JP2008151551A - Contact jig and fixture for inspecting semiconductor device and method for inspecting semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact jig etc., for inspecting semiconductor device capable of switching the measuring path of the semiconductor device capable of securing the mounting area of the circuit substrate of the measuring device for inspection, capable of simultaneous measurement even in a measuring device in which the number of channels is limited. <P>SOLUTION: A cylindrical body 18 provided with a conductive region 18c and an insulated region 18b, a spring 17 arranged in the cylindrical body 18, two sliders 15 and 16 arranged on both sides of the spring 17 sliding in the cylindrical body 18 with sliding parts 15a and 16a and contact parts 15b and 16b freely come out of the cylinder body 18. The conductive region 18c and the insulative region 18b are separately formed in the cylindrical body 18 to the sliding direction of the sliding part 15a of one contact piece 15. Depending on the stroke of the contact piece depressed by the external terminal a contact jig 10 is constituted capable of switching between the conductive state and the insulative state. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a contact jig, an inspection jig apparatus, and an inspection method used when inspecting electrical characteristics of a semiconductor device.

  As shown in FIG. 7, when inspecting the electrical characteristics of the semiconductor device 1, a contact jig 9 for inspecting the semiconductor device that makes electrical contact with the solder balls 2 that are external terminals of the semiconductor device 1 is used. . Here, FIG. 7 is a cross-sectional view of an inspection jig apparatus provided with a conventional contact jig 9. The contact jig 9 incorporates a spring 17 in a cylindrical body 18 as a sliding frame body made of a conductor, and slide parts 15a, 16a and contact parts 15b, 16b above and below the spring 17, respectively. Are provided with contacts (hereinafter referred to as plungers) 15 and 16. The upper plunger 15 has a structure in which the solder ball 2, which is an external terminal of the semiconductor device 1, is in contact with the contact portion 15 b, and the lower plunger 16 is a spring of a spring 17 that serves as an electrode terminal of a substrate of a measuring apparatus that performs inspection. It is a structure which contacts in the contact part 16b using a pressure (patent document 1 grade).

  Then, by pressing the upper surface of the semiconductor device 1 with a separately provided contact pusher jig (not shown), the upper plan of the contact jig 9 disposed at a position corresponding to the solder ball 2 of the semiconductor device 1. The jar 15 is electrically connected to the solder ball 2 of the semiconductor device 1. The upper plunger 15 is in electrical contact with the inner surface of a cylindrical body 18 made of a conductor, and is arranged in contact with both end sides of the spring 17, and the plungers 15 and 16 are cylindrical bodies of the conductor. The semiconductor device 1 and the measuring apparatus are connected to each other with 18 as an electrical path.

In FIG. 7, reference numeral 20 denotes a holding body that holds the contact jig 9 therein, and the contact jig 9 is arranged in such a manner that it is sandwiched and held between the upper lid 21 and the base 22 by the holding body 20. Established. A through hole 23 is formed in the holding body 20 corresponding to the solder ball 2 of the semiconductor device 1, and a contact jig 9 is installed corresponding to the through hole 23 of the holding body 20.
JP 2001-208793 A

  In the inspection of semiconductor devices equipped with complex functions such as analog circuits, many electronic components with test functions such as BOST (Built Out Self Test) on the circuit board of the measuring device that performs the inspection, analog circuits, etc. Electronic components such as an electrical relay that switches the measurement path of the semiconductor device when performing the inspection are mounted. Furthermore, in the inspection process for measuring a large number of semiconductor devices at the same time, when the number of channels of the measuring device is limited in order to reduce the test cost, a plurality of terminals to be measured share one channel. Electronic components such as an electrical relay that switches the conduction path are required.

  However, the above-described conventional contact jig 9 for semiconductor device inspection shown in FIG. 7 has a structure in which the upper plunger 15 and the lower plunger 16 are always electrically connected via the cylindrical body 18. When it is necessary to switch the conduction path, it is impossible to mount electronic components that increase with the increase in the number of measured devices (the number of semiconductor devices to be measured simultaneously) on the circuit board for inspection. Had a problem that could not be implemented.

  The present invention solves the above-mentioned conventional problems, and can switch the measurement path of a semiconductor device, secure the mounting area of the circuit board of the measurement apparatus for inspection, and the measurement apparatus with a limited number of channels. Another object of the present invention is to provide a semiconductor device inspection contact jig, an inspection jig apparatus and a semiconductor device inspection method capable of measuring a large number of semiconductor devices.

  In order to solve the above problems, a contact jig for inspecting a semiconductor device according to claim 1 of the present invention includes a sliding frame body having a conductive region and an insulating region, and the sliding frame body. Two contacts that are arranged on both ends of the spring and have contact portions that slide inside the sliding frame with the sliding portions and that can freely move out of the sliding frame. A contact jig for semiconductor device inspection, wherein the conductive region and the insulating region in the sliding frame are formed separately from each other with respect to the sliding direction of the sliding portion of one contactor. The region where the sliding portion of the one contactor comes into contact can be switched between the conductive region and the insulating region according to the stroke amount of the external terminal of the semiconductor device pushing down the one contactor. It is characterized by that.

  With this configuration, according to the stroke amount by which the external terminal of the semiconductor device pushes down the contact, the one contact can be switched between a conductive state in which the other contact is conductive and an insulating state in which the other contact is not conductive. it can.

  Further, in the contact jig for inspecting a semiconductor device according to claim 2 of the present invention, the contact portion of one contact is in contact with the external terminal of the semiconductor device and is electrically connected, and the contact of the other contact is made. The part is in contact with and electrically connected to the measuring device.

  With this configuration, the external terminal of the semiconductor device and the measuring device can be switched between the conductive state and the insulating state in accordance with the stroke amount by which the external terminal of the semiconductor device pushes down the contact.

The contact jig for inspecting a semiconductor device according to claim 3 of the present invention is characterized in that the other contact is fixed to the sliding frame.
According to a fourth aspect of the present invention, there is provided a contact jig for inspecting a semiconductor device, wherein each contactor and an end of a spring are insulated.

  Further, in the contact jig for inspecting a semiconductor device according to claim 5 of the present invention, the main body portion of the sliding frame body is formed of a cylindrical conductor, and the inner wall surface of the main body portion of the cylindrical body, A conductive region provided with a conductive material and an insulating region provided with an insulating material are formed separately.

  Moreover, the jig | tool apparatus for semiconductor device inspection of Claim 6 of this invention hold | maintains the contact jig for semiconductor device inspection of any one of Claims 1-5, and this contact jig. And a through hole is formed in the holding body corresponding to the external terminal of the semiconductor device, and a contact portion of one of the contacts protruding from the through hole is formed corresponding to the through hole of the semiconductor device. The contact jig for contacting an external terminal is disposed.

  The semiconductor device inspection jig apparatus according to claim 7 of the present invention is provided with a sliding communication hole having a conductive region and an insulating region at a position corresponding to the external terminal of the semiconductor device. In the communication hole, a spring and two contacts provided on both ends of the spring and slidable in the conductive region and the insulating region are arranged.

  In addition, a jig device for inspecting a semiconductor device according to claim 8 of the present invention has a plurality of electrically independent conductive regions in a sliding communication hole, and the respective conductive regions are different from each other. The conductive region that is in contact with the slider can be switched by the stroke amount that the external terminal of the semiconductor device pushes down the contact portion.

  A semiconductor device inspection method according to claim 9 of the present invention uses the jig device for semiconductor device inspection according to claim 6, claim 7 or claim 8, and the external terminal of the semiconductor device is one of the terminals. By changing the stroke amount for depressing the contact, all or some of the external terminals of the semiconductor device electrically connected to the measuring apparatus are switched to some external terminals for measurement.

  As described above, according to the present invention, since the conduction path to the measuring apparatus can be switched by the contact jig itself for inspecting the semiconductor device, the conduction path to the measuring apparatus when inspecting an analog circuit or the like is set. Electronic parts such as electrical relays to be switched can be reduced, and an area for mounting other electronic parts on the circuit board of the measuring apparatus can be secured. Also, when testing with a measuring device with a limited number of channels to reduce test costs, the number of electronic components such as electrical relays that switch the measurement path for multiple terminals to be shared to share one channel is reduced. It is possible to measure a large number of semiconductor devices at the same time.

