JP2519116Y2 - IC socket - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an IC socket used for an electrical characteristic test of a large scale integrated circuit (LSI) having a large number of densely formed electrical contacts.

[0002]

[Prior Art and Problems to be Solved by the Invention] In recent years,
In order to expand the functions of laptops, personal computers, workstations, minicomputers, mobile phones, etc., technological development of mounting LSIs with multiple terminals and electrical contacts formed at a fine pitch is in progress. And such LS for mounting
As an example of I, so-called TCP (Tape Carrier)
r Package) is known in which an extremely thin copper foil lead is formed on an organic film and an LSI chip (bare chip) and a circuit board are connected via the lead.

Conventionally, an IC socket using a wire probe for electrical connection with the above-mentioned electrical contacts has been used to test the electrical characteristics and the like of such a semiconductor circuit as TCP. FIG. 5 shows an example of the structure of this type of IC socket. In the figure, a large number of wire probes 22 corresponding to the electrical contacts of the TCP are arranged in the socket body 21, and the tip of each wire probe 22 is arranged. Is the socket body 2
It slightly protrudes from the upper surface of 1 so that it can come into contact with the electrical contacts of the TCP. Then, due to this contact, the TCP is pressed toward the socket body 21, but the wire probe subjected to the pressing force is bent and deformed. Further, when the flexural deformation becomes large, the adjacent wire probes 22 come into contact with each other as shown in FIG. 5, and therefore, unless sufficient space is secured to allow such flexural deformation of the wire probe 22, TC
Proper electrical connection between P and the wire probe 22 cannot be achieved.

On the other hand, in FIG. 6, in order to eliminate contact accidents due to the bending deformation of the wire probe 22,
An IC provided with an intermediate plate 23 having a large number of through holes 23a through which the wire probe 22 is inserted.
The example of a structure of a socket is shown. In this IC socket, when the TCP is pressed to bring the electrical contact of the TCP and the wire probe 22 into contact, each wire probe 2
2 causes bending deformation, and the intermediate plate 23 moves in the direction of arrow A in the figure in accordance with the amount of the bending deformation, thereby preventing the wire probes 22 from contacting each other, and the TCP and the wire probe 22. Can be properly connected. Note that when the TCP is detached from the socket body 21, the elasticity of the wire probe 22 itself restores the original state.

However, in the conventional IC socket (FIG. 6), the intermediate plate 23 that reciprocates along the direction of arrow A as the wire probe 22 flexes and deforms.
The stopper 24 must be provided to maintain and fix the socket, which complicates the assembling work, and thus requires a long time to manufacture the socket. Also, because of that, it is not suitable for mass production, and thus the production cost must be increased.

In view of such circumstances, an object of the present invention is to provide an IC socket of this kind which can be easily assembled and can be manufactured at a low cost.

[0007]

In the IC socket according to the present invention, a large number of wire probes for making an electrical connection with an integrated circuit are arranged side by side at a fine pitch in the socket body. Has its base portion fixed to the bottom portion of the socket body so as to be planted in the bottom portion, and is vertically movably attached to the socket body and biased upward by a bullet means. A floating plate that supports the tip portion of the wire probe so that it can be inserted therethrough, a locate board vertically movably mounted on the socket body so that the mounting portion projects from the bottom portion of the socket body, and a locate board of the locate board. A large number of guides for penetrating each of the above-mentioned wire probes are designed to be placed on the placing part according to the vertical movement position. An intermediate plate having a hole; and a lid body pivotally attached to the socket body so as to press the integrated circuit mounted on the floating plate to bring it into contact with the wire probe. .

[0008]

According to the present invention, particularly in the socket assembling work, the intermediate plate is placed and supported between the locate board and the floating plate only by placing it on the placing portion of the locate board. As described above, the mechanism for mounting the intermediate plate on the socket body is simple, so that the socket assembly is simple and easy.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS I according to the present invention will now be described with reference to FIGS.
An example of the C socket will be described. In the figure, 1 is a socket body formed in a concave shape, 2 is a fine wire, and its base portion 2a is a wire probe fixed to the bottom portion 1a of the socket body 1 by an adhesive 3. In this example, a large number of wire probes 2 are juxtaposed at a fine pitch interval so as to form a frame shape along the inner side of the socket body 1 as shown by the chain double-dashed line in FIG. Reference numeral 4 denotes a floating plate which is vertically movably mounted on the socket body 1 by inserting four guide legs 4a vertically extending from respective corners into the guide holes 1b of the socket body 1, and 5 denotes the above guide legs. 4a is inserted and screwed, and its head 5a abuts against the socket body 1 to restrict the upward movement position of the floating plate 4 (in FIGS. 2 and 4, the floating plate 4 is moved upward). 6 is a state in which it is slightly lowered from the position), 6 is an ammunition means such as a compression coil spring wound around the guide leg 4a and interposed between the socket body 1 and the floating plate 4, and 7 is The above TCP to be electrically connected to the wire probe 2
Is a carrier that carries and is set at a predetermined position on the floating plate 4 in the carried state.

The wire probes 2 are arranged side by side in a frame shape as described above, and the tip portion 2b of the wire probe 2 is above the floating plate 4 when the floating plate 4 is brought to the upward movement position. The floating plate 4 is supported by a through hole formed in the floating plate 4 so as to project from the surface. Further, when the carrier 7 is set on the floating plate 4, the TCP is positioned by the guide pin 8 embedded in the floating plate 4, whereby the electrical contact of the TCP and the tip portion of the wire probe 2 are positioned. 2b is adapted to match.

Further, in the figure, 9 is a mounting portion 9a, 9a.
′ (See FIGS. 2 and 4) projects from the bottom portion 1a of the socket body 1 and the side portions of the mounting portions 9a, 9a ′ are engaged with and guided by the guide portions 1c, 1c ′ of the bottom portion 1a. Locate board mounted on the socket body 1 so that it can move up and down,
10 is placed on the placing portions 9a and 9a 'described above, and the hole 10a is positioned by fitting with the guide pin 11 planted in the bottom portion 1a of the socket body 1. This is an intermediate plate having a large number of guide holes 10b for penetrating each wire probe 2 in this positioned state. The mounting portions 9a and 9a 'of the locate boards 9 and 9'are provided with protrusions 9b and 9b', respectively, and the locate boards 9 and 9'fall out of the socket body 1 by these protrusions 9b and 9b '. There is no such thing.

Reference numeral 12 denotes a lid body pivotally attached to the socket body 1 via a pivot 13, and 14 denotes the lid body 1 pivotally attached.
An elastic means such as a torsion coil spring that gives the habit of opening to 2 and a stopper 15 that can hold the lid 12 in the closed state. Inside the lid body 12, a frame-shaped pad portion 12 corresponding to the juxtaposed region (FIG. 3) of the wire probes 2 is provided.
The carrier 7 is formed on the floating plate 4 by projecting a and is closed by the lid 12.
Can be pressed.

Since the IC socket according to the present invention is constructed as described above, when assembling the IC socket of the present invention, the intermediate plate 10 is first assembled into the socket body 1 via the guide pin 11. The intermediate plate 10 incorporated at this time is placed on the bottom portion 1a, and then the locate board 9 is placed on the placing portions 9a, 9a '.
Is pushed in from the lower side of the bottom portion 1a of the socket body 1, whereby the projections 9b, 9b 'thereof are mounted on the socket body 1 by passing over the guide portions 1c, 1c' of the bottom portion 1a. By mounting the locate board 9, the intermediate plate 10 is pushed up to the tops of the mounting portions 9a, 9a 'of the locate board 9 and lifted up from the bottom 1a of the socket body 1. The locate board 9 and the intermediate plate 10 are Due to its own weight, the protrusions 9b, 9b 'of the locate board 9 are supported in the socket body 1 at positions where they engage with the bottom 1a. Note that FIGS. 2 and 4 show a state in which the position is moved upward by a distance L from the position in the engaged state. After that, in each wire probe 2, the base portion 2a thereof first penetrates through the guide hole 10b of the intermediate plate 10, and then the base portion 2a is arranged so that the height position of each tip portion 2b is aligned with a predetermined height. 1 is attached to the bottom portion 1a. Then, the inserted base portion 2a is fixed to the bottom portion 1a by the adhesive 3. In this way, when the wire probe 2 is attached to the bottom portion 1a of the socket body 1,
In particular, since the intermediate plate 10 is lower than the position shown in FIG. 4, the intermediate plate 10 is relatively close to the bottom portion 1a, so that each wire probe 2 can be attached to the bottom portion 1a of the socket body 1. Easier to do.

