JP3012640B1 - IC socket cover holding device - Google Patents

Abstract

An IC socket cover holding device for easily mounting a package to a socket body without causing electrical contact failure. A shaft is accommodated in slots at both ends of a holder plate 7 so as to be rotatable in the slots, and a U-shaped latch 8 is fixed to the shaft. Therefore, the latch 8 can perform a lever movement about the fixed portion as a fulcrum. A torsion coil spring 9 for applying a torsion stress to the holder plate 7 to the latch 8 is connected between the inner wall of the slot and the shaft. By covering the IC socket cover together with the holder plate on the upper part of the IC socket main body provided with the IC socket external terminals and pressing down to a predetermined position, the lower end of the latch 8 is hooked on the bottom surface of the IC socket main body, The above IC
The socket cover is configured to be held at the predetermined position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket cover holding device, and more particularly to an IC used for an open-top type IC socket used for an LSI electrical test or the like.
The present invention relates to a socket cover holding device.

[0002]

2. Description of the Related Art An IC socket cover used for an open-top type IC socket, which is widely used for an electrical test of an LSI, is strongly closed by being pushed down to a predetermined position by mechanical force of an automatic machine. It has a function to pry open the contact pin having elasticity. When the IC socket cover is released from being pushed down, the contact pins are closed again by the elasticity of the close contact pins.

Next, an open top type IC socket and B
The connection method of the GA type IC package will be described in detail with reference to FIG. FIG. 5 is an explanatory diagram for explaining a connection state between a solder ball, which is a terminal of a BGA type IC package, and a contact pin of the IC socket in the open top type IC socket. FIG. 5A shows a state before connection, and FIG. 5B shows a state after connection. FIG. 5C shows a state in which the connection has been made to an improper position (a package floating state).

When the IC socket cover (not shown) is pushed all the way down, the contact pins 5 are completely opened, and the solder balls 13 (BGA type I)
(C package terminal) insertion space is secured. That is, the contact pins 5 are opened only when the IC socket cover 3 is fully pressed, and when the hand is released from the IC socket cover 3, the contact pins 5 are lifted upward by a spring in the socket. Release the IC socket cover 3 to release the IC socket cover 3.
When the contact pins 5 are lifted, the contact pins 5 close and come into contact with the solder balls 13 at an appropriate pressure, and normal electrical connection is obtained.

[0005] An investigation into the technology related to this field based on past patent application publications shows that Japanese Patent Application Laid-Open No. 8-64320 discloses that when an IC socket is mounted, an opening of a contact pin is pushed by pushing down a cover. Disclosed is a socket that can be expanded to fit into a spherical lead terminal of an IC package without mechanical damage.

Japanese Unexamined Patent Publication No. 10-112365 discloses a uniform contact state which is not affected by variations in the shape of the solder ball by deforming and enclosing the contact in accordance with each solder ball having a slightly different size. Is disclosed.

Japanese Patent Application Laid-Open No. Hei 10-189191 discloses that the scissor opening of a contact pin is rotated with respect to the center of the solder ball while maintaining electrical contact with the side surface of the solder ball. A BGA test IC socket capable of removing a film is disclosed.

Further, Japanese Patent Application Laid-Open No. 10-255941 discloses a method in which a protrusion protruding from the upper surface of a substrate and a plurality of contacts in contact with a ball terminal are provided. There is disclosed a BGA device socket in which a contact portion is approached or separated, and a BGA device can be fitted / removed simply by moving a cover up and down.

[0009]

By the way, the conventional IC socket cover used for the open top type IC socket has no problem that is particularly inconvenient as long as it is mounted using an automatic machine. However, if the automatic machine goes down or if you want to operate it on a small scale, and you want to attach it manually without using the automatic machine, you need to refer to the manual to install it. It becomes.

At this time, the pressure required for operating the IC socket cover is theoretically proportional to the number of contact pins. However, with some exceptions where the number of pins is small, the pressure is generally three times. Since the IC socket cover shown in FIG. 3 must be pressed down with one hand and the force greater than the reaction force with one hand, the other hand must be used to attach a small IC package using tweezers. Sex had become very bad. In other words, it is necessary to simultaneously perform a task requiring muscle strength and a task to reduce muscle strength, and this task is difficult.

Open-top type IC sockets, which are often used for LSI electrical tests and the like, have been conventionally developed for automatic machines, and therefore are not suitable for mounting work with reference to a manual. The reason is that, as described above, the force required for operating the IC socket cover 3 increases in proportion to the number of contact pins 5, and when it becomes about 400 pins, about 3 to 5 kgf is required. This is because mounting the IC package 12 while holding the reaction force with one hand is a very difficult task.

By the way, when the IC package is to be mounted in a state where the IC socket cover has not been pushed down to the lower limit, the contact pins 5 shown in FIG. 5A are in a half-open state. Solder ball 13 shown
Is held at an improper position (floating state of the package) as shown in FIG. 5 (c). 13 may be crushed due to heat generation, which may result in defective specifications or poor conduction.

The techniques disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 8-64320 and the following are all mainly concerned with a method of contacting a solder ball with a contact pin. However, the above-described problem that occurs when the button is pressed has not been solved.

The present invention has been made in view of the above problems in the conventional IC socket cover, and
An object of the present invention is to provide an IC socket cover holding device and a method thereof that can easily mount a package on an IC socket body without causing electrical contact failure.

[0015]

In order to solve the above problems, an IC socket cover holding device according to the present invention comprises:
The contact pin is opened by lowering the IC socket cover to a prescribed position, and the contact pin is closed by raising the IC socket cover upward from the prescribed position. An IC socket cover holding device attached to an upper portion of a socket cover, wherein the IC socket cover holding device includes holding means and the like, and holds the IC socket cover in a state of being lowered to the specified position by the holding means. Having a structure "(claim 1), whereby the above object can be achieved.

The IC socket cover holding device is formed integrally with the IC socket cover. (Claim 2) The holding means has a flat holder plate having one slot at each end. A shaft in each of the slots housed so as to be rotatable in each of the slots, and a torsion coil spring for applying a torsional stress to each of the holder plates to each of the shafts. The holder plate is fixed to the side wall of each of the shafts, and has a substantially U-shaped or L-shaped latch that can swing around the fixed portions (Claim 3); Or one of the latch and the torsion coil spring is formed of a metal material or a plastic material (Claim 4). Can be applied to terminals of the package C to the IC socket for electrically connecting (Claim 5), it - the IC package is BGA type (claim 6), characterized by.

(Operation) The operation of the present invention will be described below.
The IC socket cover holding device according to the present invention is an open-top type IC which is widely used for LSI electrical tests and the like.
In the C socket, a holder plate provided with latches at both ends is provided as a component to be installed above the IC socket cover.
By being configured to be hooked on the bottom surface of the socket body, it is possible to hold the IC socket cover at the position lowered by the above-mentioned specified amount, thereby opening the contact pin opening by the predetermined amount. It can be maintained in a state.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a state in which an IC socket main body is mounted on an IC socket cover holding device according to an embodiment of the present invention. FIG. 2 is a front view of the IC socket cover holding device according to the embodiment of the present invention.

In each of the slots provided at both ends of the holder plate 7, a shaft 10 is accommodated so as to be rotatable in the slot, and a U-shaped latch 8 is provided on the shaft 10. It is fixed. Therefore, the latch 8 can perform a lever movement about the fixed portion as a fulcrum. Between the inner wall of the slot and the shaft 10, the latch 8 is provided with the holder plate 7.
A torsion coil spring 9 for applying a torsional stress to is connected to both ends of the torsion coil spring 9 by an E-shaped retaining ring 11.

FIG. 3 is a front view showing a state before the IC socket cover according to the embodiment of the present invention is mounted on the socket body. The entire IC socket cover holding device according to the embodiment of the present invention is covered with the IC socket main body 2, but has not been pushed down yet. In this state, the lower end portion (claw portion) of the latch 8 lightly presses the side wall of the IC socket main body 2 by the action of the torsional stress of the coil spring 9. The IC socket main body 2 of the open top type IC socket is mounted on the substrate 1 via the spacer 6, and further, the socket external terminals 4 are fixed by soldering and electrically connected. An IC socket cover 3, which is a conventional IC socket cover, is mounted on the IC socket body.

FIG. 4 shows a state in which the IC socket cover holding device according to the embodiment of the present invention has been mounted on the IC socket body. In this state, the lower end of the latch 8 is inserted into the bottom of the IC socket body 2 shown in FIG. 3, and the arm of the latch 8 is actuated by the torsion stress of the coil spring 9 so that the IC socket shown in FIG. The side wall of the main body 2 is pressed lightly.

Hereinafter, a method of mounting an IC package using the IC socket cover holding device according to the present embodiment will be described. First, the latch 8 of the IC socket cover is opened and set on the upper surface of the IC socket cover 3. That is, the IC socket cover according to the present embodiment is set on the IC socket cover 3 held by the other hand while holding the latch 8 so as to be pushed inward with one hand.

Next, the upper surface of the holder plate 7 is pushed downward (toward the substrate 1). Thus, when the lower end of the latch 8 reaches the bottom surface of the IC socket body 2, the opposing latches 8 rotate inwardly by leverage due to the spring stress of the torsion coil spring 9, and are caught on the bottom surface of the socket body 2. The socket cover 3 is fixed at a predetermined position. As a result, the contact pins (see FIG. 5 described above) of the socket external terminals 4 are opened in a prescribed amount, so that the solder balls (lead terminals, see FIG. 5 described above for details) of the IC package 12. Can be accepted without causing poor electrical contact.

Next, the IC package 12 is picked up by suction tweezers or the like, and inserted into a specified position of the IC socket body 2. Further, after the IC package 12 is inserted by the operation as described above, while holding the IC socket cover 3 with, for example, both fingers except for the forefinger of both hands,
By pushing down the upper end portions of the latches 8 located at both ends of the holder plate 7 with the forefinger of both hands, the lower end portions of the latches 8 hooked on the bottom surface of the IC socket main body 2 are opened, and the IC socket cover 3 is returned upward. can do.

When an automatic machine is used, the IC socket cover according to the present invention can be used by removing it from the IC socket main body 2. However, when the automatic machine is used, both the holder plate 7 and the latch 8 must be pressed down. With such a structure, it can be used without carrying out the above-mentioned removal.

The material forming the holder plate 7, the latch 8, or the torsion coil spring 9 can be metal or plastic. In the present embodiment, the socket cover 3 is a conventional IC socket cover, and the socket cover 3 is provided with the IC socket cover holding device according to the present invention.
That is, the IC socket cover holding device according to the present invention has a separate structure.
It may be formed as an integral structure with the above.

In this embodiment, the latch 8
Is U-shaped, but it is also possible to make it L-shaped. Further, in the present embodiment, the IC socket body 2 is intended for a BGA (Ball Grid Array) type IC package, but it is an open top type IC for QFP type, TSOP type, and other IC packages. It may be a socket. Further, in the present embodiment, I
Although the example in which the C package is mounted on the external terminal of the IC socket has been described, it is also possible to pull out the IC package already mounted on the external terminal of the IC socket by the same operation.

[0028]

As described above, according to the present invention,
According to the C socket cover holding device, when mounting the IC package, the IC socket cover of the open top type IC socket can be maintained in a state of being pushed down. It is not necessary to push down the IC socket cover until the insertion / removal work of the IC package is completed, so that the mounting work or the removal work (fitting / removing work) of the IC package becomes easy.

Also, since the IC socket cover is securely held in a depressed state, a prescribed opening amount of the contact pin is secured when the IC package is mounted.
The IC package can be securely mounted without causing poor electrical contact.

[Brief description of the drawings]

FIG. 1 is a plan view showing a state in which an IC socket body is mounted on an IC socket cover using an IC socket cover holding device according to an embodiment of the present invention.

FIG. 2 is a front view of an IC socket cover using the IC socket cover holding device according to the embodiment of the present invention.

FIG. 3 is a front view showing a state before the IC socket cover using the IC socket cover holding device according to the embodiment of the present invention is mounted on the IC socket main body.

FIG. 4 is a front view showing a state in which the IC socket cover using the IC socket cover holding device according to the embodiment of the present invention has been mounted on the IC socket main body.

FIG. 5 is a terminal (solder ball) of a BGA type IC package.
FIG. 4 is a diagram for explaining a connection state between the IC socket and a contact pin of the IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 IC socket main body 3 IC socket cover 4 IC socket external terminal 5 Contact pin 6 Spacer 7 Holder plate 8 Latch 9 Torsion coil spring 10 Shaft 11 E type snap ring 12 IC package 13 BGA type IC package terminal (solder ball)

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-11-297443 (JP, A) JP-A-10-32068 (JP, A) JP-A-11-214105 (JP, A) JP-A-11-297 135217 (JP, A) Japanese Utility Model Application No. 5-94983 (JP, U) Japanese Utility Model Application No. 54-174841 (JP, U) Japanese Utility Model Application No. 5-87863 (JP, U) (58) Field surveyed (Int. ⁷ , DB name) H01R 23/00 H01R 33/00-33/97 H01L 23/00 G01R 31/26

Claims (6)

(57) [Claims] 1. An IC socket having a structure in which a contact pin is opened by lowering an IC socket cover to a predetermined position and a contact pin is closed by raising the IC socket cover upward from the predetermined position. An IC socket cover holding device added to an upper portion of the IC socket cover, wherein the IC socket cover holding device includes holding means and the like, and the IC socket cover is lowered to the prescribed position by the holding means. An IC socket cover holding device having a structure for holding as it is. 2. The IC socket cover holding device according to claim 1, wherein said IC socket cover holding device is formed integrally with said IC socket cover. 3. The holding means includes a flat holder plate having one slot at each end, a shaft in each of the slots housed so as to be rotatable in each of the slots, and A torsion coil spring for applying a torsional stress to each of the holder plates to each of the shafts, and a torsion coil spring that is fixed to the side wall of each of the shafts and that can swing about the fixed portions. The IC socket cover holding device according to claim 1, further comprising a substantially U-shaped or substantially L-shaped latch. 4. The I according to claim 1, wherein one of the holder plate, the latch and the torsion coil spring is formed of a metal material or a plastic material.
C socket cover holding device. 5. The I according to claim 1, wherein the I pin is applicable to an IC socket for electrically connecting the contact pins to terminals of an IC package.
C socket cover holding device. 6. The IC socket cover holding device according to claim 5, wherein the IC package is a BGA type.