  Hereinafter, a semiconductor device inspection contact jig, a jig apparatus including the contact jig, and a semiconductor device inspection method according to an embodiment of the present invention will be specifically described with reference to the drawings.

  A configuration of a contact jig for semiconductor device inspection (hereinafter simply referred to as a contact jig) according to the present embodiment will be described with reference to FIGS. 1 to 6 are sectional views of a jig apparatus provided with the contact jigs of the first, second, and third embodiments, and are configured to be able to electrically switch a semiconductor device to be inspected in the contact jig. ing. Note that components having the same function are denoted by the same reference numerals in the conventional contact jig or between the embodiments.

(Embodiment 1)
As shown in FIG. 1 and FIG. 2, an IC socket as an inspection jig apparatus includes a contact jig 10 for semiconductor device inspection according to the first embodiment and a holding body 20 that holds the contact jig 10. Is configured. A through hole 23 of the holding body 20 is formed corresponding to the solder ball 2 as an external terminal of the semiconductor device 1, and the contact jig 10 is installed corresponding to the through hole 23 of the holding body 20.

  The contact jig 10 is disposed on a cylindrical tubular body 18 as a sliding frame body, a spring 17 disposed in the tubular body 18, and both ends (upper side and lower side) of the spring 17. The upper plunger 15 and the lower plunger 16 which are two upper and lower contacts are formed. That is, in the cylindrical body 18, the upper plunger 15 is disposed on the upper side, the lower plunger 16 is disposed on the lower side, and the spring 17 is accommodated between these plungers 15 and 16. . The upper plunger 15 includes a sliding portion 15 a that can slide in the cylindrical body 18 and a contact portion 15 b that contacts the solder ball 2. The lower plunger 16 includes a sliding portion 16a that can slide in the cylindrical body 18, and a contact portion 16b that is connected to a measuring device that performs inspection. These plungers 15 and 16 are each provided with an insulating portion 19 on the surface that contacts both ends of the spring 17, and the portions other than the insulating portion 19 are made of a conductive material.

  The contact jig 10 is held in a posture in which the cylindrical body 18 is sandwiched from above and below by an upper lid 21 and a base 22 of a holding body 20 as a holding body. The contact portion 15 b of the upper plunger 15 protrudes through a through hole 23 formed in the upper lid 21. Further, the contact portion 16 b of the lower plunger 16 protrudes through a hole 22 a provided in the base 22. Reference numerals 24 and 25 denote vertical frames of the holding body 20.

  In the present embodiment, the cylindrical body 18 is composed of an insulating region 18b and a conductive region 18c on the inner wall surface portion of the main body portion 18a made of a conductor (for example, iron) where the sliding portions 15a and 15a come into contact. Are formed separately with respect to the sliding direction of the sliding portions 15a and 16a of the plungers 15 and 16. In this embodiment, the inner wall surface portion of the cylindrical body 18 includes, for example, an insulating region 18b composed of a region closer to the upper side (closer to the side where the semiconductor device 1 is disposed) and a lower portion (a measuring device is disposed). The insulating region 18b is formed by applying an insulating material (for example, anodized) to the inner wall surface, and the conductive region 18c is formed by applying the conductive material (for example, gold) to the inner wall surface. It is configured by applying to. In a steady state, the sliding portions 15 a and 16 a of the plungers 15 and 16 are pressed against the upper side or the lower side of the cylindrical body 18 by the urging force of the spring 17. In addition, the area | region where the sliding part 16a of the lower plunger 16 can move the inside of the cylindrical body 18 is comprised so that it may always become the electrically conductive area | region 18c. In this embodiment, the cylindrical body 18 is configured to have an upper surface portion and a lower surface bottom portion, and through-holes through which the contact portions 15b, 16b of the plungers 15, 16 are inserted are formed. .

