JPS6276273A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPS6276273A JPS6276273A JP60218303A JP21830385A JPS6276273A JP S6276273 A JPS6276273 A JP S6276273A JP 60218303 A JP60218303 A JP 60218303A JP 21830385 A JP21830385 A JP 21830385A JP S6276273 A JPS6276273 A JP S6276273A
- Authority
- JP
- Japan
- Prior art keywords
- floating plate
- socket
- main body
- bump
- mounting section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣの製造過程で実施するバーン・イン・テス
トの試験装置のＩＣソケットに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket for a test device for a burn-in test carried out in the process of manufacturing an IC.
従来ＩＣは各種のタイプのものが製造されており、それ
ぞれのタイプに適合したバーン・イン・テスト用のｔＣ
ソケットが実用されている。Conventionally, various types of ICs have been manufactured, and tCs for burn-in testing are suitable for each type.
Sockets are in use.
しかし本願が対象としている一つの面に高密度に多数の
バンプを設けたＩＣのバーン・イン・テスト用のＩＣソ
ケットは未だ実用されていない。However, an IC socket for burn-in testing of an IC, which has a large number of bumps arranged at high density on one surface and is the object of this application, has not yet been put into practical use.
本発明は上述の問題点を解決し前記多数の）バンプを設
けたＩＣのバーン・イン・テスト用のＩＣソケットを提
供するもので、複数のスプリングプローブを設けた本体
と、この本体上に上下動可能に取付けられかつ上方へ弾
圧されているフローティングプレートと、このフローテ
ィングプレート上に検査されるべきＩＣを挟んで載置さ
れるカッへ゛−板とを備えたＩＣソケットにおいて、フ
ローティングプレート上面に形成されたｒｃｆ２置区画
の複数の隅部にそれぞれ少なくとも１つの前記ＩＣのハ
ンプが嵌入すべき位置決め用凹部を穿設したものである
。The present invention solves the above-mentioned problems and provides an IC socket for burn-in testing of ICs provided with a large number of bumps. In an IC socket equipped with a floating plate that is movably mounted and pressed upward, and a cage plate that places the IC to be inspected on the floating plate with the IC to be inspected sandwiched therebetween, A positioning recess into which at least one hump of the IC is to be fitted is formed in each of a plurality of corners of the RCF2 placement section.
もしくは上記ＩＣ載置区画内の周辺及び各隅部のうち少
なくともその一方はＩＣ載置区画内の他の部分より高く
した凸部を形成し、この凸部の複数個所にそれぞれ少な
くとも１つの前記ＩＣのバンプが嵌入すべき位置決め用
凹部を穿設したものである。Alternatively, at least one of the periphery and each corner of the IC mounting section is formed with a protrusion that is higher than other parts of the IC mounting section, and at least one of the ICs is placed at a plurality of locations on each of the protrusions. A positioning recess into which the bump is inserted is bored.
〔作 用〕
上述のようにＩＣをフローティングプレートのＩＣ載置
区画内に載置すれば大まかな位置決めは出来るが、前記
のように高密度に多数のバンプが設けられているＩＣで
は更に精密な位置決めが必要である。本願ではＩＣを載
置区画内に挿入すれば、各ハンプは一定規格で配列され
ているので、複数の隅部にのみ設けたバンプの嵌入用凹
部により、全部のバンプの位置を正確に決めることが出
来る。[Function] As mentioned above, if the IC is placed in the IC placement section of the floating plate, rough positioning is possible, but with an IC that has a large number of bumps arranged at high density as described above, more precise positioning is required. Positioning is required. In this application, when the IC is inserted into the mounting section, the humps are arranged in a fixed standard, so the positions of all the bumps can be determined accurately by using the recesses for inserting the bumps provided only at the corners. I can do it.
第１図は本発明のＩＣソケットの縦断面図で、第２図は
フローティングプレー１・が上昇した状態の一部分の拡
大断面図である。FIG. 1 is a longitudinal sectional view of the IC socket of the present invention, and FIG. 2 is an enlarged sectional view of a portion of the IC socket with the floating plate 1 raised.
本体ｌには複数のスプリングプローブ２を所定の位置に
本体を貫通して垂直に植設しである。このスプリングプ
ローブ２の植設部分の上側には４本のガイドビン３で水
平方向が保持され、上下方向には摺動可能なフローティ
ングプレート４が設けられており、スプリング５で常時
はガイドピン３の上端のストッパ３ａに弾圧されている
。なお、フローティングプレート４には前記スプリング
プローブ２に対応する位置に透孔４ｄがあけられており
、プローブ先端が透孔内に遊嵌されている。またフロー
ティングプレート４の上面にはここに載置されるＩＣ６
の外形に合った形状の凹部４ａが設けられている。この
凹部４ａの底部は第３図示のように４隅もしくは周辺部
全部にわたって他の底部より高くした凸部４ｃを設け、
この凸部４ｃの上面の複数個所にそれぞれここに載置さ
れるＩＣ６のバ□
１１ ンプ６ａが嵌入される位置決め用
凹部４ｂを少なくと１ も１つずつ穿設し
である。A plurality of spring probes 2 are vertically embedded in the main body 1 at predetermined positions so as to pass through the main body. Above the implanted part of the spring probe 2, the horizontal direction is maintained by four guide pins 3, and a floating plate 4 that can be slid in the vertical direction is provided. It is pressed against a stopper 3a at the upper end. A through hole 4d is formed in the floating plate 4 at a position corresponding to the spring probe 2, and the tip of the probe is loosely fitted into the through hole. Also, on the top surface of the floating plate 4 is an IC 6 placed here.
A recess 4a having a shape matching the outer shape of the recess 4a is provided. The bottom of this recess 4a is provided with a convex part 4c that is higher than the other bottom parts over the four corners or the entire peripheral part as shown in the third figure,
At least one positioning recess 4b into which the bump 6a of the IC 6 placed therein is inserted is bored at a plurality of locations on the upper surface of the convex portion 4c.
なお、前記凸部４ｃは設けずに直接底部の複数個所に前
記と同様に位置決め用凹部４ｂを設けても良い。Incidentally, the convex portion 4c may not be provided, and positioning recesses 4b may be provided directly at a plurality of locations on the bottom in the same manner as described above.
ここに載置されたＩＣ６の上側にはこのＩＣ６の上面に
密着する下面を有するカバー板７を置き、押え部材８で
ＩＣ６をカバー板７とフローティングプレート４との間
に挟持してフローティングプレート４を本体１の方向に
押圧する。A cover plate 7 having a lower surface that is in close contact with the upper surface of the IC 6 is placed above the IC 6 placed here, and the IC 6 is held between the cover plate 7 and the floating plate 4 by the holding member 8 to remove the floating plate 4. Press in the direction of main body 1.
なお第２図示のようにＩＣ６には接続端子としてバンプ
６ａが設けられており、フローティングプレート４の透
孔４ｄの位置とバンプ６ａの位置が前記位置決め用凹部
４ｂとここに嵌入されたバンプ６ａとで規制されて一致
するので、各バンプ６ａは対応したスプリングプローブ
２の先端と接触する。このときスプリングプローブ２の
先端は内蔵のバネにより押し込まれた先端とハンプ６ａ
とが一定の押圧力で接触するようになっている。As shown in the second diagram, the IC 6 is provided with a bump 6a as a connection terminal, and the position of the through hole 4d of the floating plate 4 and the position of the bump 6a are aligned with the positioning recess 4b and the bump 6a fitted therein. Each bump 6a contacts the tip of the corresponding spring probe 2. At this time, the tip of the spring probe 2 is pressed in by the built-in spring and the hump 6a
are in contact with each other with a constant pressing force.
上述のように本発明によればＩＣをフローティングプレ
ート上面の凹部に挿入するだけで位置の粗調が出来、さ
らにＩＣ底部にまで挿入すればＩＣのバンプ自身が位置
の精密調整を行うので、前記のような高密度に多数のハ
ンプを設けたＩＣも容易に位置決めが出来る。As described above, according to the present invention, the position can be roughly adjusted simply by inserting the IC into the recess on the top surface of the floating plate, and if the IC is inserted all the way to the bottom of the IC, the IC bump itself can perform precise position adjustment. It is also possible to easily position an IC with a large number of humps arranged at high density.
第１図は本発明のＩＣソケットの縦断面図、第２図はフ
ローティングプレートが上弄した状態の一部分の拡大断
面図、第３図はフローティングプレートとＩＣの一部断
面の斜視図である。
１・・・・・・本体、２・・・・・・スプリングプロー
ブ、３・・・・・・ガイドビン、４・・・・・・フロー
ティングプレート、４ｂ・・・・・・位置決め用凹部、
４ｃ・・・・・・凸部、６・・・・・・ｒｃ、６ａ・・
・・・・バンプ、７・・・・・・カバー仮、８・・・・
・・押え部材。
箋２ΩFIG. 1 is a longitudinal sectional view of an IC socket of the present invention, FIG. 2 is an enlarged sectional view of a portion of the IC socket with the floating plate placed on top, and FIG. 3 is a perspective view of a portion of the floating plate and IC. 1...Main body, 2...Spring probe, 3...Guide bin, 4...Floating plate, 4b...Positioning recess,
4c...Protrusion, 6...rc, 6a...
...Bump, 7...Temporary cover, 8...
...Press member. Notebook 2Ω
Claims (2)
本体上に上下動可能に取付けられかつ上方へ弾圧されて
いるフローティングプレートと、このフローティングプ
レート上に検査されるべきＩＣを挟んで載置されるカバ
ー板とを備えたＩＣソケットにおいて、 フローティングプレート上面に形成されたＩＣ載置区画
の複数の隅部にそれぞれ少なくとも１つの前記ＩＣのバ
ンプが嵌入すべき位置決め用凹部を穿設したことを特徴
とするＩＣソケット。(1) A main body provided with a plurality of spring probes, a floating plate mounted on the main body so as to be movable up and down and pressed upward, and an IC to be inspected placed on the floating plate. In the IC socket, a positioning recess into which at least one bump of the IC is to be fitted is formed in each of a plurality of corners of the IC mounting section formed on the upper surface of the floating plate. IC socket.
本体上に上下動可能に取付けられかつ上方へ弾圧されて
いるフローティングプレートと、このフローティングプ
レート上に検査されるべきＩＣを挟んで載置されるカバ
ー板とを備えたＩＣソケットにおいて、 フローティングプレート上面に形成されたＩＣ載置区画
内の周辺部及び各隅部のうち少なくともその一方はＩＣ
載置区画内の他の部分より高くした凸部を形成し、この
凸部の複数個所にそれぞれ少なくとも１つの前記ＩＣの
バンプが嵌入すべき位置決め用凹部を穿設したことを特
徴とするＩＣソケット。(2) A main body provided with a plurality of spring probes, a floating plate mounted on the main body so as to be movable up and down and pressed upward, and an IC to be inspected placed on this floating plate with the IC sandwiched therebetween. In an IC socket equipped with a cover plate, at least one of the periphery and each corner of the IC mounting section formed on the upper surface of the floating plate is
An IC socket characterized in that a convex portion is formed higher than other parts in the mounting section, and positioning recesses into which at least one bump of the IC is to be fitted are bored at a plurality of locations of the convex portion, respectively. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60218303A JPS6276273A (en) | 1985-09-30 | 1985-09-30 | Ic socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60218303A JPS6276273A (en) | 1985-09-30 | 1985-09-30 | Ic socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6276273A true JPS6276273A (en) | 1987-04-08 |
| JPH0361997B2 JPH0361997B2 (en) | 1991-09-24 |
Family
ID=16717723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60218303A Granted JPS6276273A (en) | 1985-09-30 | 1985-09-30 | Ic socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6276273A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63291375A (en) * | 1987-05-22 | 1988-11-29 | Yamaichi Electric Mfg Co Ltd | Ic socket |
| JPH0183342U (en) * | 1987-11-24 | 1989-06-02 | ||
| JPH01104684U (en) * | 1987-12-31 | 1989-07-14 | ||
| JPH04254773A (en) * | 1991-02-06 | 1992-09-10 | Nec Kyushu Ltd | Contactor |
| US5247250A (en) * | 1992-03-27 | 1993-09-21 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket |
| US5647756A (en) * | 1995-12-19 | 1997-07-15 | Minnesota Mining And Manufacturing | Integrated circuit test socket having toggle clamp lid |
| US5791914A (en) * | 1995-11-21 | 1998-08-11 | Loranger International Corporation | Electrical socket with floating guide plate |
| US6084421A (en) * | 1997-04-15 | 2000-07-04 | Delaware Capital Formation, Inc. | Test socket |
| US6204680B1 (en) | 1997-04-15 | 2001-03-20 | Delaware Capital Formation, Inc. | Test socket |
| KR100743587B1 (en) * | 1999-05-27 | 2007-07-27 | 닛폰 하츠죠 가부시키가이샤 | Probe unit for testing substrate to be mounted semiconductor chip |
| JP2008098048A (en) * | 2006-10-13 | 2008-04-24 | Enplas Corp | Socket for electric component |
| JP2009139191A (en) * | 2007-12-05 | 2009-06-25 | Nec Electronics Corp | Socket for inspection |
| JP2011210415A (en) * | 2010-03-29 | 2011-10-20 | Enplas Corp | Socket for electric component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921417U (en) * | 1972-05-26 | 1974-02-23 | ||
| JPS5257261U (en) * | 1975-10-23 | 1977-04-25 | ||
| JPS5689186U (en) * | 1979-12-12 | 1981-07-16 | ||
| JPS5830295U (en) * | 1981-08-24 | 1983-02-26 | 山一電機工業株式会社 | integrated circuit board socket |
| JPS59218762A (en) * | 1983-05-26 | 1984-12-10 | Fujitsu Ltd | Mounting method of leadless chip carrier |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3108622A1 (en) * | 1981-03-06 | 1982-09-16 | Wacker-Chemie GmbH, 8000 München | "METHOD FOR STABILIZING AQUEOUS SOLUTIONS OF ACETOACETAMIDES" |
-
1985
- 1985-09-30 JP JP60218303A patent/JPS6276273A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921417U (en) * | 1972-05-26 | 1974-02-23 | ||
| JPS5257261U (en) * | 1975-10-23 | 1977-04-25 | ||
| JPS5689186U (en) * | 1979-12-12 | 1981-07-16 | ||
| JPS5830295U (en) * | 1981-08-24 | 1983-02-26 | 山一電機工業株式会社 | integrated circuit board socket |
| JPS59218762A (en) * | 1983-05-26 | 1984-12-10 | Fujitsu Ltd | Mounting method of leadless chip carrier |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371746B2 (en) * | 1987-05-22 | 1991-11-14 | Yamaichi Electric Mfg | |
| JPS63291375A (en) * | 1987-05-22 | 1988-11-29 | Yamaichi Electric Mfg Co Ltd | Ic socket |
| JPH0183342U (en) * | 1987-11-24 | 1989-06-02 | ||
| JPH0249670Y2 (en) * | 1987-11-24 | 1990-12-27 | ||
| JPH01104684U (en) * | 1987-12-31 | 1989-07-14 | ||
| JPH0517829Y2 (en) * | 1987-12-31 | 1993-05-12 | ||
| JPH04254773A (en) * | 1991-02-06 | 1992-09-10 | Nec Kyushu Ltd | Contactor |
| US5247250A (en) * | 1992-03-27 | 1993-09-21 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket |
| US5791914A (en) * | 1995-11-21 | 1998-08-11 | Loranger International Corporation | Electrical socket with floating guide plate |
| US5647756A (en) * | 1995-12-19 | 1997-07-15 | Minnesota Mining And Manufacturing | Integrated circuit test socket having toggle clamp lid |
| US6084421A (en) * | 1997-04-15 | 2000-07-04 | Delaware Capital Formation, Inc. | Test socket |
| US6204680B1 (en) | 1997-04-15 | 2001-03-20 | Delaware Capital Formation, Inc. | Test socket |
| KR100743587B1 (en) * | 1999-05-27 | 2007-07-27 | 닛폰 하츠죠 가부시키가이샤 | Probe unit for testing substrate to be mounted semiconductor chip |
| JP2008098048A (en) * | 2006-10-13 | 2008-04-24 | Enplas Corp | Socket for electric component |
| JP2009139191A (en) * | 2007-12-05 | 2009-06-25 | Nec Electronics Corp | Socket for inspection |
| JP2011210415A (en) * | 2010-03-29 | 2011-10-20 | Enplas Corp | Socket for electric component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0361997B2 (en) | 1991-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |