KR101777644B1 - Socket for testing semiconductor - Google Patents
Socket for testing semiconductor Download PDFInfo
- Publication number
- KR101777644B1 KR101777644B1 KR1020160017910A KR20160017910A KR101777644B1 KR 101777644 B1 KR101777644 B1 KR 101777644B1 KR 1020160017910 A KR1020160017910 A KR 1020160017910A KR 20160017910 A KR20160017910 A KR 20160017910A KR 101777644 B1 KR101777644 B1 KR 101777644B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor
- elastic
- circuit board
- printed circuit
- conductive
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Abstract
A socket for semiconductor testing is disclosed. A socket for semiconductor testing according to the present invention is a socket for testing a semiconductor mounted on a printed circuit board provided in a tester so as to transmit an electrical signal between a semiconductor and a tester, the socket comprising: a socket body to which the semiconductor is detachably mounted; And a connection unit coupled to the inside of the socket body to be electrically connected to the semiconductor and the printed circuit board, wherein the connection unit is disposed inside the socket body to elastically support the semiconductor mounted on the socket body A bonded semiconductor seating; An upper support coupled to support the semiconductor seating; A lower support portion coupled to support the upper support portion; And an upper end portion contacting the terminal of the semiconductor and a lower end contacting the conductive terminal portion of the printed circuit board to electrically connect the semiconductor and the printed circuit board to each other through the semiconductor mounting portion, the upper support portion, and the lower support portion, And a conductive elastic supporting part connected to the semiconductor mounting part, the upper supporting part and the lower supporting part to elastically support the semiconductor mounting part, the upper supporting part and the lower supporting part.
Description
The present invention relates to a semiconductor test socket, and more particularly, to a socket for semiconductor test, which can smoothly cope with a finer pitch of a terminal (solder ball) formed on a semiconductor and secure reliability according to electrical contact between a terminal of a semiconductor and a printed circuit board To a socket for semiconductor testing.
Generally, a semiconductor is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. The semiconductor blanket inspection is performed in such a state that a semiconductor test socket formed to be in electrical contact with a terminal of a semiconductor is coupled to an inspection circuit board and a semiconductor is coupled to a semiconductor test socket. Semiconductor test sockets are used in the burn-in test process during the semiconductor manufacturing process as well as final semiconductor test.
The size and spacing of the terminals of the semiconductor, that is, the size and spacing of the leads, are also becoming finer in accordance with the development and miniaturization tendency of the semiconductor integration technology, and accordingly, a method of finely forming the gap between the conductive patterns applied to the semiconductor test socket is required have. Therefore, there is a limitation in manufacturing a semiconductor test socket for testing a semiconductor to be integrated with a conventional Pogo-Pin type conductive contactor. In addition, since the semiconductor test socket to which the conductive contactor of the Pogo-Pin type is applied uses a spring, there is a disadvantage in that the lifetime is short due to a reduction in elasticity.
In recent years, a technology has been proposed to be compatible with the integration of semiconductors. In this technique, a perforated pattern is formed in a vertical direction on a silicon body made of a silicone material of elastic material, and then conductive powder is filled in the perforated pattern to form a conductive pattern PCR type is widely used. Here, in the case of the PCR type semiconductor test socket, there is a method of forming a conductive pattern by a method of vertically applying an electrical pattern corresponding to a conductive pattern by using the electrical property of the conductive powder in addition to the punching and filling method to aggregate the conductive powder Is also being used.
However, such a PCR-type semiconductor test socket has a limitation in manufacturing a socket for semiconductor test corresponding to miniaturization of a terminal of a semiconductor as well as the reliability of the electrical contact due to the conductive pattern being sensitive to ambient temperature.
Accordingly, research and development on a semiconductor test socket capable of ensuring reliability in accordance with electrical contact between a terminal of a semiconductor and a printed circuit board while smoothly responding to a finer pitch of terminals (solder balls) And the like.
The technical problem of the present invention is to provide a semiconductor device which can smoothly cope with a finer pitch of terminals (solder balls) formed in a semiconductor and ensures reliability in accordance with electrical contact between terminals of a semiconductor and conductive terminals of a printed circuit board, And to provide a socket for semiconductor testing that can contribute.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.