  In the above configuration, the semiconductor device inspection method of the first embodiment is as follows. As shown in FIG. 1 and FIG. 2, the upper surface of the semiconductor device 1 is arranged to be pressurized by a separately provided contact pusher jig (not shown). As shown in FIG. 1, in a state where the upper plunger 15 is pushed down by a small amount (for example, several hundred μm), the sliding portion 15a of the upper plunger 15 is located in the insulating region 18b in the cylindrical body 18, and this In this case, since the upper plunger 15 cannot electrically secure a conduction path with the cylindrical body 18, the semiconductor ball 2, which is an external terminal of the semiconductor device 1, and the electrode terminal on the substrate of the measuring apparatus are in an insulated state. .

  On the other hand, as shown in FIG. 2, when the upper plunger 15 is further pushed down via the semiconductor device 1 by the contact pusher jig, the sliding portion 15a of the upper plunger 15 is positioned in the conductive region 18c, The sliding portion 15a of the upper plunger 15 is in electrical contact within the cylindrical body 18, and a conduction path to the lower plunger 16 via the main body portion 18a and the conductive region 18c of the cylindrical body 18 which is a conductor. Can be secured. Thereby, the semiconductor ball 2 which is the external terminal of the semiconductor device 1 and the electrode terminal on the substrate of the measuring apparatus are in a conductive state.

  1 and 2 show a case where the insulating region 18b is formed in the upper half of the inner wall surface of the cylindrical body 18 and the conductive region 18c is formed in the lower half, and the insulating region 18b and the conductive region 18 are shown. Is divided into two parts with substantially the same area (simply the same shape), but the present invention is not limited to this. In the region where the sliding portion 15a of the upper plunger 15 moves in the cylindrical body 18 in the cylindrical body 18 (main body portion 18a), a plurality of (for example, up and down directions in this embodiment) (for example, the vertical direction). It is also possible to divide the region into three or more regions (similar to a belt-like shape in the circumferential direction) and to have a structure having the conductive region 18c and the insulating region 18b in various combinations. It is. Thereby, the semiconductor ball 2 which is the external terminal of the semiconductor device 1 and the electrode terminal on the substrate of the measuring device can be individually switched to the conductive state or the insulating state according to the position (stroke amount) of the upper plunger 15. In addition, electronic components such as relays on the inspection circuit board that have been necessary in the past can be reduced.

(Embodiment 2)
3 and 4 are cross-sectional views for explaining the contact jig 10 according to Embodiment 2 of the present invention and the inspection jig apparatus (IC socket) provided with the contact jig 10. FIG. As shown in FIGS. 3 and 4, in the second embodiment, the entire cylindrical body 18 of the contact jig 10 is divided into an insulating region 18 b and a conductive region 18 c vertically in two. The insulating region 18b is made of an insulating material, the conductive region 18c is made of a conductive material, and these materials are joined in a cylindrical shape in the vertical direction. The sliding portion 15a of the upper plunger 15 and the sliding portion 16a of the lower plunger 16 connect the spring 17 in the sliding communication hole 26 in which the hole space and the hole space of the conductive region 18c following the hole space communicate with each other. It is set as the structure which goes up and down via. The other configuration is the same as that of the first embodiment.

  In the second embodiment, the cylindrical body 18 has a bottomless cylindrical shape having no upper surface portion or lower surface bottom portion, and the upper lid 21 moves the sliding portion 15a of the upper plunger 15 upward. The range is restricted, and the base 22 restricts the downward movement range of the sliding portion 16a of the lower plunger 16, but is not limited thereto. Further, in this embodiment, the case where the area of the insulating region 18b (that is, the size in the sliding direction is opposed to the insulating region 18b) is slightly larger than that of the insulating region 18b is illustrated, but the present invention is not limited to this. .

  Also in the above configuration, by pressing the upper surface of the semiconductor device 1 with a separately provided contact pusher jig (not shown), the upper plunger 15 is only a small amount (for example, several hundred μm) as shown in FIG. When not pushed down, the sliding portion 15a of the upper plunger 15 is positioned in the insulating region 18b, and in this case, the upper plunger 15 cannot electrically secure a conduction path with the cylindrical body 18, so that the semiconductor The semiconductor ball 2 which is an external terminal of the device 1 and the electrode terminal on the substrate of the measuring apparatus are in an insulated state.

  On the other hand, as shown in FIG. 4, when the upper plunger 15 is further pushed down via the semiconductor device 1 by the contact pusher jig, the sliding portion 15a of the upper plunger 15 is located in the conductive region 18c, The sliding portion 15a of the upper plunger 15 is in electrical contact within the cylindrical body 18, and a conduction path to the lower plunger 16 via the main body portion 18a and the conductive region 18c of the cylindrical body 18 which is a conductor. Can be secured. Thereby, the semiconductor ball 2 which is the external terminal of the semiconductor device 1 and the electrode terminal on the substrate of the measuring apparatus are in a conductive state.

  In the second embodiment, the sliding portion 15a of the upper plunger 15 in the cylindrical body 18 of the contact jig 10 is divided into a plurality of regions with respect to the sliding direction within a range in which the sliding portion 15a slides. Thus, a structure having the conductive region 18c and the insulating region 18b in various combinations is obtained, whereby the semiconductor ball 2 which is the external terminal of the semiconductor device 1 and the electrode terminal on the substrate of the measuring apparatus are connected to the position of the upper plunger 15. Depending on (the stroke amount in the sliding communication hole 26), it is possible to individually switch to a conductive state or an insulating state, and it is possible to reduce electronic components such as a relay on the inspection circuit board, which has been conventionally required.

(Embodiment 3)
5 and 6 are cross-sectional views for explaining a contact jig 10 according to Embodiment 3 of the present invention and an inspection jig apparatus (IC socket) provided with the contact jig 10. FIG.

  As shown in FIGS. 5 and 6, even in the third embodiment, an inspection jig apparatus includes a contact jig 10 for semiconductor device inspection and a holding body 20 as a holding body for holding the contact jig 10. An IC socket is configured. A through hole 23 of the holding body 20 is formed corresponding to the solder ball 2 as an external terminal of the semiconductor device 1, and the contact jig 10 is installed corresponding to the through hole 23 of the holding body 20.

  The contact jig 10 includes a cylindrical tubular body 18 as a sliding frame body that is vertically divided into an upper conductive region 18g and a lower conductive region 18f via an annular insulating portion 31, and a cylindrical shape. A spring 17 disposed in the body 18 and an upper plunger 15 and a lower plunger 16 which are two upper and lower contacts disposed on both ends (upper side and lower side) of the spring 17 are provided. In addition to this, an external terminal 34 connected to the upper conductive region 18g of the cylindrical body 18 via a conduction path 32 is provided.

  Specifically, the cylindrical body 18 is configured such that the entire cylindrical body 18 is divided into an upper conductive region 18g and a lower conductive region 18f, each of which is individually formed of a conductive material. These members are joined in a cylindrical shape with respect to the vertical direction via the insulating portion 31 formed in the above. That is, the upper conductive region 18g and the lower conductive region 18f are configured to be electrically independent through the insulating portion 31. The sliding portion 15a of the upper plunger 15 and the lower plan are formed in the sliding communication hole 13 in which the hole portion of the upper conductive region 18g, the hole portion of the insulating portion 31 and the hole portion of the lower conductive region 18f communicate with each other. The sliding portion 16 a of the jar 16 can be moved up and down via a spring 17. The insulating portion 31 is configured by applying an insulating material (for example, anodized) to a base material, and the conductive regions 18a and 18b have a structure in which a conductive material (for example, gold) is applied to the base material (conductive material is desirable). However, this is not a limitation.

  Furthermore, the external terminal 34 connected to the upper conductive region 18g of the cylindrical body 18 via the conduction path 32 is an auxiliary plan as an auxiliary contact via a spring 36 in the second cylindrical body 35 made of a conductive material. The auxiliary plunger 37 includes a sliding portion 37a that can slide in the second cylindrical body 35 and a contact portion 37b that is connected to a measuring device that performs inspection.

