KR101469202B1

KR101469202B1 - Socket module for testing semiconductor package

Info

Publication number: KR101469202B1
Application number: KR20130091151A
Authority: KR
Inventors: 박인성; 윤준호; 우병훈
Original assignee: 주식회사 티에프이
Priority date: 2013-07-31
Filing date: 2013-07-31
Publication date: 2014-12-10

Abstract

The present invention relates to a floating unit comprising a hollow body; An upper layer disposed to cover one end of both open ends of the body and having a first connection layer in which conductive powder is dispersed; And a lower layer disposed below the upper layer and having a second connection layer having a conductive pillar electrically connected to the conductive powder.

Description

[0001] SOCKET MODULE FOR TESTING SEMICONDUCTOR PACKAGE [0002]

The present invention relates to a socket module for testing semiconductor packages.

In general, a semiconductor package completed by a semiconductor manufacturing process is checked if the operating characteristics are properly implemented through a test (inspection) process, and then shipped when it is classified as a good product.

In this inspection process, the semiconductor package is electrically connected to the inspection circuit board while being inserted into the socket module. Specifically, the balls of the semiconductor package are electrically connected through the electrodes of the circuit board and the conductive members of the socket module. Under this connection, when the power supply is applied to the semiconductor package from the circuit board, whether the semiconductor package is normally operated or not is judged from the abnormality of the power supply by the semiconductor package.

During repetitive stomach inspection, the conductive member is damaged and deformed by the balls of the semiconductor package. Thereby, the upper conductive member must be replaced at regular intervals during the use of the socket module, and the resulting cost is a burden.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket module for testing a semiconductor package capable of reducing the replacement cost of a portion for electrically connecting a semiconductor package and an inspection circuit board.

According to an aspect of the present invention, there is provided a socket module for testing a semiconductor package, comprising: a floating unit having a hollow body; An upper layer disposed to cover one end of both open ends of the body and having a first connection layer in which conductive powder is dispersed; And a lower layer disposed below the upper layer and having a second connection layer having a conductive pillar electrically connected to the conductive powder.

The upper layer may further include a first frame coupled to a lower side of the first connection layer.

Here, the first frame may be formed in a ring shape, and may be a receiving space opened toward the lower layer together with the first connecting layer.

Here, the lower layer may further include a second frame formed to surround the second connection layer, the second frame allowing the second connection layer to be inserted into the accommodation space.

Here, the second frame may include an inner frame part corresponding to a height of the second connection layer and accommodated in the accommodation space; And an outer frame portion having a height lower than the inner frame and corresponding to the first frame.

Here, the upper layer includes a first through hole and the lower layer includes a second through hole, and the floating unit may include an alignment protrusion passing through the first through hole and the second through hole. have.

The apparatus may further include a housing for accommodating the floating unit, the upper layer, and the lower layer.

Here, the housing may further include alignment holes into which the alignment protrusions are inserted.

Here, the thickness of the first connection layer may be smaller than the thickness of the second connection layer.

The lower layer may further include a metal terminal disposed on the conductive pillar and having a surface coinciding with a surface of the remaining portion of the second connection layer.

According to another aspect of the present invention, there is provided a socket module for testing a semiconductor package, comprising: a housing having a receiving portion; A lower layer disposed in the accommodating portion and having a ring-shaped second frame and a second rubber layer protruding upwardly from the second frame and having conductive pillars; An upper layer disposed on the lower layer and having a ring-shaped first frame for receiving the second rubber layer, and a first rubber layer disposed on the first frame so as to be in contact with the second rubber layer and having a conductive powder dispersed therein, ; And a floating unit having a ring-shaped body disposed on the upper layer.

Here, the housing may include an alignment hole disposed around the receptacle, the lower layer may include a second through-hole formed in the second frame, and the upper layer may be formed in the first frame And the floating unit may include alignment protrusions provided on the body and inserted into the alignment holes through the first through holes and the second through holes.

According to the socket module for testing a semiconductor package according to the present invention configured as described above, it is possible to reduce the replacement cost of a portion electrically connecting the semiconductor package and the inspection circuit board.

1 is an exploded perspective view of a socket module 100 for testing a semiconductor package according to an embodiment of the present invention.
2 is a perspective view showing the decomposition state of the conductive layer 130 together with the floating unit 110 of FIG.
3 is a cross-sectional view of a portion of the conductive layer 130 of FIG.

Hereinafter, a socket module for testing a semiconductor package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

1 is an exploded perspective view of a socket module 100 for testing a semiconductor package according to an embodiment of the present invention.

Referring to this figure, a socket module 100 for testing a semiconductor package may include a floating unit 110 and a conductive layer 130, as well as a housing 150.

The floating unit 110 has a hollow body. The body is generally in the form of a square ring, and its hollow portion 111 may be in the form of open at both ends. The body may include a conductive layer 130 and alignment protrusions 113 extending in a direction toward the housing 150.

The conductive layer 130 is disposed so as to close one end of the open both ends of the floating unit 110. The conductive layer 130 may be formed in a rectangular plate shape as a whole. The size of the conductive layer 130 may correspond to the size of the floating unit 110.

The housing 150 is formed to receive the floating unit 110 and the conductive layer 130. For this purpose, the housing 150 may have a receiving portion 151 with an open upper portion. In addition, the housing 150 may be provided with an alignment hole 153 for receiving the alignment protrusion 113. An electrode 155 connected to the inspection circuit board may be formed on the bottom of the housing 150.

The conductive layer 130 will be described in detail with reference to FIGS. 2 and 3. FIG.

2 is a perspective view showing a decomposition state of the conductive layer 130 together with the floating unit 110 of FIG.

Referring to FIG. 1, the conductive layer 130 may include an upper layer 131 and a lower layer 141.

The upper layer 131 may include a first connecting layer 133 and a first frame 135.

The first connection layer 133 may include a resilient base material and conductive powder 134 (FIG. 3) dispersed within the base material. The base material may be, for example, rubber. In this case, the first connecting layer 133 may be referred to as a first rubber layer.

The first frame 135 has a generally rectangular ring shape. The first frame 135 supports the first connection layer 133 from the lower side. A first through hole 137 may be formed in the first frame 135.

The lower layer 141 is disposed below the upper layer 131. The lower layer 141 may have substantially the same size as the upper layer 131.

The lower layer 141 may specifically include a second connection layer 143 and a second frame 145. [

The second connection layer 143 may be formed of a base material, for example, rubber, as a flexible base material like the first connection layer 133. The conductive pillars 144a (FIG. 3) may be regularly arranged inside the base material.

The second frame 145 is formed so as to surround the second connection layer 143. The second frame 145 has a generally rectangular ring shape. The second frame 145 can be divided into an inner frame portion 146 having a height corresponding to the second connecting layer 143 and an outer frame portion 147 having a lower height than the inner frame portion 146 have. A second through hole 149 corresponding to the first through hole 137 may be formed in the outer frame portion 147.

A method of coupling the upper layer 131 and the lower layer 141 will be described with reference to FIG.

3 is a cross-sectional view of a portion of the conductive layer 130 of FIG.

Referring to this figure, the first connection layer 133 of the upper layer 131 is supported by the first frame 135 disposed on the lower side thereof. Thereby, the first connecting layer 133 and the first frame 135 form a receiving space in which the lower side is opened.

The second connection layer 143 of the lower layer 141 is formed to protrude from the second frame 145. Thereby, the second connecting layer 143 is inserted into the receiving space. With this coupling method, alignment between the upper layer 131 and the lower layer 141 can be stably maintained.

A metal terminal 144b may be disposed above the conductive pillar 144a of the lower layer 141. [ The metal terminal 144b may have a surface that is flush with the surface of the remaining portion of the second connecting layer 143. [ Thereby, contact between the powder 134 of the first connection layer 133 and the metal terminal 144b can be more stably maintained.

The thickness of the upper layer 131 may be thinner than that of the lower layer 141. Specifically, the upper layer 131 protects the lower layer 141, and the thickness of the upper layer 131 may be about 1/5 of the thickness of the lower layer 141.

According to this configuration, the upper layer 131 and the lower layer 141 are also coupled to the floating unit 110 while being coupled to each other. At this time, the alignment protrusion 113 of the floating unit 110 passes through the first through hole 137 of the upper layer 131 and the second through hole 149 of the lower layer 141. The protruding end of the alignment protrusion 113 is finally inserted into the alignment hole 153 of the housing 150. Thereby, coupling between the floating unit 110 and the upper layer 131, the lower layer 141, and further the lower layer 141 can be performed in a simple manner. Also, the operation of releasing the upper coupling and replacing the upper layer 131 can be performed easily without any special tool.

For testing the semiconductor package, the semiconductor package may be disposed in the receiving portion 111 of the floating unit 110. [ At this time, the ball of the semiconductor package comes into contact with the conductive layer 130. Specifically, the ball contacts the powder 134 of the upper layer 131 and is connected to the electrode 155 of the housing 150 through the metal terminal 144b and the column 144a. Here, the electrode 155 of the housing 150 is electrically connected to the inspection circuit board.

During use of the socket module 100, only the upper layer 131 may be replaced and the lower layer 141 may be used for a longer period of time. Also, since the upper layer 131 is less expensive than the lower layer 141, the overall maintenance cost of the socket module 100 can be reduced.

The socket module for testing a semiconductor package as described above is not limited to the configuration and operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: Socket module for semiconductor package test 110: Floating unit
130: conductive layer 131: upper layer
133: first connection layer 135: first frame
141: lower layer 143: second connection layer
145: second frame 150: housing
151:

Claims

A floating unit having a hollow body;
An upper layer disposed to cover one end of both open ends of the body and having a first connection layer in which conductive powder is dispersed; And
And a lower layer disposed below the upper layer and including a second connection layer having a conductive pillar electrically connected to the conductive powder,
Wherein a thickness of the first connecting layer is thinner than a thickness of the second connecting layer.

The method according to claim 1,
Wherein the upper layer comprises:
Further comprising a first frame coupled to a lower side of the first connection layer.

3. The method of claim 2,
Wherein the first frame is formed in a ring shape to form a receiving space open toward the lower layer together with the first connecting layer.

The method of claim 3,
Wherein the lower layer comprises:
Further comprising a second frame formed to surround the second connection layer, the second frame allowing the second connection layer to be inserted into the accommodation space.

5. The method of claim 4,
Wherein the second frame comprises:
An inner frame part corresponding to a height of the second connection layer and accommodated in the accommodation space; And
And an outer frame portion having a height lower than the inner frame and corresponding to the first frame.

The method according to claim 1,
Wherein the upper layer has a first through hole and the lower layer has a second through hole,
Wherein the floating unit includes alignment protrusions passing through the first through holes and the second through holes.

The method according to claim 6,
Further comprising a housing for receiving the floating unit, the upper layer, and the lower layer.

8. The method of claim 7,
Wherein the housing further comprises an alignment hole into which the alignment protrusion is inserted.

delete

The method according to claim 1,
Wherein the lower layer comprises:
Further comprising a metal terminal disposed on the conductive pillar and having a surface coinciding with a surface of the remaining portion of the second connecting layer.

A housing having a receiving portion;
A lower layer disposed in the accommodating portion and having a ring-shaped second frame and a second rubber layer protruding upwardly from the second frame and having conductive pillars;
An upper layer disposed on the lower layer and having a ring-shaped first frame for receiving the second rubber layer, and a first rubber layer disposed on the first frame so as to be in contact with the second rubber layer and having a conductive powder dispersed therein, ; And
And a floating body having a ring-shaped body disposed on the upper layer.

12. The method of claim 11,
The housing has an alignment hole disposed around the accommodating portion,
Wherein the lower layer has a second through hole formed in the second frame,
Wherein the upper layer has a first through hole formed in the first frame,
Wherein the floating unit includes alignment protrusions provided on the body and inserted through the first through holes and the second through holes to be inserted into the alignment holes.