The present invention relates to a socket for semiconductor testing mounted on a printed circuit board provided on a tester for transmitting an electrical signal between a semiconductor and a tester, the socket comprising: a socket body to which the semiconductor is detachably mounted; And a connection unit coupled to the inside of the socket body to be electrically connected to the semiconductor and the printed circuit board, wherein the connection unit is disposed inside the socket body to elastically support the semiconductor mounted on the socket body A bonded semiconductor seating; An upper support coupled to support the semiconductor seating; A lower support portion coupled to support the upper support portion; And an upper end portion contacting the terminal of the semiconductor and a lower end contacting the conductive terminal portion of the printed circuit board to electrically connect the semiconductor and the printed circuit board to each other through the semiconductor mounting portion, the upper support portion, and the lower support portion, And a conductive elastic support portion for connecting the semiconductor mounting portion, the upper supporting portion, and the lower supporting portion to each other.
According to another aspect of the present invention, there is provided a semiconductor test socket mounted on a printed circuit board provided on a tester for transmitting an electrical signal between a semiconductor and a tester, the socket comprising: a socket body to which the semiconductor is detachably mounted; And a connection unit coupled to the inside of the socket body to electrically connect the semiconductor and the printed circuit board, wherein the connection unit includes: an upper support coupled to the inside of the socket body; A lower support portion coupled to the socket body to support a lower portion of the upper support portion; A synthetic resin filler joined between the upper support portion and the lower support portion; And the upper end of the semiconductor chip is in contact with the terminal of the semiconductor and the lower end of the semiconductor chip is in contact with the conductive terminal of the printed circuit board to electrically connect the semiconductor and the printed circuit board to each other. And a conductive elastic supporting portion connected to the upper supporting portion and the lower supporting portion to elastically support the upper supporting portion and the lower supporting portion.
The synthetic resin filler is characterized by being formed of silicon or an epoxy resin.
Wherein the conductive elastic supporting portion comprises: a first elastic portion contacting the terminal of the semiconductor and formed to provide a predetermined elastic force; A support unit integrally formed at a lower portion of the first elastic member and adapted to support the first elastic member; And a second elastic part integrally formed on the lower part of the support part and contacting the conductive part terminal of the printed circuit board to provide a predetermined elastic force.
And the second elastic part is brought into contact with the conductive part terminal of the printed circuit board so as to be in close contact with the solder.
The conductive elastic support portion is formed of a coil spring that is divided into the first elastic portion, the support portion, and the second elastic portion. In order to provide a certain elastic force in the regions of the first elastic portion and the second elastic portion, And the coils are formed in close contact with each other to provide a supporting force for preventing warp deformation when the semiconductor and the printed circuit board are electrically connected in the region of the supporting portion.
According to the present invention, the terminal of the semiconductor and the conductive terminal of the printed circuit board are electrically connected to each other by the conductive elastic support portion vertically coupled to penetrate the semiconductor mounting portion, the upper support portion, and the lower support portion coupled to the receiving portion of the socket body. It is possible to smoothly cope with the pitch at which the terminals of the semiconductor are made finer at the time of conducting the semiconductor blanket inspection and to secure the reliability in accordance with the electrical contact between the terminals of the semiconductor and the terminals of the conductive terminals of the printed circuit board, There is an advantage.
1 is a view showing a semiconductor test socket according to a first embodiment of the present invention.
2 is a plan view of the semiconductor test socket shown in FIG.
FIG. 3 is a view showing the connection unit shown in FIG. 1. FIG.
FIG. 4 is a view showing the conductive elastic support portion of the connection unit shown in FIG. 1. FIG.
5 is a view showing a socket for semiconductor testing according to a second embodiment of the present invention.
FIG. 6 is a view showing a main portion of the socket for semiconductor test shown in FIG. 5; FIG.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions will not be described in order to simplify the gist of the present invention.
1st Example
FIG. 1 is a view showing a socket for testing a semiconductor according to a first embodiment of the present invention, FIG. 2 is a view showing a plane of a socket for testing a semiconductor shown in FIG. 1, And FIG. 4 is a view showing the conductive elastic support portion of the connection unit shown in FIG. 1. FIG.
1 to 4, a semiconductor testing socket according to a first embodiment of the present invention includes a
The
Although not shown in the drawing, the
In addition, a
The
Such a
The connecting
The
The
The
The conductive
To this end, the conductive
In other words, the conductive
At this time, the conductive
The first
The conductive
Hereinafter, the operation of the semiconductor test socket according to the present embodiment will be described.
First, the
When the
When the
At this time, when the
As described above, the semiconductor test socket of the present embodiment has the
Second Example
FIG. 5 is a view showing a socket for semiconductor test according to a second embodiment of the present invention, and FIG. 6 is a view showing a main portion of the socket for semiconductor test shown in FIG.
