JPH0183342U - - Google Patents

Info

Publication number
JPH0183342U
JPH0183342U JP1987178626U JP17862687U JPH0183342U JP H0183342 U JPH0183342 U JP H0183342U JP 1987178626 U JP1987178626 U JP 1987178626U JP 17862687 U JP17862687 U JP 17862687U JP H0183342 U JPH0183342 U JP H0183342U
Authority
JP
Japan
Prior art keywords
package
pedestal
lead
flat
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987178626U
Other languages
Japanese (ja)
Other versions
JPH0249670Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987178626U priority Critical patent/JPH0249670Y2/ja
Publication of JPH0183342U publication Critical patent/JPH0183342U/ja
Application granted granted Critical
Publication of JPH0249670Y2 publication Critical patent/JPH0249670Y2/ja
Expired legal-status Critical Current

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  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａは従来のＩＣソケツト断面図、同図Ｂ
はＩＣパツケージに規制壁６ａを介入した状態を
示す平面図、第２図乃至第８図は本考案の実施例
を示し、第２図はフラツト形ＩＣパツケージ用ソ
ケツト平面図、第３図は同断面図、第４図は同斜
視図、第５図はフラツト形ＩＣパツケージを搭載
せる同斜視図、第６図は同ＩＣパツケージを搭載
直前の状態を以つて示す同拡大断面図、第７図は
同ＩＣパツケージを搭載状態を以つて示す同拡大
断面図、第８図は第７図において押え板を閉合し
た状態を以て示す同断面図である。 １…フラツト形ＩＣパツケージ、１′…ＩＣパ
ツケージ本体、１ａ…側壁、２…ＩＣリード、７
…ソケツト本体、８…ＩＣ搭載台、９…コンタク
ト、１０…バネ、１１…台座、１１ａ…側方規制
部、１１ｂ…載置部、１５…間隔。 Figure 1A is a cross-sectional view of a conventional IC socket, and Figure 1B is a cross-sectional view of a conventional IC socket.
2 is a plan view showing a state in which the regulating wall 6a is interposed in an IC package, FIGS. 2 to 8 show an embodiment of the present invention, FIG. 2 is a plan view of a socket for a flat type IC package, and FIG. 3 is the same. 4 is a perspective view of the same, FIG. 5 is a perspective view of the same in which a flat IC package is mounted, FIG. 6 is an enlarged sectional view of the same showing the IC package in a state immediately before mounting, and FIG. 8 is an enlarged sectional view showing the IC package in a mounted state, and FIG. 8 is a sectional view showing the same in FIG. 7 with the presser plate closed. 1...Flat type IC package, 1'...IC package body, 1a...side wall, 2...IC lead, 7
...Socket body, 8...IC mounting base, 9...contact, 10...spring, 11...pedestal, 11a...side regulation part, 11b...placement part, 15...interval.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソケツト本体にフラツト形ＩＣパツケージを支
承する上下動可能なＩＣ搭載台を具備すると共に
、該ＩＣ搭載台に使用されたフラツト形ＩＣパツ
ケージの側方へ突出されたＩＣリードを載接する
コンタクトを備え、上記ＩＣ搭載台の下降にて該
コンタクトにＩＣリードを載接する構成としたフ
ラツト形ＩＣパツケージ用ソケツトにおいて、上
記ＩＣ搭載台の上面にフラツト形ＩＣパツケージ
の位置決めのための台座を突設し、該台座に上記
ＩＣリードが突出する角隅部において同角隅部を
形成する同リード基部下面を支承する載置部と、
同角隅部において同角隅部を形成するＩＣパツケ
ージ本体の側壁に当接する側方規制部とを具備さ
せ、上記台座は上記載置部によるＩＣリードの支
承にてＩＣパツケージ本体をＩＣ搭載台上面より
高位に浮かし支持する高さを有することを特徴と
するフラツト形ＩＣパツケージ用ソケツト。 The socket body is provided with a vertically movable IC mounting base that supports a flat IC package, and is provided with a contact on which an IC lead protruding to the side of the flat IC package used in the IC mounting base is placed. In the socket for a flat type IC package, which has a structure in which an IC lead is placed on the contact when the IC mounting base is lowered, a pedestal for positioning the flat type IC package is provided protruding from the top surface of the IC mounting base, and a pedestal for positioning the flat type IC package is provided. a mounting part that supports the lower surface of a base of the IC lead forming a corner at a corner where the IC lead protrudes from the pedestal;
The pedestal is provided with a lateral regulating part that comes into contact with the side wall of the IC package main body forming the same angular corner at the same corner, and the pedestal supports the IC package main body as an IC mounting stand by supporting the IC lead by the above-mentioned mounting part. A socket for a flat IC package, characterized by having a height that allows it to be floated and supported above the top surface.
JP1987178626U 1987-11-24 1987-11-24 Expired JPH0249670Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987178626U JPH0249670Y2 (en) 1987-11-24 1987-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987178626U JPH0249670Y2 (en) 1987-11-24 1987-11-24

Publications (2)

Publication Number Publication Date
JPH0183342U true JPH0183342U (en) 1989-06-02
JPH0249670Y2 JPH0249670Y2 (en) 1990-12-27

Family

ID=31470235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987178626U Expired JPH0249670Y2 (en) 1987-11-24 1987-11-24

Country Status (1)

Country Link
JP (1) JPH0249670Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04126691U (en) * 1991-05-02 1992-11-18 株式会社エンプラス IC socket
JPH06203935A (en) * 1992-12-25 1994-07-22 Yamaichi Electron Co Ltd Ic socket

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830295U (en) * 1981-08-24 1983-02-26 山一電機工業株式会社 integrated circuit board socket
JPS59146955U (en) * 1983-03-22 1984-10-01 山一電機工業株式会社 Connector with connected device body removal device
JPS6240366U (en) * 1985-08-30 1987-03-10
JPS6276273A (en) * 1985-09-30 1987-04-08 日本電気株式会社 Ic socket
JPS6415674A (en) * 1987-07-09 1989-01-19 Kyushu Nippon Electric Contact element for inspecting ic

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3108622A1 (en) * 1981-03-06 1982-09-16 Wacker-Chemie GmbH, 8000 München "METHOD FOR STABILIZING AQUEOUS SOLUTIONS OF ACETOACETAMIDES"

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830295U (en) * 1981-08-24 1983-02-26 山一電機工業株式会社 integrated circuit board socket
JPS59146955U (en) * 1983-03-22 1984-10-01 山一電機工業株式会社 Connector with connected device body removal device
JPS6240366U (en) * 1985-08-30 1987-03-10
JPS6276273A (en) * 1985-09-30 1987-04-08 日本電気株式会社 Ic socket
JPS6415674A (en) * 1987-07-09 1989-01-19 Kyushu Nippon Electric Contact element for inspecting ic

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04126691U (en) * 1991-05-02 1992-11-18 株式会社エンプラス IC socket
JPH06203935A (en) * 1992-12-25 1994-07-22 Yamaichi Electron Co Ltd Ic socket

Also Published As

Publication number Publication date
JPH0249670Y2 (en) 1990-12-27

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