JP2008098048A - Socket for electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electric component capable of easily positioning terminals of the electric component with an existing socket body kept used even when the position of a terminal of the electric component usable for positioning is different. <P>SOLUTION: This IC socket 10 is structured such that positioning insertion rods 31 each having a positioning recessed part 31c positioned by inserting a solder ball 1a of an IC package 1 therein are detachably mounted on a floating plate 11 of a socket body 10a of the IC socket 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  According to the present invention, there is provided an electrical component in which a housing portion that accommodates an electrical component formed by projecting a plurality of terminals is provided in the socket body, and a plurality of contact pins that can be separated from and connected to the terminals of the electrical component are disposed. It is related to the socket.

  Conventionally, as an “electrical component socket”, there is an IC socket that detachably holds an IC package that is an “electrical component”.

  The IC package includes a so-called BGA (Ball Grid Array) type. For example, a large number of substantially spherical solder balls (terminals) protrude from the lower surface of a rectangular package body to form a matrix. It is arranged.

  On the other hand, the IC socket is placed with the IC package positioned at a predetermined position on the mounting portion of the socket body, and the solder balls of the IC package are brought into contact with the contact portions of the contact pins to electrically Connected.

  As such an electrical component socket, there is one described in Patent Document 1. Patent Document 1 states that “a main body provided with a plurality of spring probes, a floating plate mounted on the main body so as to be movable up and down and pressed upward, and an IC to be inspected are sandwiched on the floating plate. In the IC socket provided with the cover plate mounted in step 1, at least one positioning recess into which the bump of the IC is to be fitted is drilled in each of a plurality of corners of the IC mounting section formed on the upper surface of the floating plate. IC socket characterized by the above. "

According to such an invention, “the rough adjustment of the position can be achieved simply by inserting the IC into the concave portion on the upper surface of the floating plate, and further, the bump of the IC itself performs the fine adjustment of the position by inserting it into the bottom of the IC. Such an IC having a large number of bumps with a high density as described above can be easily positioned. "
JP-A-62-76273

  However, in the invention described in Patent Document 1, when the positions of the terminals that can be used for positioning on the housing portion of the socket body are different among the plurality of terminals formed on the electrical component, each of the electrical components Therefore, it is necessary to prepare a socket body having an accommodating portion provided with a positioning portion corresponding to the above. In addition, when the production of sockets for electrical parts having a positioning portion provided at such a specific position is a small quantity and a variety of products, there is a possibility that the production takes cost and time.

  In view of this, the present invention provides a terminal for an electrical component while using the existing socket body without replacing the housing portion of the socket body, even if the positions of the terminals that can be used for positioning in the electrical component are different. It is an object of the present invention to provide a socket for an electrical component that can easily cope with positioning and that does not require cost and time to form a positioning portion.

  In order to achieve such an object, according to the first aspect of the present invention, there is provided a housing body for accommodating an electrical component formed by projecting a plurality of terminals, and the socket body is provided with a separate contact with the terminal of the electrical component. A socket for an electrical component in which a plurality of possible contact pins are arranged, and a positioning member having a positioning recess into which the terminal of the electrical component is inserted and positioned is detachably provided in the housing portion. It is characterized by having a socket for electrical parts.

  According to a second aspect of the present invention, in addition to the configuration according to the first aspect, a plurality of through holes into which the contact pins can be inserted are formed in the housing portion, and the positioning member includes the plurality of through holes. It is characterized by comprising an insertion fitting portion to be inserted into one in which the contact pin is not inserted, and a head portion provided on the upper side of the insertion portion and formed with the positioning recess.

  According to a third aspect of the present invention, in addition to the configuration according to the first aspect, the housing portion is formed with a plurality of through holes into which the contact pins can be inserted, and the positioning member is a plate-shaped frame. The plate-like frame body is provided with the positioning recess on a portion of the plurality of through holes into which the contact pins are not inserted, and the contact pins of the plurality of through holes are provided with the contact pins. An insertion hole into which the contact pin can be inserted is formed on what is inserted.

  According to a fourth aspect of the invention, in addition to the configuration of the third aspect, the plate-like frame body is provided with an insertion portion to be inserted into the plurality of through holes below the positioning recess. It is characterized by that.

  According to a fifth aspect of the present invention, in addition to the configuration according to any one of the first to fourth aspects, the accommodating portion is a floating plate that accommodates the electrical component and moves up and down. The terminal of the electrical component is accommodated in the positioning recess when in the highest position, and the terminal of the electrical component is formed on the contact pin when the floating plate is in the lowest position. It is accommodated in a concave contact part.

  According to a sixth aspect of the present invention, in addition to the configuration according to any one of the first to fifth aspects, the positioning recess is formed in a conical shape or a pyramid shape so as to accommodate a terminal of the electrical component. It is characterized by.

  In addition to the configuration according to any one of claims 1 to 6, which is the invention according to claim 7, the positioning recess has a recess formed by further denting the bottom side of the cone shape or the pyramid shape. It is characterized by that.

  According to the first aspect of the present invention, the positioning member having the positioning recess into which the terminal of the electrical component is inserted and positioned is detachably provided in the housing portion of the socket body. Therefore, even if the position of the terminal that can be used for positioning formed on the electrical component is different for each electrical component, the positioning recess is provided at the corresponding position on the socket body housing portion in the existing electrical component socket. Can be provided. Therefore, even if the position of the terminal that can be used for positioning formed on the electrical component is different for each electrical component, the existing socket body can be used without replacing the socket body housing itself. It is possible to easily cope with the positioning of the terminal of the component, and it is possible to prevent cost and time from forming the positioning mechanism.

  According to the second aspect of the present invention, the accommodating portion is formed with a plurality of through holes into which the contact pins can be inserted, and the positioning member is not inserted with the contact pins among the plurality of through holes. It consists of an insertion part to be inserted and a head part provided on the upper side of the insertion part and having a positioning recess. Therefore, if the positioning member is disposed at a desired position among the plurality of through holes formed in the housing portion, the positioning mechanism is located at a position to be positioned without previously forming the positioning mechanism integrally on the housing portion. The provided socket for electrical parts can be used. Also, when using electrical parts with different terminal positions that can be used for positioning in electrical parts, change the position where the positioning member is inserted into the through hole according to the placement of the terminals of the electrical part. can do.

  According to the invention described in claim 3, the housing portion is formed with a plurality of through holes into which the contact pins can be inserted, and the positioning member is a plate-shaped frame body. A positioning recess is provided on the through hole in which the contact pin is not inserted, and an insertion hole through which the contact pin can be inserted is provided on the through hole in which the contact pin is inserted. Been formed. Therefore, when there are a plurality of locations where positioning of the terminals of the electrical component is desired, if a plate-like frame body that simultaneously accommodates a plurality of terminals that can be used for positioning is used, rather than providing a positioning member in each through hole. A plurality of positioning mechanisms can be easily provided in the housing portion at a time.

  According to invention of Claim 4, the plate-shaped frame was provided with the insertion part inserted in a some through-hole below the positioning recessed part. Therefore, the positioning recess in the plate-like frame can be more accurately provided on the accommodating portion.

  According to the fifth aspect of the present invention, the accommodating portion is a floating plate that accommodates an electrical component and moves up and down, and when the floating plate is in the highest position, the terminal of the electrical component is accommodated in the positioning recess. When the floating plate is at the lowest lowered position, the terminals of the electrical parts are accommodated in the concave contact portions formed on the upper portions of the contact pins. Therefore, when the electrical component terminal and the contact pin are not in contact, the electrical component terminal is positioned by the positioning recess, and when the electrical component terminal and the contact pin are in contact with each other, the electrical component terminal is formed at the upper end of the contact pin. The terminal of the electrical component can be positioned by the concave contact portion.

  According to the invention described in claim 6, the positioning recess is formed in a conical shape or a pyramid shape so that the terminal of the electric component is accommodated. Therefore, the terminals of the electrical component can be easily accommodated by the positioning recess.

  According to the seventh aspect of the present invention, the positioning recess has a conical or pyramidal bottom that is further recessed to form a recess. Therefore, even if dust or the like enters the positioning recess, the process proceeds to the recess, so that the positioning recess can be brought into a state where there is no problem in accommodating the terminal of the electrical component.

Embodiment 1 of the Invention

  Embodiment 1 of the present invention will be described below.

  1 to 6 show a first embodiment of the present invention.

  First, the configuration will be briefly described. The IC socket 10 that is an “electrical component socket” includes a pressing mechanism (not shown) of the IC package 1 that is an “electrical component” and a socket body 10a. As shown in FIGS. 1 and 3, the socket body 10a is provided with a floating plate 11 serving as an “accommodating portion” for accommodating the IC package 1, and is formed so as to protrude from the IC package 1 (see FIG. 5). A plurality of contact pins 20 detachable from the solder balls 1a (see FIG. 5), which are a plurality of “terminals”, are arranged. As shown in FIG. 5, the IC socket 10 accommodates the IC package 1 on the floating plate 11, while the wiring board 12 is provided below, and the IC package 1 is connected to the IC package 1 via the contact pins 20. Electrical connection with the substrate 12 is achieved.

  As shown in FIG. 3, the socket body 10a includes a floating plate 11, an upper plate 13, an intermediate plate 14x, an intermediate plate 14y, and a lower plate 15 that house the IC package 1 in this order from the top. These plates 11, 13, 14 x, 14 y, 15 are arranged with a gap therebetween, and a gap S 1 is provided between the upper plate 13 and the intermediate plate 14 x, and the intermediate plate 14 y and the lower plate A gap S <b> 2 is provided between the plate 15.

  The upper plate 13, the intermediate plates 14 x and 14 y, and the lower plate 15 are disposed so as not to move, and the floating plate 11 is placed on the plates 13 to 15 in a state in which the IC package 1 is accommodated. On the other hand, it is arranged to be movable up and down.

  Further, as shown in FIGS. 1 and 3, the floating plate 11 is formed with a plurality of receiving through holes 11a into which the contact pins 20 can be inserted. As shown in FIG. A plurality of upper through holes 13a through which 20 can be inserted are formed, a plurality of intermediate through holes 14a-1 through which the contact pins 20 can be inserted are formed in the intermediate plate 14x, and a contact pin 20 is formed in the intermediate plate 14y. A plurality of intermediate through holes 14 a-2 that can be inserted are formed, and the lower plate 15 is formed with a plurality of lower through holes 15 a through which the contact pins 20 can be inserted. Further, the floating plate 11 is formed with partition walls 11b separating the plurality of housing through holes 11a, and the upper plate 13 is formed with partition walls 13b separating the plurality of upper through holes 13a. The intermediate plate 14x is formed with a partition 14b-1 that separates the plurality of intermediate through holes 14a-1, and the intermediate plate 14y is formed with a partition 14b-2 that separates the plurality of intermediate through holes 14a-2. The lower plate 15 is formed with partition walls 15b that separate the plurality of lower through holes 15a from each other. The diameter of the accommodation through hole 11a is D1, the diameter of the upper through hole 13a is D2, and the diameters of the intermediate through holes 14a-1 and 14a-2 are D3. The diameter of the lower through hole 15a is D4.

  On the floating plate 11 of the socket body 10a, as shown in FIGS. 1 and 3, a positioning insertion rod 31 which is a “positioning member” to be inserted into the accommodation through hole 11a formed in the floating plate 11 is attached and detached. It is provided freely.

  As shown in FIGS. 2A and 2B, the positioning insertion rod 31 includes an insertion portion 31 a to be inserted into one of the plurality of accommodating through holes 11 a into which the contact pin 20 is not inserted. The head portion 31b is provided on the upper side of the insertion portion 31a and has a positioning recess 31c. Among these, as shown in FIGS. 2A and 2B, the insertion portion 31a includes a distal end side portion 31a-1 and a proximal end side portion 31a provided on the proximal end side of the distal end side portion 31a-1. −2, and the diameter of the distal end side portion 31a-1 is d7, and the diameter of the proximal end side portion 31a-2 is d8. The diameter d8 of the base end side portion 31a-2 is formed to have substantially the same size as the diameter D1 of the accommodation through hole 11a of the floating plate 11, and the size of the diameter d7 of the tip end side portion 31a-1 is the base end side. It is formed smaller than the diameter d8 of the part 31a-2. The head 31b is formed with a positioning recess 31c into which the solder ball 1a of the IC package 1 is inserted and positioned. As shown in FIGS. 2A and 2B, the positioning recess 31c is formed in a conical shape so that the solder ball 1a of the IC package 1 can be received and positioned easily.

  As shown in FIG. 3, the contact pins 20 disposed in the socket body 10 a include a terminal side contact member 21 that contacts the solder ball 1 a of the IC package 1 and a substrate side contact member that contacts the electrode 12 a of the wiring substrate 12. 22 and a spring 23 provided between the terminal side contact member 21 and the substrate side contact member 22. As shown in FIGS. 3 and 4A, the terminal-side contact member 21 is provided in the middle of the first rod-shaped portion 21a and the first rod-shaped portion 21a disposed across the upper plate 13 and the intermediate plate 14x. The first flange portion 21b. Moreover, as shown in FIG.3 and FIG.4 (B), the board | substrate side contact member 22 has the 2nd rod-shaped part 22a arrange | positioned ranging from the intermediate | middle plate 14y to the lower plate 15, and the 2nd rod-shaped part 22a. It consists of the 2nd flange part 22b provided in the middle.

  As shown in FIG. 3, the first rod-like portion 21 a of the terminal-side contact member 21 is inserted into the accommodation through hole 11 a of the floating plate 11 at a portion above the first flange portion 21 b. The portion below the first flange portion 21b is inserted through the upper through hole 13a and the intermediate through hole 14a-1 of the intermediate plate 14x.

Further, as shown in FIG. 3, the second rod-like portion 22a of the substrate-side contact member 22 is inserted into the lower through hole 15a of the lower plate 15 at a portion below the second flange portion 22b. The portion above the two flange portions 22b is inserted into the intermediate through hole 14a-2 of the intermediate plate 14y.
As shown in FIG. 4A, the first rod-shaped portion 21a has a first same diameter portion 21a-1 formed with the same diameter, and a first tapered portion 21a- formed with a taper on the side in contact with the spring 23. 2. As shown in FIG. 3, the diameter of the first same diameter portion 21 a-1 is d1, which is larger than the inner diameter X1 of the spring 23 and smaller than the outer diameter X2 of the spring 23. . And as shown in FIG. 3, the lower part side of the 1st same diameter part 21a-1 of the 1st rod-shaped part 21a contacts the upper part of the spring 23, and the 1st taper part 21a-2 of the 1st rod-shaped part 21a is, It is inserted on the upper side of the spring 23. With such a configuration, the entire portion of the terminal side contact member 21 below the first flange portion 21b is not inserted into the spring 23, so the diameter of the spring 23 can be reduced, and the contact The diameter of the entire child 20 can also be reduced. Further, on the upper portion of the first rod-shaped portion 21a that contacts the solder ball 1a of the IC package 1, there is a concave contact portion 21c that is recessed in a conical shape as shown in FIGS. It is formed and can accommodate the solder ball 1a. Furthermore, the diameter d1 of the first identical diameter portion 21a-1 of the first rod-shaped portion 21a is formed to be approximately the same size as the diameter D1 of the accommodation through hole 11a and the diameter D2 of the upper through hole 13a.

  Further, as shown in FIG. 4B, the second rod-shaped portion 22a has a second same diameter portion 22a-1 formed with the same diameter and a second tapered portion formed with a taper on the side in contact with the spring 23. 22a-2. As shown in FIG. 3, the diameter of the second same diameter portion 22 a-1 is d <b> 3 and is formed larger than the inner diameter X <b> 1 of the spring 23 and smaller than the outer diameter X <b> 2 of the spring 23. . And as shown in Drawing 3, the upper part side of the 2nd same diameter part 22a-1 of the 2nd rod-like part 22 contacts the lower part of spring 23, and the 2nd taper part 22a-2 of the 2nd rod-like part 22a, It is inserted into the lower side of the spring 23. With such a configuration, the entire portion of the board-side contact member 22 above the second flange portion 22b is not inserted into the spring 23, so the diameter of the spring 23 can be reduced, and the contact The diameter of the entire 20 can also be reduced. Further, as shown in FIGS. 3 and 4B, a concave contact portion 22c recessed in a conical shape is formed in the lower portion of the second rod-shaped portion 22a that contacts the electrode 12a of the wiring board 12. Furthermore, the diameter d3 of the second same diameter portion 22a-1 of the second rod-shaped portion 22a is formed to be approximately the same size as the diameter D4 of the lower through hole 15a.

  As shown in FIG. 3, the first flange portion 21b is disposed in the gap S1 between the upper plate 13 and the intermediate plate 14x, and has a diameter d2. Further, since the diameter d2 of the first flange portion 21b is formed larger than the diameter D2 of the upper through hole 13a of the upper plate 13, the first flange portion 21b does not pass through the upper through hole 13a. . Accordingly, the first flange portion 21 b has a function of restricting the terminal side contact member 21 from moving upward by the elastic force of the spring 23.

  Moreover, the 2nd flange part 22b is arrange | positioned in the clearance gap S2 between the intermediate | middle plate 14y and the lower side plate 15, as shown in FIG. 3, and the magnitude | size of a diameter is d4. Further, since the diameter d4 of the second flange portion 22b is formed larger than the diameter D4 of the lower through hole 15a of the lower plate 15, the second flange portion 22b passes through the lower through hole 15a. There is nothing. Therefore, the second flange portion 22 b has a function of restricting the substrate side contact member 22 from moving downward by the elastic force of the spring 23.

  Therefore, the presence of the positioning recess 31c and the concave contact portion 21c allows the solder ball 1a of the IC package 1 to be accommodated in the positioning recess 31c when the floating plate 11 is at the highest position as shown in FIG. As shown in FIG. 5B, when the floating plate 11 is at the lowest lowered position, the solder ball 1a of the IC package 1 is accommodated in the concave contact portion 21c formed on the upper portion of the contact pin 20. It has become.

  Next, the operation of the IC socket 10 according to the first embodiment of the present invention will be described.

  First, the IC package 1 is mounted on the floating plate 11 as shown in FIG. At this time, the solder ball 1a of the IC package 1 is accommodated in the positioning recess 31c formed in the head portion 31b of the positioning insertion rod 31 inserted into the accommodation through hole 11a of the floating plate 11. Further, contact pins 20 inserted into the respective through holes 11a, 13a, 14a, and 15a are arranged at the positions of the solder balls 1a in which the electrical connection between the solder balls 1a and the wiring board 12 in the IC package 1 is planned. It is installed. The contact pin 20 is in a state in which the spring 23 is extended, the first flange portion 21b is in contact with the upper plate 13 to generate a stopper function, and the second flange portion 22b is in contact with the lower plate 15. A stopper function is generated so that the spring 23 does not come out of the through holes 14a-1 and 14a-2 of the intermediate plates 14x and 14y.

  Next, as the floating plate 11 descends to the lowest position, the solder ball 1a of the IC package 1 is formed on the upper end of the terminal side contact member 21 of the contact pin 20, as shown in FIG. It is accommodated in the concave contact portion 21c. At this time, the solder ball 1 a is separated from the positioning recess 31 c of the positioning insertion rod 31.

  Therefore, the solder ball 1a of the IC package 1 is always accommodated and positioned by either the positioning recess 31c or the contact recess 21c.

  According to such an IC socket 10, the positioning member 31 having the positioning recess 31c in which the solder ball 1a of the IC package 1 is inserted and positioned is detachably provided on the floating plate 11 of the socket body 10a. Therefore, even if the position of the solder ball 1a that can be used for positioning formed in the IC package 1 is different for each IC package 1, the corresponding position on the floating plate 11 of the socket body 10a in the existing IC socket 10 The positioning recess 31c can be provided. Therefore, even when the position of the solder ball 1a that can be used for positioning formed on the IC package 1 is different for each IC package 1, it is possible to cope with it without replacing the floating plate 11 itself of the socket body 10a. .

  The floating plate 11 is formed with a plurality of receiving through holes 11a into which the contact pins 20 can be inserted, and the positioning insertion rod 31 is not inserted with the contact pins 20 among the plurality of receiving through holes 11a. And a head portion 31b provided on the upper side of the insertion portion 31a and having a positioning recess 31c. Therefore, if the positioning insertion rod 31 is disposed at a desired position among the plurality of accommodating through holes 11a formed in the floating plate 11, it is possible to integrally form the positioning portion on the floating plate 11 in advance. It is possible to use the IC socket 10 in which a positioning portion is provided at a position to be positioned. Further, when using the IC package 1 in which the position of the solder ball 1a that can be used for positioning in the IC package 1 is different, the positioning insertion rod 31 is accommodated in the accommodation through hole in accordance with the arrangement of the solder ball 1a of the IC package 1. If the position inserted into 11a is changed, it can respond.

  Further, the floating plate 11 accommodates the IC package 1 and moves up and down. When the floating plate 11 is at the highest position, the solder ball 1a of the IC package 1 is accommodated in the positioning recess 31c, and the floating plate 11 is at the highest position. When in the lowered position, the solder ball 1a of the IC package 1 is accommodated in a concave contact portion 21c formed on the top of the contact pin 20. Therefore, when the solder ball 1a of the IC package 1 and the contact pin 20 are not in contact with each other, the positioning of the solder ball 1a of the IC package 1 is performed by the positioning recess 31c. In the state in which the contact is made, the solder ball 1a of the IC package 1 can be positioned by the concave contact portion 21c formed at the upper end of the contact pin 20.

  Further, the positioning recess 31c is formed in a conical shape so that the solder ball 1a of the IC package 1 is accommodated. Therefore, the solder balls 1a of the IC package 1 can be easily accommodated by the positioning recess 31c.

In addition, according to Embodiment 1 of this invention, although the positioning insertion stick 31 comprised the positioning recessed part 31c formed in the cone shape, it is not limited to the said embodiment. As shown in FIGS. 6A and 6B, the positioning insertion rod 31 may be configured such that the conical bottom side of the positioning recess 31c is further recessed to form a recess 31d. With this configuration, even if dust or the like enters the positioning recess 31c, the dust or the like enters the recess 31d, so that the positioning recess 31c does not have a problem in housing the solder ball 1a of the IC package 1. Can do.
[Embodiment 2 of the Invention]

  The second embodiment of the present invention will be described below.

  7 to 9 show a second embodiment of the present invention. In the second embodiment of the present invention, the same members as those of the first embodiment of the present invention are denoted by the same reference numerals and the following description is omitted.

  The IC socket 110 which is an “electrical component socket” in the second embodiment of the present invention is different from the IC socket 10 in the first embodiment of the present invention in that the floating plate 11 is accommodated in the first embodiment of the present invention. In contrast to the positioning insertion rod 31 as a “positioning member” being inserted into the through hole 11a, in the second embodiment of the present invention, positioning is performed among the plurality of accommodation through holes 11a of the floating plate 11. Positioning as a “positioning member” on the floating plate 11 as shown in FIGS. 7 and 9A and 9B so that the positioning recess 32c is disposed with respect to the housing through hole 11a used for The frame 32 is provided.

  That is, in Embodiment 2 of the present invention, as shown in FIGS. 8A and 8B, the plate-like positioning frame body 32 that is a “positioning member” has an opening 32g and is formed in the floating plate 11. Appear from above. Further, at the four corners of the opening 32g, convex portions 32h projecting inward so as to cover the four corners (see FIG. 7) of the arrangement range of the contact pins 20 arranged in a substantially square shape in plan view. Is formed. A positioning recess 32c provided on the convex portion 32h on the accommodation through hole 11a of the floating plate 11 on which the contact pin 20 is not inserted, and the contact pin 20 of the plurality of accommodation through holes 11a are inserted. An insertion hole 32e through which the contact pin 20 can be inserted is formed (see FIGS. 9A and 9B).

  The action of the plate-like positioning frame 32 in the second embodiment of the present invention is substantially the same as the action of the positioning insertion portion 31 in the first embodiment of the present invention.

According to such an IC socket 110, the floating plate 11 is formed with a plurality of accommodating through holes 11 a into which the contact pins 20 can be inserted, and the plate-like positioning frame body 32 that is a “positioning member” A positioning recess 32c is provided on the accommodation through hole 11a on which the contact pin 20 is not inserted, and the contact pin 20 is inserted on the accommodation through hole 11a in which the contact pin 20 is inserted. A possible insertion hole 32e was formed. Therefore, when there are a plurality of locations where the solder balls 1a of the IC package 1 are desired to be positioned, if a plate-shaped positioning frame 32 that simultaneously stores a plurality of solder balls 1a that can be used for positioning is used, each of the receiving through A plurality of positioning recesses 32c can be provided in the floating plate 11 at a time more easily than providing the positioning insertion rod 31 in the hole 11a.
Embodiment 3 of the Invention

  The third embodiment of the present invention will be described below.

  FIG. 10 shows a third embodiment of the present invention. In the third embodiment of the present invention, the same members as those of the second embodiment of the present invention or the first embodiment of the present invention are denoted by the same reference numerals, and the following description is omitted.

  The IC socket 210 which is the “socket for electrical parts” in the third embodiment of the present invention is different from the IC socket 10 in the first embodiment of the present invention in that the positioning recess 32c is different in the second embodiment of the present invention. Whereas the back surface of the formed plate-like positioning frame 32 is formed flat, in the third embodiment of the present invention, as shown in FIGS. The insertion portion 33f to be inserted into the plurality of accommodating through holes 11a is provided on the back surface of the plate-like positioning frame 33 on which 32c is formed. The insertion portion 33f has the same configuration as the insertion portion 31a described in the first embodiment of the present invention.

  With this configuration, the positioning recess 32c in the plate-like positioning frame 33 can be more accurately arranged at a desired position on the floating plate 11.

  In the first to third embodiments of the present invention, the positioning recesses 31c and 32c have been described as having a conical shape. However, the present invention is not limited to the above-described embodiment, and a configuration having a pyramid shape is also possible.

It is a top view of the IC socket which concerns on Embodiment 1 of this invention. It is the figure which showed the positioning insertion rod which concerns on the embodiment, (A) is a side view of a positioning insertion rod, (B) is a top view of a positioning insertion rod. It is sectional drawing which shows the relationship between the contact pin which concerns on the embodiment, and several plates. It is a side view which shows the components of the contact pin which concerns on the embodiment, (A) is a side view which shows the structure of a terminal side contact member, (B) is a side view which shows the structure of a board | substrate side contact member. (C) is a side view showing the configuration of the spring. FIG. 3A is a cross-sectional view of the IC socket according to the embodiment, FIG. 3A is a cross-sectional view showing a state where the floating plate is raised, and FIG. 3B is a cross-sectional view showing a state where the floating plate is lowered. It is the figure which showed the other example of the positioning insertion rod which concerns on the embodiment, (A) is a side view which shows the other example of the positioning insertion rod, (B) is a positioning insertion rod It is a top view which shows the other example. It is a top view of the IC socket which concerns on Embodiment 2 of this invention. The structure of the plate-shaped frame which concerns on the embodiment is shown, (A) is a top view of a plate-shaped frame, (B) is a partially expanded plan view of (A). FIG. 3A is a cross-sectional view of the IC socket according to the embodiment, FIG. 3A is a cross-sectional view showing a state where the floating plate is raised, and FIG. 3B is a cross-sectional view showing a state where the floating plate is lowered. It is sectional drawing of the IC socket which concerns on Embodiment 3 of this invention, (A) is sectional drawing which shows the state which the floating plate raised, (B) is sectional drawing which shows the state which the floating plate fell It is.

Explanation of symbols

1 IC package (electrical parts)
1b terminal
10 IC socket (socket for electrical parts)
10a Socket body
11 Floating plate (container)
12 Wiring board
13 Upper plate
14 Intermediate plate
15 Lower plate
20 Contact pin
21 Contact member on the terminal side
21a First rod
21b First flange
21c Concave contact
22 Board side contact member
22a Second rod
22b Second flange
22c Concave contact
23 Spring
31 Positioning and insertion rod
31a Insertion part
31b head
31c Positioning recess
31d recess
32 Positioning frame
32c Positioning recess
32e insertion hole
33 Positioning frame
33f Insertion part

Claims (7)

The socket for an electrical component is provided with an accommodating portion for accommodating an electrical component formed by projecting a plurality of terminals, and provided with a plurality of contact pins that can be attached to and detached from the terminal of the electrical component. And
A socket for electrical parts, wherein a positioning member having a positioning recess for positioning by inserting the terminal of the electrical part is detachably provided in the housing part. A plurality of through holes into which the contact pins can be inserted are formed in the housing portion,
The positioning member includes an insertion portion to be inserted into the plurality of through holes into which the contact pins are not inserted, and a head provided on the upper side of the insertion portion to form the positioning recess. The socket for an electrical component according to claim 1, comprising: a portion. A plurality of through holes into which the contact pins can be inserted are formed in the housing portion,
The positioning member is a plate-shaped frame, and the plate-shaped frame is provided with the positioning recesses on the plurality of through-holes through which the contact pins are not inserted, 2. The electrical component socket according to claim 1, wherein an insertion hole into which the contact pin can be inserted is formed on a through hole in which the contact pin is inserted.   4. The electrical component socket according to claim 3, wherein the plate-like frame body is provided with an insertion portion to be inserted into the plurality of through holes below the positioning recess.   The accommodating portion is a floating plate that accommodates the electrical component and moves up and down. When the floating plate is at the highest position, the terminal of the electrical component is accommodated in the positioning recess, and the floating plate is 5. The electric device according to claim 1, wherein the terminal of the electric component is accommodated in a concave contact portion formed on an upper portion of the contact pin when the electric component is in the lowest position. Socket for parts.   The electrical component socket according to any one of claims 1 to 5, wherein the positioning recess is formed in a conical shape or a pyramid shape so that a terminal of the electrical component is accommodated.   The electrical component socket according to any one of claims 1 to 6, wherein the positioning recess has a recess formed by further recessing the bottom of the conical shape or the pyramid shape.

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