JPH01216279A - Connector for inspecting pin of ic - Google Patents
Connector for inspecting pin of icInfo
- Publication number
- JPH01216279A JPH01216279A JP63042671A JP4267188A JPH01216279A JP H01216279 A JPH01216279 A JP H01216279A JP 63042671 A JP63042671 A JP 63042671A JP 4267188 A JP4267188 A JP 4267188A JP H01216279 A JPH01216279 A JP H01216279A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- contact rod
- contact
- guide groove
- positioning body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000881 depressing effect Effects 0.000 abstract 1
- 238000007689 inspection Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に用いられる、プリント基板上
に実装されたＩＣの検査用ピン接続装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a pin connection device for testing an IC mounted on a printed circuit board, which is used in various electronic devices.
従来の技術
プリント基板上に実装されているＩＣの良否の検査等を
行う場合、従来は、ＩＣピンの数に合わせて間隔を持っ
た端子を、ＩＣの両側面より、スプリングを介してピン
に押し付けて接続を行ない、その接続された端子とロジ
ック・アナライザー等とを結び、ＩＣの良・不良解析等
を行っていた。Conventional technology When inspecting the quality of an IC mounted on a printed circuit board, conventionally, terminals spaced apart according to the number of IC pins were attached to the pins from both sides of the IC via springs. Connections were made by pressing, and the connected terminals were connected to a logic analyzer, etc., to analyze whether the IC was good or bad.
以下、図面を参照しながら、上述した従来のＩＣの検査
ピン接続装置の一例について説明する。Hereinafter, an example of the above-mentioned conventional IC test pin connecting device will be described with reference to the drawings.
第４図に示す様に、ＩＣピン（図示せず）の数に合わせ
た多数の端子３１をもつ、一対の接続片３２を、その長
さ方向の中央部分において軸３３で回転自在に結合して
いる。一対の接続片３２の一方の端部の間にコイルスプ
リング３４を設けて、接続片３２の他方の端部が常に閉
じるように付勢している。この他方の端部において、Ｉ
Ｃのピンをはさむようにして各端子３１をピンと接続し
ている。As shown in FIG. 4, a pair of connecting pieces 32 having a number of terminals 31 corresponding to the number of IC pins (not shown) are rotatably connected by a shaft 33 at the central portion in the longitudinal direction. ing. A coil spring 34 is provided between one end of the pair of connection pieces 32 to urge the other end of the connection piece 32 to always close. At this other end, I
Each terminal 31 is connected to a pin such that the pin C is sandwiched therebetween.
発明が解決しようとする課題
しかしながら、上記のような構成では、ＩＣの高密度、
小型化にともない、ＩＣの各ピンと各接続端子３１との
接触面積が減少してきて、接続された状態のＩＣのピン
と接続端子３１が少しのショックでも分離して、ＩＣの
検査が、しげしば中断を余儀なくされるという問題点を
有していた。Problems to be Solved by the Invention However, with the above configuration, the high density of IC,
With miniaturization, the contact area between each pin of an IC and each connection terminal 31 has decreased, and the pins of a connected IC and connection terminal 31 can separate even with the slightest shock, often interrupting IC inspection. The problem was that they were forced to do so.
本発明は、上記課題に鑑み、ＩＣのピンと接続端子が少
しのシ目ツクででも分離することのない接続の安定した
接続装置を提供するものである。SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a connection device that provides a stable connection in which IC pins and connection terminals will not be separated even by the slightest touch.
課題を解決するための手段
上記課題を解決するために、本発明のＩＣの検査用ビン
接続装置は、ＩＣのピンに対応したガイド溝をもつ位置
決め体と、この位置決め体との間に相対的に上下動可能
に設置され、屍端が上記ガイド溝に嵌合し、下降ｊ区動
力を受けるとガイド溝に嵌合されたＩＣのピンに接触す
る接触棒を有すする接触棒マウント体と、この位置決め
体と接触棒マウント体との間に設置されて、ガイド溝に
嵌合されたＩＣのピンと接触棒との間隔を設定する′弾
性手段を備えたものである。Means for Solving the Problems In order to solve the above problems, the IC inspection bin connection device of the present invention has a positioning body having a guide groove corresponding to the pin of the IC, and a relative position between the positioning body and the positioning body. a contact rod mount body, which is installed to be movable up and down in the guide groove, has a contact rod whose end of the corpse fits into the guide groove, and which contacts a pin of an IC fitted in the guide groove when receiving a downward movement force; , an elastic means is provided between the positioning body and the contact rod mount body to set the distance between the pin of the IC fitted in the guide groove and the contact rod.
作用
本発明は、上記した構成によって、ＩＣの上部から位置
決め体を降ろしてきて、ガイド溝にＩＣのピンをはめ込
み、この状態で接触棒マウント体を下降させて、接触棒
とＩＣのピンとをガイド溝内において接触させるもので
あり、あらかじめ接触棒の先端をガイド溝に位置させて
いるため、かつこのガイド溝にＩＣのピンをガイドする
ようにしているため、接続状態において、たとえ衝撃が
加わっても接触棒とＩＣのピンとが外れることはないも
のである。According to the above-described structure, the present invention lowers the positioning body from the top of the IC, fits the pin of the IC into the guide groove, and in this state lowers the contact rod mount body to guide the contact rod and the pin of the IC. The tip of the contact rod is placed in the guide groove in advance, and the pin of the IC is guided in this guide groove. However, the contact rod and the IC pin will not come off.
実施例
以下、本発明の一実施例の接触棒を備えたＩＣの検査用
ピン接続装置について、図面を参照しながら説明する。Embodiment Hereinafter, an IC inspection pin connection device equipped with a contact rod according to an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例におけるＩＣの検査用ピン接
続装置の先端部の分解斜視図を示すものである。第２図
はその組立状態を示す断面図である。FIG. 1 is an exploded perspective view of the tip of an IC testing pin connection device according to an embodiment of the present invention. FIG. 2 is a sectional view showing the assembled state.
第１図、第２図において、１は接触棒３を保護するため
のカバーで、接触棒マウント体２とカバー止めネジ８に
よって一体になる。２は接触棒マウント体、３は接触棒
マウント体２に一体化された接触棒、４はスライドスプ
リング、６はスプリング案内軸、６はＩＣピン位置決め
体で、１０７のピン７ａが１本１本嵌合するガイド溝６
ａ、各接触棒３を各ガイド溝６！Ｌに案内する案内穴６
ｂ、スライドピン溝６Ｃを有する。７はＩＣｌ３はカバ
ー止めネジ、９は上下にスライドするための案内ビンを
示す。In FIGS. 1 and 2, reference numeral 1 denotes a cover for protecting the contact rod 3, which is integrated with the contact rod mount body 2 by a cover set screw 8. As shown in FIG. 2 is a contact rod mount body, 3 is a contact rod integrated into the contact rod mount body 2, 4 is a slide spring, 6 is a spring guide shaft, 6 is an IC pin positioning body, and 107 pins 7a are arranged one by one. Guide groove 6 to fit
a, each contact rod 3 into each guide groove 6! Guide hole 6 guiding to L
b. It has a slide pin groove 6C. ICl3 is a cover fixing screw 7, and 9 is a guide pin for sliding up and down.
本実施例においては、先ずＩＣピン位置決め体６に、ス
プリング案内軸５をネジ込んで固定する。In this embodiment, first, the spring guide shaft 5 is screwed into the IC pin positioning body 6 and fixed.
次いで固定されたスプリング案内軸６にスライドスプリ
ング４を通しておく。次に接触棒マウント体２にＩＣｙ
のピン７ａの数だけの接触棒３を通して、上下にきめら
れた寸法だけ突き出させて、接着剤を横穴２ａから流し
込んで各接触棒３を接触棒マウント体２に固定する。接
触棒３を所定数だけ固定した接触棒マウント体２を、前
述のＩＣピン位置決め体６の上部よりかぶせてきて１．
スライド案内ビンネジ穴２Ｃと、ｘＣＣピッ位置決体６
の横にあるスライドピン溝６ｃとを合わせて、スライド
案内ビン９をネジ込んで接触棒マウント体２とＩＣピン
位置決め体６を、接触棒マウント体２に対してＩＣピン
位置決め体６をスライドピン溝６Ｃの範囲だけ上下動可
能に結合する。Next, the slide spring 4 is passed through the fixed spring guide shaft 6. Next, attach the ICy to the contact rod mount body 2.
Each contact rod 3 is fixed to the contact rod mount body 2 by passing through the contact rods 3 as many as the number of pins 7a, causing them to protrude vertically by a predetermined dimension, and pouring adhesive through the horizontal hole 2a. The contact rod mount body 2 on which a predetermined number of contact rods 3 are fixed is placed over the above-mentioned IC pin positioning body 6.1.
Slide guide pin screw hole 2C and xCC pitch positioning member 6
Align the slide pin groove 6c next to the contact bar mount body 2 and the IC pin positioning body 6 by screwing the slide guide pin 9 into the slide pin. They are coupled to be movable up and down within the range of the groove 6C.
このとき、接触棒３の先端は案内穴６ｂの中に挿入され
る。最後に結合したＩＣピン位置決め体６と接触棒マウ
ント体２の上部からカバー１をかぶせて、カバー止めネ
ジ８を使って接触棒マウント体２とカバー１を固定する
。なお、２ｂは接触棒マウント体２に設けた空気抜き穴
である。At this time, the tip of the contact rod 3 is inserted into the guide hole 6b. Finally, cover 1 is placed over the IC pin positioning body 6 and contact bar mount body 2 that have been combined, and the contact bar mount body 2 and cover 1 are fixed using cover set screws 8. Note that 2b is an air vent hole provided in the contact rod mount body 2.
以上のように構成されたＩＣの検査用ピン接続装置につ
いて、以下第１図及び、第２図を用いてその動作を説明
する。The operation of the IC testing pin connection device configured as described above will be described below with reference to FIGS. 1 and 2.
先ず、ＩＣ７の上部から、カバー１、接触棒マウント体
２を通してＩＣピン位置決め体６を降ろしてきて、ガイ
ド溝６Ｃで工Ｃ７のピン７ａに位置を合わせる。その上
部から接触棒案内穴６ａを介して接触棒３が降りてくる
構造になっており、ＩＣピン位置決め体６が相対的に上
昇する事によって、ガイド溝６Ｃにおいて接触棒３はピ
ン７１Ｌに接触する。接触棒マウント体２の上部に、あ
る寸法だけ接触棒３が突き出ていて、この突き出ている
部分にリード線等をつなぐ事が出来る。First, the IC pin positioning body 6 is lowered from the top of the IC 7 through the cover 1 and the contact rod mount body 2, and is aligned with the pin 7a of the workpiece C7 in the guide groove 6C. The contact rod 3 descends from the top through the contact rod guide hole 6a, and as the IC pin positioning body 6 rises relatively, the contact rod 3 comes into contact with the pin 71L in the guide groove 6C. do. A contact rod 3 protrudes by a certain dimension from the upper part of the contact rod mount body 2, and a lead wire or the like can be connected to this protruding portion.
なお、カバー１は接触棒マウント体２の上部から接触棒
３を保護する目的でかぶさっている。なお、このカバー
１には第３図の如き押さえ装置が設けられており、ＩＣ
ビン７ａと接触棒３が接続可能となる。Note that the cover 1 is placed over the contact rod mount 2 for the purpose of protecting the contact rod 3. Note that this cover 1 is provided with a holding device as shown in FIG.
The bottle 7a and the contact rod 3 can now be connected.
第３図において、１ｏは上記ＩＣピン位置決め体６を押
し下げるためのスプリングを含む押し具、１１は検査さ
れるＩＣ７が装着されたプリント基板、１２はプリント
基板１１をスライド可能にして、どの位置のＩＣ７の真
上にでも位置決め体６が移動出来るための保持板である
。In FIG. 3, 1o is a pushing tool including a spring for pushing down the IC pin positioning body 6, 11 is a printed circuit board on which the IC 7 to be inspected is mounted, and 12 is a slider for the printed circuit board 11. This is a holding plate that allows the positioning body 6 to move even right above the IC 7.
発明の効果
以上のように、本発明はＩＣの上部から接触棒をガイド
溝を通じて降ろしてきてＩＣビンに接触させ、かつ、そ
の上部をスプリング等を介した押さえ装置で押さえて接
触状態を維持することによって、たとえ衝撃が加わって
も接触状態を安定に保つことができる。Effects of the Invention As described above, the present invention lowers the contact rod from the upper part of the IC through the guide groove to contact the IC bottle, and maintains the contact state by pressing the upper part with a pressing device using a spring or the like. This makes it possible to maintain a stable contact state even if an impact is applied.
又、これらを複数設けることによシ、プリント基板上に
実装された、複数のＩＣの連続関係、相互関係等を一度
に一人の人で検討することが可能となる。Further, by providing a plurality of these, it becomes possible for one person to examine the continuous relationship, mutual relationship, etc. of a plurality of ICs mounted on a printed circuit board at a time.
第１図は本発明の一実施例におけるＩＣの検査用ビン接
続装置の分解斜視図、第２図はその取付状態を示す断面
図、第３図は本発明の一実施例を示す斜視図、第４図ム
、Ｂは従来例のＩＣビン接続具の側面図及びムー五′線
断面図である。
１・・・・・・カバー、２・・・・・・接触棒マウント
体、３・・・・・・接触棒、６・・・・・・ＩＣピン位
置決め体、６ａ・・・・・・ガイド溝、６ｂ・・・・・
・接触棒案内穴、７・・・・・・ＩＣ１７ａ・・・・・
・ＩＣビン
代理人の氏名 弁理士 中 尾 敏 男 ほか１８第
ｌ 図 ノーカバー／ −一
一カハ゛−
２−桔ゑ葎７クント体
３−−ＩＩ摩七隊
４−−スライドスアリング
！−−ヌアシングＸ円釉
６＝ＩＣと・ン拉１！！・め林
−−−ＩＣ
９−−−スライド案内Ｌ°ン
第２図
２−一一接ゑ犀７ウント林
６ −−− Ｉに゛ンイ立置゛め不敷第３図FIG. 1 is an exploded perspective view of an IC inspection bin connection device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing its installed state, and FIG. 3 is a perspective view showing an embodiment of the present invention. Figures 4 and 4B are a side view and a sectional view taken along the line 5' of a conventional IC bin connector. 1... Cover, 2... Contact rod mount body, 3... Contact rod, 6... IC pin positioning body, 6a... Guide groove, 6b...
・Contact rod guide hole, 7...IC17a...
・Name of IC bottle agent: Patent attorney Toshio Nakao et al. 18th
l Figure No Cover / -11 Kaha- 2-Kasueho 7 Kuntai 3--II Mashichi-tai 4--Slide Suaring! --Nuashing !・Merin --- IC 9 --- Slide guide L °n Figure 2 2-11 contact 7 Unt Hayashi 6 --- I stand upright Figure 3
Claims (1)
の位置決め体との間に相対的に上下動可能に設置され、
先端が上記ガイド溝に嵌合し、下降駆動力を受けると上
記ガイド溝に嵌合されたＩＣのピンに接触する接触棒を
有する接触棒マウント体と、この位置決め体と接触棒マ
ウント体との間に設置されて、上記ガイド溝に嵌合され
たＩＣのピンと接触棒との間隔を設定する弾性手段を備
えたＩＣの検査用ピン接続装置。A positioning body having a guide groove corresponding to the pin of the IC, and a positioning body installed so as to be movable vertically relative to the positioning body,
A contact rod mount body having a contact rod whose tip fits into the guide groove and contacts a pin of an IC fitted in the guide groove when receiving a downward driving force, and the positioning body and the contact rod mount body. A pin connecting device for testing an IC, comprising an elastic means installed between the contact rod and the pin of the IC fitted in the guide groove to set a distance between the pin and the contact rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63042671A JPH01216279A (en) | 1988-02-25 | 1988-02-25 | Connector for inspecting pin of ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63042671A JPH01216279A (en) | 1988-02-25 | 1988-02-25 | Connector for inspecting pin of ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01216279A true JPH01216279A (en) | 1989-08-30 |
Family
ID=12642491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63042671A Pending JPH01216279A (en) | 1988-02-25 | 1988-02-25 | Connector for inspecting pin of ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01216279A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05157804A (en) * | 1991-12-06 | 1993-06-25 | Nec Gumma Ltd | Circuit tester |
| JP2015117991A (en) * | 2013-12-18 | 2015-06-25 | アキム株式会社 | Probe unit and temperature characteristic measurement instrument using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637370B2 (en) * | 1982-06-08 | 1988-02-16 | Hamamatsu Photonics Kk |
-
1988
- 1988-02-25 JP JP63042671A patent/JPH01216279A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637370B2 (en) * | 1982-06-08 | 1988-02-16 | Hamamatsu Photonics Kk |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05157804A (en) * | 1991-12-06 | 1993-06-25 | Nec Gumma Ltd | Circuit tester |
| JP2015117991A (en) * | 2013-12-18 | 2015-06-25 | アキム株式会社 | Probe unit and temperature characteristic measurement instrument using the same |
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