After the wire probe 2 is inserted, its tip 2
The floating plate 4 is attached to the socket body 1 so that b is inserted from the lower side of the floating plate 4, whereby the base portion 2a is attached to the bottom portion 1a of the socket body 1.
The wire probe 2 fixedly attached to the socket 2 and having the tip 2b supported by the floating plate 4 so that it can be inserted thereinto is aligned with a predetermined position of the socket body 1 while penetrating the guide hole 10b of the intermediate plate 10. Set up. Then, after this, the lid body 12 and the like are attached to the socket body 1 to complete the assembly of the socket.

Next, in the assembled IC socket of the present invention, when the TCP and the wire probe 2 are electrically connected, the socket body 1 is first fixed so that the bottom portion 1a thereof is placed on a base or the like (not shown). The locating board 9 is moved by the base or the like as shown in FIGS.
As shown, the wire probe 2 is raised by the distance L so that the wire probe 2 penetrates the guide hole 10b of the intermediate plate 10 at the substantially intermediate portion thereof as shown in the figure. Then, the carrier 7 carrying the TCP is placed at a predetermined position on the floating plate 4 with the lid 12 opened. In this case, the carrier 4 is placed so that the electrical contacts of the TCP and the tip portions 2b of the wire probes 2 are already in contact with each other. When the lid 7 is closed, the pad portion 12a presses the carrier 7, whereby the electrical contacts of the TCP carried on the carrier 4 and the corresponding tip portions 2b of the wire probes 2 are applied with an appropriate pressure. Contacted. Further, each wire probe 2 is bent by the pressing action based on the closing of the lid body 12, but the wire probe 2 penetrates the guide hole 10b of the intermediate plate 10 at the central portion thereof as described above, and Since the guide hole 10b has a size that allows the bending of the wire probe 2, the wire probes 2 do not cause contact accidents with each other, and accordingly, the electrical contact of the TCP and the suitability of the wire probe 2 are not caused. Electrical connection is guaranteed.

In the above embodiment, particularly, the distance L (see FIG. 4) at which the locate board 9 can move up and down in the state where the locate board 9 is mounted on the socket body 1 can be appropriately set if necessary, and the locate board can be used. The size and the like of the guide hole 10b formed in the intermediate plate 10 placed on the plate 9 can be appropriately selected.

[0017]

As described above, according to the present invention, the TC
Since it is a simple mechanism in which the intermediate plate supported by the locate board is arranged between the floating plate for mounting P etc. and the socket body, the workability at the time of socket assembly is remarkably improved. Since the socket can be assembled in an extremely short time, mass production can be effectively realized. And
This makes it possible to reduce the price of the socket.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention.

FIG. 2 is a vertical sectional view of the IC socket according to the present invention.

FIG. 3 is a plan view of the IC socket according to the present invention with a lid removed.

FIG. 4 is a partial vertical sectional view of the IC socket according to the present invention.

FIG. 5 is a partial vertical sectional view of a conventional IC socket of this type.

FIG. 6 is a partial vertical sectional view of another conventional IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket body 2 Wire probe 3 Adhesive 4 Floating plate 5 Stopper bolt 6 Ammunition means 7 Carrier 8 Guide pin 9 Locate board 10 Intermediate plate 11 Guide pin 12 Lid body 13 Axis 14 Ammunition means

Claims (1)

(57) [Scope of utility model registration request] 1. An IC socket in which a large number of wire probes for making electrical connection with an integrated circuit are arranged side by side at a fine pitch in a socket body, and the wire probe has a base at the bottom of the socket body. It is fixedly planted in the bottom portion, is vertically movably attached to the socket body, and is urged upward by a bullet means to support the tip portion of the wire probe so that it can be inserted therethrough. A floating plate, a locate board mounted on the socket body so as to be vertically movable so that the mounting section projects from the bottom section of the socket body, and the above-mentioned mounting section according to the vertical movement position of the locate board. An intermediate plate having a large number of guide holes for penetrating each of the wire probes, and An IC socket comprising: a lid pivotally attached to the socket body so as to press the integrated circuit mounted on a floating plate to contact the wire probe.