement operation of the magazine 2 is performed by an operator. However, if the magazine 2 storing the jig 1 of a different type from the jig 1 in which the parts are cut out is mistakenly replaced and placed, the jig 1 before replacement is replaced. There may be a problem in the electronic component transfer apparatus that has been controlled according to the product type. For example, when the jig 1 before replacement is a pallet with a large ring size and the jig 1 after replacement is a pallet with a small ring size, the ejector whose movement range is regulated in conformity with the large ring size 11 may be damaged by interference with the expanded ring having a small ring size after replacement.

  In addition, when the jig 1 before replacement is a pallet or a flat ring, and the jig 1 after replacement is a waffle tray, the ejector 11 that is not required for the pickup is operated in conjunction with the transfer head 6 to promote peeling. There is a risk of damage due to contact with the bottom of the waffle tray. Even in such a case, the type of the jig 1 to be mounted on the electronic component supply stage 3 is recognized in advance by the jig identifying means 7, and the type of the jig 1 before replacement stored in the storage unit 8 is stored. If they are different, error processing such as warning or interruption of the transfer operation can be performed to prevent the occurrence of a malfunction.

  Further, when the jig 1 mounted on the electronic component supply stage 3 is a flat ring, the jig mounting tool 40 is mounted on the electronic component supply stage 3 by the operator, but the type of the flat ring stored in the magazine 2 A similar problem may occur when the jig mounting tool 40 corresponding to a different product type is mounted. Even in such a case, the type of the jig mounting tool 40 mounted on the electronic component supply stage 3 is recognized in advance by the jig identifying means 7, and the type of the jig mounting tool 40 stored in the storage unit 8. If the difference is different from the above, error processing such as warning or interruption of the transfer operation can be performed to prevent the occurrence of a malfunction.

  According to the electronic component transfer device of the present invention, it is possible to prevent the occurrence of problems such as breakage of the jig and the pickup mechanism due to the mistake in the type of jig, so that the electronic component stored in the jig can be picked up. This is useful in the field of transferring to a substrate.

1 is an overall configuration diagram of an electronic component transfer apparatus according to an embodiment of the present invention. The side view which shows the jig | tool mounting tool of one embodiment of this invention (A), (b) Side view which shows the jig | tool mounting tool of one embodiment of this invention. The perspective view which shows the recognition part and recognized part of one embodiment of this invention Explanatory drawing which shows the sensor logic regarding the kind identification of the jig | tool in the electronic component transfer apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Jig 2 Magazine 3 Electronic component supply stage 4 Jig moving means 5 Substrate 6 Transfer head 7 Jig identification means 8 Storage part 10 Control part 11 Ejector 20, 30, 40 Jig mounting tool 21 Sensor 22 Dog 31d, 41a Wafer sheet

Claims (6)

  A magazine for storing a plurality of electronic component storage jigs, an electronic component supply stage for mounting a jig mounting tool for mounting the jigs interchangeably, and the magazine and the electronic component supply stage A jig moving means for moving the jig to mount the jig on the electronic component supply stage and replacing the jig mounted on the electronic component supply stage with another jig; and the electronic component supply stage A transfer means for picking up an electronic component from the jig mounted on the substrate and transferring it to a substrate; a jig identifying means for identifying the type of the jig mounted on the electronic component supply stage; and An error process is performed when the type of the jig identified by the jig identifying unit is different from the type of the jig stored in the storage unit. Electronic component transfer apparatus characterized by comprising a Cormorant error processing means.   2. The electronic component transfer according to claim 1, wherein a type of the jig is identified by recognizing a recognized portion provided on the jig side by a recognition unit provided on the electronic component supply stage side. Mounting device.   The recognition unit is composed of a plurality of sensors, and the recognized unit is formed in a different form for each type of the jig, and the type of the jig is determined by combining the sensors that have detected the form of the recognized unit. 3. The electronic component transfer device according to claim 2, wherein the electronic component transfer device is identified.   A jig for attaching and holding an electronic component on the upper surface of the wafer sheet, a magazine for storing a plurality of jigs, an electronic component supply stage for mounting the jig mounting tool for mounting the jig in a replaceable manner, The jig is moved between the magazine and the electronic component supply stage to mount the jig on the electronic component supply stage, and the jig mounted on the electronic component supply stage is used as another jig. A jig moving means to be exchanged, a transfer means for picking up an electronic component from the jig mounted on the electronic component supply stage and transferring it to the substrate, and a lower side of the electronic component picked up by the transfer means Peeling promoting means for promoting peeling of the electronic component from the wafer sheet; jig identifying means for identifying the jig mounted on the electronic component supply stage or the type of the jig mounting tool; Storage means for storing the jig stored in the magazine and the type of the jig mounting tool, and the jig or the type of the jig mounting tool identified by the jig identifying means stored in the storage means. An electronic component transfer apparatus, comprising: error processing means for performing error processing when the jig is different from the type of the jig or the jig mounting tool.   5. The type of the jig mounting tool is identified by recognizing a recognized part provided on the jig mounting tool side by a recognition unit provided on the electronic component supply stage side. Electronic component transfer device.   The recognition unit is composed of a plurality of sensors, and the recognized unit is formed in a different form for each type of the jig, and the combination of the sensor that detects the form of the recognized unit is used to 6. The electronic component transfer apparatus according to claim 5, wherein the type is identified.

Images