Here, the electrode terminal on the substrate of the measuring device to which the contact portion 16b of the lower plunger 16 contacts is different from the electrode terminal on the substrate of the measuring device to which the external terminal 34 contacts.
In the above configuration, by pressing the upper surface of the semiconductor device 1 with a separately provided contact pusher jig (not shown), the upper plunger 15 is pushed down by a small amount (for example, several hundred μm) as shown in FIG. In the non-connected state, the sliding portion 15a of the upper plunger 15 is located in contact with the upper conductive region 18g, and in this case, is electrically connected to the external terminal 34 connected to the upper conductive region 18g via the conductive path 32. Then, the electrode terminal on the substrate of the measuring apparatus where the external terminal 34 is in contact with the semiconductor ball 2 which is the external terminal of the semiconductor device 1 is in a conductive state. Since the upper plunger 15 does not conduct to the lower conductive region 18f, the upper plunger 15 is insulated from the electrode terminals on the substrate of the measuring device that are in contact with the lower plunger 16.

  Further, when the upper plunger 15 is further pushed down via the semiconductor device 1 by the contact pusher jig to be in a state as shown in FIG. 6, the sliding portion 15a of the upper plunger 15 is positioned in the lower conductive region 18f. The sliding portion 15a of the upper plunger 15 is in electrical contact with the lower conductive region 18f, and a conduction path to the lower plunger 16 can be secured via the lower conductive region 18f, which is a conductor. The semiconductor ball 2 which is an external terminal of the device 1 and the electrode terminal on the substrate of the measuring apparatus are in a conductive state. Since the upper plunger 15 does not conduct to the upper conductive region 18g, the upper plunger 15 is insulated from the electrode terminal on the substrate of the measuring device where the external terminal 34 is in contact.

  Thereby, the individual conductive regions 18g and 18f to be conducted are switched with respect to the semiconductor ball 2 which is an external terminal of the semiconductor device 1 in accordance with the position of the upper plunger 15 (the stroke amount in the sliding communication hole 26). As a result, the individual electrode terminals on the substrate of the measuring device that conducts can be switched, and electronic components such as relays on the inspection circuit board that have been conventionally required can be reduced.

  In the third embodiment, the sliding portion 15a of the upper plunger 15 in the cylindrical body 18 of the contact jig 10 is divided into a plurality of regions with respect to the sliding direction within a range in which the sliding portion 15a slides. Thus, a structure having a plurality of conductive regions can be selected in various combinations, whereby a semiconductor ball 2 that is an external terminal of the semiconductor device 1 and a plurality of types of electrode terminals on the substrate of the measuring apparatus are connected to the upper plan. The jar 15 can be switched in accordance with the position of the jar 15 (the stroke amount in the sliding communication hole 26). Furthermore, the contact portion 16b of the lower plunger 16 and the external terminal 34 are brought into contact with separate measuring devices. Thus, the measuring device itself can be switched.

  In the first to third embodiments, the lower plunger 16 is shown to be slidable. However, the present invention is not limited to this, and any structure that can satisfactorily contact the measuring device side is possible. For example, the cylindrical body 18 may be fixed.

  In the above embodiments, the case where the sliding frame body is the cylindrical tubular body 18 is described. In this case, the upper plunger 15 and the lower plunger 16 are slid well on the entire circumference. Although it has the advantage that each sliding part 15a, 16a can be satisfactorily brought into contact with the entire circumference while being able to guide in the moving direction, it is not limited to this, and a predetermined portion (at least a part in the circumferential direction) with respect to the sliding direction It is also possible to adopt a shape that can be contacted.

  According to the contact jig for semiconductor device inspection of the present invention, and the inspection jig apparatus and the semiconductor device inspection method, it is possible to reduce the electronic components that switch the conduction path to the measurement unit when inspecting an analog circuit or the like, It can secure an area where other electronic components can be mounted on the inspection circuit board, and is useful for semiconductor device inspection technology using a semiconductor device inspection jig using a measuring device with a limited number of channels to reduce test costs. It is.

Sectional drawing of the contact jig and inspection jig apparatus which concern on Embodiment 1 of this invention (The state where the stroke amount pushed down below the upper plunger is small) Sectional drawing of the contact jig and inspection jig apparatus which concern on the same Embodiment 1 (The state where the stroke amount pushed down below the upper plunger is large) Sectional drawing of the contact jig and inspection jig apparatus which concern on Embodiment 2 of this invention (The state where the stroke amount pushed down below the upper plunger is small) Sectional drawing of the contact jig and inspection jig apparatus which concern on the same Embodiment 2 (The state where the stroke amount pushed down of the upper plunger is large) Sectional drawing of the contact jig and inspection jig apparatus which concern on Embodiment 3 of this invention (The state where the stroke amount pushed down below the upper plunger is small) Sectional drawing of the contact jig and inspection jig apparatus which concern on the same Embodiment 3 (The state where the stroke amount pushed down of the upper plunger is large) Sectional view of conventional contact jig and inspection jig device

Explanation of symbols

1 Semiconductor Device 2 Solder Ball (External Terminal)
10 Contact jig 15 Upper plunger (Contact)
15a, 16a Sliding part 15b, 16b Contact part 16 Lower plunger (contact)
17 Spring 18 Tubular body (sliding frame)
18a Body 18b Insulating area 18c Conductive area 18g Upper conductive area 18f Lower conductive area 19 Insulating part 20 Holding body 21 Upper lid 22 Base 31 Insulating part 32 Conductive path 34 External terminal

Claims (9)

  A sliding frame having a conductive region and an insulating region, a spring disposed in the sliding frame, and disposed at both ends of the spring, and sliding on the sliding portion in the sliding frame. And a contact jig for inspecting a semiconductor device, comprising two contactors having contact portions that can be moved out and withdrawn from the inside of the sliding frame body, wherein the conductive region and the insulating region in the sliding frame body The sliding portion of the one contact is formed by dividing the sliding direction of the sliding portion of the one contact with the stroke amount of the external terminal of the semiconductor device pushing down the one contact. A contact jig for inspecting a semiconductor device, wherein a region in contact with the semiconductor device is switched to either the conductive region or the insulating region.   The contact portion of one contact is in contact with an external terminal of a semiconductor device and is electrically connected, and the contact portion of the other contact is in contact with and electrically connected to a measuring device. 2. A contact jig for testing a semiconductor device according to 1.   The contact jig for semiconductor device inspection according to claim 2, wherein the other contact is fixed to the sliding frame.   The contact jig for semiconductor device inspection according to claim 1, wherein each contact and an end of the spring are insulated.   The body of the sliding frame is formed of a cylindrical conductor, and a conductive region provided with a conductive material on the inner wall surface of the cylindrical body, and an insulating region provided with an insulating material The contact jig for semiconductor device inspection according to claim 1, wherein the contact jig is formed by being divided.   A contact jig for inspecting a semiconductor device according to any one of claims 1 to 5 and a holder for holding the contact jig, wherein the holder is made transparent to correspond to an external terminal of the semiconductor device. An inspection is characterized in that a hole is formed, and the contact jig for contacting the contact portion of one of the contacts protruding from the through hole with the external terminal of the semiconductor device is disposed corresponding to the through hole. Jig device.   A sliding communication hole having a conductive region and an insulating region is provided at a position corresponding to the external terminal of the semiconductor device, and a spring and both ends of the spring are provided in the sliding communication hole to insulate the conductive region. The inspection jig apparatus according to claim 6, wherein two contactors slidable in the region are arranged.   The sliding communication hole has a plurality of electrically independent conductive regions, each of the conductive regions is connected to an external terminal of a different inspection jig, and the external terminal of the semiconductor device pushes down the contact portion. 8. The inspection jig apparatus according to claim 7, wherein the conductive region in contact with the slider can be switched according to a stroke amount.   A semiconductor that is electrically connected to a measuring device by changing a stroke amount by which an external terminal of a semiconductor device pushes down one contact using the inspection jig device according to claim 6, 7, or 8. A method for inspecting a semiconductor device, characterized in that measurement is performed by switching all or some of the external terminals of the device to external terminals.

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