5 and 6, the semiconductor testing socket according to the second embodiment of the present invention includes a
Here, since the
The
The
A lower groove 43 is formed on the lower surface of the
The
An upper groove 45 is formed on the upper surface of the
The
The conductive
To this end, the conductive
That is, the conductive
At this time, the conductive
The first
The second
The conductive
That is, the conductive
The conductive
As described above, the semiconductor test socket according to the present embodiment includes the conductive
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious to those who have. Accordingly, such modifications or variations should not be individually understood from the technical spirit and viewpoint of the present invention, and modified embodiments should be included in the claims of the present invention.
10: Socket body
12:
20: connection unit
22: Semiconductor mount part
24: upper support
26:
28: conductive elastic support
28A: first elastic part
28B:
28C: second elastic portion
Claims (6)
A socket body to which the semiconductor is detachably mounted; And
And a connection unit coupled to the inside of the socket body to electrically connect the semiconductor and the printed circuit board,
The connecting unit includes:
A semiconductor mounting part coupled to the inside of the socket body to elastically support the semiconductor mounted on the socket body;
An upper support coupled to support the semiconductor seating;
A lower support portion coupled to support the upper support portion; And
The upper end portion is in contact with the terminal of the semiconductor and the lower end portion is in contact with the conductive terminal of the printed circuit board to electrically connect the semiconductor and the printed circuit board And a conductive elastic supporting portion provided to elastically support the semiconductor mounting portion, the upper supporting portion and the lower supporting portion,
The conductive elastic support portion
A first elastic portion in contact with the terminal of the semiconductor, a second elastic portion in contact with the conductive portion terminal of the printed circuit board in a soldering manner, and a support portion disposed between the first elastic portion and the second elastic portion, Wherein a constant gap is formed between the coils so as to provide a predetermined elastic force in the region of the first elastic portion and the second elastic portion, and in the region of the support portion, when the semiconductor and the printed circuit board are electrically connected to each other, And the coils are formed in close contact with each other so as to provide a supporting force capable of preventing deformation.
A socket body to which the semiconductor is detachably mounted; And
And a connection unit coupled to the inside of the socket body to electrically connect the semiconductor and the printed circuit board,
The connecting unit includes:
An upper support coupled to the inside of the socket body;
A lower support portion coupled to the socket body to support a lower portion of the upper support portion;
A synthetic resin filler joined between the upper support portion and the lower support portion; And
The upper end portion of the semiconductor chip is in contact with the terminal of the semiconductor chip and the lower end portion of the semiconductor chip is in contact with the conductive terminal of the printed circuit board to electrically connect the semiconductor chip and the printed circuit board And a conductive elastic supporting portion provided to elastically support the upper supporting portion and the lower supporting portion,
The conductive elastic support portion
A first elastic portion which is in contact with the terminal of the semiconductor, a second elastic portion which is brought into contact with or in contact with the conductive portion terminal of the printed circuit board so as to come into elastic contact with the conductive portion terminal, and a second elastic portion which is arranged between the first elastic portion and the second elastic portion Wherein a constant gap is formed between the coils so as to provide a predetermined elastic force in the region of the first elastic portion and the second elastic portion, and in the region of the supporting portion, the semiconductor and the printed circuit board Wherein the coils are formed in close contact with each other to provide a supporting force capable of preventing warp deformation when electrically connected.
Wherein the synthetic resin filler is made of silicon or an epoxy resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150161510 | 2015-11-18 | ||
| KR20150161510 | 2015-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170058225A KR20170058225A (en) | 2017-05-26 |
| KR101777644B1 true KR101777644B1 (en) | 2017-09-12 |
Family
ID=59052259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160017910A KR101777644B1 (en) | 2015-11-18 | 2016-02-16 | Socket for testing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101777644B1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101949871B1 (en) * | 2017-06-28 | 2019-02-20 | 양희성 | Micro contactor for connecting electric signal |
| KR101976028B1 (en) * | 2018-01-09 | 2019-05-07 | (주)디팜스테크 | A contact pin for a semiconductor socket which can prevent a short circuit while performing a buffer action by elasticity |
| KR102653116B1 (en) * | 2023-07-20 | 2024-04-02 | 주식회사 비이링크 | Socket apparatus for circuit testing of electronic devices |
| KR102651424B1 (en) * | 2023-12-19 | 2024-03-26 | 주식회사 피엠티 | Chip test socket |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101417746B1 (en) | 2013-04-22 | 2014-07-10 | 상명대학교서울산학협력단 | Apparatus for measuring conductivity with 4 electrode |
-
2016
- 2016-02-16 KR KR1020160017910A patent/KR101777644B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101417746B1 (en) | 2013-04-22 | 2014-07-10 | 상명대학교서울산학협력단 | Apparatus for measuring conductivity with 4 electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170058225A (en) | 2017-05-26 |
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |